component
CDCI6214RGET
Public Made by Adomby adom
Texas Instruments Clock Generators / Frequency Synthesizers / PLL, VQFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
CDCI6214RGET
Texas Instruments · Clock Generators / Frequency Synthesizers / PLL · VQFN-24-EP(4x4)
CDCI6214RGET from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | XOUT/FB_P | bidirectional | Crystal driver output, LVCMOS input, or differential positive reference (FB_P) for the PLL, with the crystal path supporting 8 MHz to 50 MHz. |
| 2 | XIN/FB_N | input | Crystal input or differential negative reference (FB_N) for the PLL, with the crystal path supporting 8 MHz to 50 MHz. |
| 3 | VDDREF | power_in | Power supply for the input path, digital core and EEPROM, which must be within 1.71 V to 3.465 V and must be powered from the same supply as VDDVCO. |
| 4 | REFSEL | input | Manual reference selection MUX for the PLL with internal pullup RPU = 50 kΩ and pulldown RPD = 50 kΩ. |
| 5 | REFP | input | Differential positive reference input for the PLL. |
| 6 | REFN | input | Differential negative reference input for the PLL. |
| 7 | Y0 | output | Output 0 pin, with the output supply limited to 1.71 V to 3.465 V on the VDDO supplies. |
| 8 | RESETN/SYNC | input | Chip reset (active low) or, alternatively, output divider synchronization, with internal pullup RPU = 50 kΩ. |
| 9 | Y4N | output | Output 4 negative pin of the differential output pair. |
| 10 | Y4P | output | Output 4 positive pin of the differential output pair. |
| 11 | OE/GPIO4 | bidirectional | Global output enable (default) or programmable GPIO, with internal pullup RPU = 50 kΩ. |
| 12 | SCL/GPIO3 | bidirectional | Serial interface clock (default, I2C compatible up to 400 kHz) or programmable GPIO. |
| 13 | Y3N | output | Output 3 negative pin of the differential output pair. |
| 14 | Y3P | output | Output 3 positive pin of the differential output pair. |
| 15 | VDDO34 | power_in | Power supply for outputs 3 and 4, within 1.71 V to 3.465 V. |
| 16 | VDDO12 | power_in | Power supply for outputs 1 and 2, within 1.71 V to 3.465 V. |
| 17 | Y2N | output | Output 2 negative pin of the differential output pair. |
| 18 | Y2P | output | Output 2 positive pin of the differential output pair. |
| 19 | SDA/GPIO2 | bidirectional | Serial interface data (default, I2C compatible up to 400 kHz) or programmable GPIO. |
| 20 | STATUS/GPIO1 | bidirectional | Status output (default) or programmable GPIO, with internal pullup RPU = 50 kΩ. |
| 21 | Y1N | output | Output 1 negative pin of the differential output pair. |
| 22 | Y1P | output | Output 1 positive pin of the differential output pair. |
| 23 | EEPROMSEL | input | EEPROM page mode select, low loads page 0 and high loads page 1, with RPU = 50 kΩ and RPD = 50 kΩ. |
| 24 | VDDVCO | power_in | Power supply for the VCO and PLL, which must be powered from the same supply as VDDREF and within 1.71 V to 3.465 V. |
| 25 | GND | power_in | Ground connection on the exposed thermal pad, which should be connected with multiple vias to a solid GND plane. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | RTC/Clock Chip |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | -0.3 | 3.65 | V | VDDREF, VDDVCO, VDDO12, VDDO34; over operating free-air temperature range | 5 | ||
| Input voltage | -0.3 | V | XIN/FB_P, XOUT/FB_N, REFP, REFN; max VDDREF + 0.3 V | 5 | |||
| Output voltage | -0.3 | V | Y0, Y1P, Y1N, Y2P, Y2N, Y3P, Y3N, Y4P, Y4N; max VDDO_x + 0.3 V | 5 | |||
| Junction temperature | TJ | 125 | ºC | 5 | |||
| Storage temperature | Tstg | 150 | ºC | 5 | |||
| Core supply voltage | VDDREF, VDDVCO | 1.71 | 3.465 | V | Core supply voltage | 5 | |
| Output supply voltage | VDDO1 | 1.71 | 3.465 | V | Output supply voltage | 5 | |
| Ambient temperature | TA | -40 | 85 | ºC | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 39.5 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 29.5 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Junction-to-board thermal resistance | RθJB | 16.9 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 2.6 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Junction-to-top characterization parameter | ψJT | 0.4 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Junction-to-board characterization parameter | ψJB | 16.8 | °C/W | RGE (VQFN) 24 pins | 5 | ||
| Reference frequency | fIN_Ref | 1 | 250 | MHz | 6 | ||
| Differential input voltage swing, peak-to-peak | VIN_DIFF | 0.5 | 1.6 | V | VDDREF = 2.5 V or 3.3 V, AC-coupled differential input buffer | 6 | |
| Differential input voltage swing, peak-to-peak | VIN_DIFF | 0.5 | 1 | V | VDDREF = 1.8 V, AC-coupled differential input buffer | 6 | |
| Input duty cycle | IDC | 40 | 60 | % | 6 | ||
| Crystal frequency | fIN_Xtal | 8 | 50 | MHz | Fundamental mode | 6 | |
| Crystal equivalent series resistance | ZESR | 30 | 100 | Ω | A supported crystal is within | 6 | |
| Crystal load capacitance | CL | 5 | 8 | pF | Using on-chip load capacitance. A supported crystal is within. | 6 | |
| Crystal tolerated drive power | PXTAL | 100 | uW | A supported crystal tolerates up to | 6 | ||
| On-chip load capacitance | CXIN_LOAD | 3 | 9.1 | pF | Programmable in typical 200-fF steps at room temp | 6 | |
| Phase detector frequency | fPFD | 1 | 100 | MHz | 7 | ||
| Voltage-controlled oscillator frequency | fVCO | 2400 | 2800 | MHz | 7 | ||
| Configurable closed-loop PLL bandwidth | fBW | 100 | 3000 | kHz | REF = 25 MHz | 7 | |
| Clock distribution frequency | fCLKDIST | 400 | 700 | MHz | 7 | ||
| Output frequency | fO_LVCMOS | 0.1 | 350 | MHz | VDDO_x = 2.5 V or 3.3 V, normal drive | 8 | |
| Output frequency | fO_LVCMOS | 0.1 | 250 | MHz | VDDO_x = 1.8 V, normal drive | 8 | |
| Output frequency | fO_HCSL | 0.1 | 350 | MHz | 9 | ||
| Output common mode | VCM_HCSL | 0.2 | 0.34 | 0.55 | V | 9 | |
| Differential output voltage | VOD | 0.4 | 1 | V | fO_HCSL = 100 MHz | 9 | |
| Absolute crossing point | VCROSS | 250 | 550 | mV | Rp = 49.9 Ω ±5%, fO_HCSL = 100 MHz | 9 | |
| Output duty cycle | ODC | 45 | 55 | % | Not in PLL bypass mode | 9 | |
| Parallel termination | RP | 45 | 55 | Ω | Rp = 49.9 Ω ±5% required | 9 | |
| Output common mode | VCM | 1.125 | 1.2 | 1.375 | V | VDDO_X = 2.5 V, 3.3 V, chx_lvds_cmtrim_inc = 2 | 9 |
| Output common mode | VCM | 0.8 | 0.9 | 1 | V | VDDO_X = 1.8 V, chx_lvds_cmtrim_inc = 2 | 9 |
| Differential output voltage LVDS | VOD | 0.25 | 0.3 | 0.45 | V | 9 | |
| Differential output voltage LVDS-like | VOD | 0.45 | V | Programmable differential AC-coupled output | 9 | ||
| EEPROM programming cycles | nEEcyc | 10 | 10000 | cycles | each word | 6 | |
| Initialization time | tINIT | 5 | ms | Initialization time from POR to device releasing PLL outputs | 10 | ||
| Power supply ramp | tVDD | 50 | 2000 | µs | Timing requirement for any VDD pin while RESETN = LOW | 10 | |
| Typical current | IDD_TYP | 83 | mA | 4x 156.25-MHz LVDS case using crystal input and doubler | 12 | ||
| VCO and PLL current | IDD_VCO | 13 | mA | fVCO = 2500 MHz, PSFB = PSA = 4 and PSB = off | 11 | ||
| Output channel current | IDD_OUT | 10 | mA | Activated output channel, 1x LVDS 156.25 MHz | 11 | ||
| SCL clock frequency | fSCL | 100 | kHz | Standard | 11 | ||
| SCL clock frequency | fSCL | 400 | kHz | Fast-mode | 11 | ||
| Propagation delay | tPD_ZDM | -600 | 600 | ps | REF = 67 MHz, VCO = 2680 MHz, external ZDM, LVCMOS | 10 | |
| Skew between HCSL | tSK_HCSL | 140 | ps | Y[4:1] = HCSL, fOY[4:1] = 100 MHz | 10 | ||
| Low-level output voltage | VOL | 0.4 | V | At 3-mA sink current, VDDREF = 3.3 V, 5% | 11 | ||
| Low-level output current | IOL | 3 | mA | VOL = 0.4 V | 11 | ||
| Input capacitance GPIO | CIN_GPIO | 10 | pF | 6 | |||
| Pullup resistance | RPU | 77 | kΩ | Pin 11, 20 | 7 | ||
| Rise/fall time | tRJ_CL | 500 | 750 | fs | RMS phase jitter int. range 10 kHz to 20 MHz, XIN = Crystal 25 MHz, Yx = 156.25 MHz LVDS | 8 |
CAD (KiCad official)
- Symbol:
CDCI6214RGET - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
cdci6214rget-etched.step/cdci6214rget-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cdci6214rget.step/cdci6214rget.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (104 pp, sha256
393f17c509d0fd01, retrieved 2026-11-02, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).