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Ray Initial commit: component/cd74hct377m96 a4fae80 11d ago

CD74HCT377M96

Texas Instruments · Flip Flops · SOIC-20-300mil

CD74HCT377M96 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E input Active-low data enable input common to all eight flip-flops; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns before rising CP edge at VCC=4.5 V; presents 1.5 HCT unit loads (≤360 µA each at 25 °C).
2 Q0 output Registered Q output of flip-flop 0; assumes state of D0 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; propagation delay tPHL/tPLH ≤38 ns at CL=50 pF, VCC=4.5 V.
3 D0 input Data input for flip-flop 0; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; presents 0.25 HCT unit loads.
4 D1 input Data input for flip-flop 1; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; presents 0.25 HCT unit loads.
5 Q1 output Registered Q output of flip-flop 1; assumes state of D1 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; fanout 10 LSTTL loads over temperature.
6 Q2 output Registered Q output of flip-flop 2; assumes state of D2 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; tPLH/tPHL ≤38 ns at CL=50 pF.
7 D2 input Data input for flip-flop 2; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input leakage ≤±1 µA at VCC=5.5 V.
8 D3 input Data input for flip-flop 3; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input capacitance 10 pF typ.
9 Q3 output Registered Q output of flip-flop 3; assumes state of D3 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; output transition time tTLH/tTHL ≤15 ns at CL=50 pF.
10 GND power_in Ground supply reference for all internal logic; DC GND current ICC/IGND must not exceed ±50 mA absolute maximum.
11 CP input Buffered clock input common to all eight flip-flops; flip-flops load on rising edge when E is Low; maximum clock frequency 25 MHz at VCC=4.5 V; clock pulse width tW ≥20 ns at VCC=4.5 V; presents 0.5 HCT unit loads.
12 Q7 output Registered Q output of flip-flop 7; assumes state of D7 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; fanout 10 LSTTL loads over temperature.
13 D7 input Data input for flip-flop 7; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input leakage ≤±1 µA at VCC=5.5 V.
14 D4 input Data input for flip-flop 4; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input capacitance 10 pF typ.
15 Q4 output Registered Q output of flip-flop 4; assumes state of D4 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; tPLH/tPHL ≤38 ns at CL=50 pF.
16 Q6 output Registered Q output of flip-flop 6; assumes state of D6 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; output transition time tTLH/tTHL ≤15 ns at CL=50 pF.
17 D6 input Data input for flip-flop 6; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input leakage ≤±1 µA at VCC=5.5 V.
18 D5 input Data input for flip-flop 5; VIH ≥2 V, VIL ≤0.8 V (HCT); set-up time ≥12 ns, hold time ≥3 ns relative to rising CP edge at VCC=4.5 V; input capacitance 10 pF typ.
19 Q5 output Registered Q output of flip-flop 5; assumes state of D5 on rising CP edge when E is Low; VOH ≥3.98 V / VOL ≤0.26 V at VCC=4.5 V with 4 mA TTL load; fanout 10 LSTTL loads over temperature.
20 VCC power_in Positive supply voltage for HCT type; operating range 4.5 V to 5.5 V; quiescent ICC ≤8 µA typ / 80 µA max at 25 °C; absolute maximum −0.5 V to 7 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Logic
Pins 20

CAD (KiCad official)

  • Symbol: CD74HCT377M96
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: cd74hct377m96-etched.step / cd74hct377m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hct377m96.step / cd74hct377m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (20 pp, sha256 e31605c6c3b60b6d, retrieved 2026-09-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF