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CD74HCT367M96
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Texas Instruments Buffers, Drivers, Receivers, Transceivers, SOIC-16. Pinout settled in review by an AI reviewer against the manufacturer's datasheet, KiCad symbol/footprint/3D.
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CD74HCT367M96
Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-16
CD74HCT367M96 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ~{OE1} | input | Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 1: buffers 1 to 4. |
| 2 | 1A | input | Buffer data input. |
| 3 | 1Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 4 | 2A | input | Buffer data input. |
| 5 | 2Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 6 | 3A | input | Buffer data input. |
| 7 | 3Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 8 | GND | power_in | Ground. |
| 9 | 4Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 10 | 4A | input | Buffer data input. |
| 11 | 5Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 12 | 5A | input | Buffer data input. |
| 13 | 6Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 14 | 6A | input | Buffer data input. |
| 15 | ~{OE2} | input | Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 2: buffers 5 and 6. |
| 16 | VCC | power_in | Supply, 4.5 V to 5.5 V for HCT. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16 |
| Category | Logic |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | -0.5 | 7 | V | over operating free-air temperature range | 4 | |
| Input clamp current | IIK | -20 | 20 | mA | VI < -0.5 V or VI > VCC + 0.5 V | 4 | |
| Output clamp current | IOK | -20 | 20 | mA | VO < -0.5 V or VO > VCC + 0.5 V | 4 | |
| Continuous output current | IO | -35 | 35 | mA | -0.5 V < VO < VCC + 0.5 V | 4 | |
| Continuous current through VCC or GND | -50 | 50 | mA | 4 | |||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Lead temperature (soldering) | 300 | °C | soldering 10 s | 4 | |||
| Temperature range | TA | -55 | 125 | °C | 4 | ||
| Supply voltage range (HCT types) | VCC | 4.5 | 5.5 | V | HCT types | 4 | |
| Input rise and fall time (HCT types) | tt | 500 | ns | VCC = 4.5 V | 4 | ||
| Junction-to-ambient thermal resistance, D (SOIC) 16 pins | RθJA | 73 | °C/W | D (SOIC) package, 16 pins | 4 | ||
| High level input voltage | VIH | 2 | V | VCC = 4.5 to 5.5 V | 5 | ||
| Low level input voltage | VIL | 0.8 | V | VCC = 4.5 to 5.5 V | 5 | ||
| High level output voltage | VOH | 4.4 | V | IOH =, 20 μA; VCC = 4.5 V; TA = -55 to 125°C | 5 | ||
| High level output voltage | VOH | 3.98 | V | IOH =, 4 mA; VCC = 4.5 V; TA = 25°C | 5 | ||
| High level output voltage | VOH | 3.84 | V | IOH =, 4 mA; VCC = 4.5 V; TA = -40 to 85°C | 5 | ||
| High level output voltage | VOH | 3.7 | V | IOH =, 4 mA; VCC = 4.5 V; TA = -55 to 125°C | 5 | ||
| Low level output voltage | VOL | 0.1 | V | IOL = 20 μA; VCC = 4.5 V; TA = -55 to 125°C | 5 | ||
| Low level output voltage | VOL | 0.26 | V | IOL = 4 mA; VCC = 4.5 V; TA = 25°C | 5 | ||
| Low level output voltage | VOL | 0.33 | V | IOL = 4 mA; VCC = 4.5 V; TA = -40 to 85°C | 5 | ||
| Low level output voltage | VOL | 0.4 | V | IOL = 4 mA; VCC = 4.5 V; TA = -55 to 125°C | 5 | ||
| Input leakage current | II | -0.1 | 0.1 | μA | VI = VCC to GND; VCC = 5.5 V; TA = 25°C | 5 | |
| Input leakage current | II | -1 | 1 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C | 5 | |
| Supply current | ICC | 8 | μA | VI = VCC to GND; VCC = 5.5 V; TA = 25°C | 5 | ||
| Supply current | ICC | 80 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C | 5 | ||
| Supply current | ICC | 160 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -55 to 125°C | 5 | ||
| Additional supply current per input pin (OE1 input) | ΔICC | 100 | 216 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C | 5 | |
| Additional supply current per input pin (OE1 input) | ΔICC | 270 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C | 5 | ||
| Additional supply current per input pin (OE1 input) | ΔICC | 294 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C | 5 | ||
| Additional supply current per input pin (all other inputs) | ΔICC | 100 | 198 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C | 5 | |
| Additional supply current per input pin (all other inputs) | ΔICC | 247.5 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C | 5 | ||
| Additional supply current per input pin (all other inputs) | ΔICC | 269.5 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C | 5 | ||
| Three-state leakage current | IOZ | -0.5 | 0.5 | μA | VO = VCC or GND; VCC = 5.5 V; TA = 25°C | 5 | |
| Three-state leakage current | IOZ | -5 | 5 | μA | VO = VCC or GND; VCC = 5.5 V; TA = -40 to 85°C | 5 | |
| Three-state leakage current | IOZ | -10 | 10 | μA | VO = VCC or GND; VCC = 5.5 V; TA = -55 to 125°C | 5 | |
| Data to outputs (HC/HCT367) propagation delay | tpd | 25 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 | ||
| Data to outputs (HC/HCT367) propagation delay | tpd | 31 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 | ||
| Data to outputs (HC/HCT367) propagation delay | tpd | 38 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 | ||
| Data to outputs (HC/HCT368) propagation delay | tpd | 30 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 | ||
| Data to outputs (HC/HCT368) propagation delay | tpd | 38 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 | ||
| Data to outputs (HC/HCT368) propagation delay | tpd | 45 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 | ||
| Output enable and disable to outputs | 35 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 | |||
| Output enable and disable to outputs | 44 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 | |||
| Output enable and disable to outputs | 53 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 | |||
| Output transition time | tt | 12 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 | ||
| Output transition time | tt | 15 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 | ||
| Output transition time | tt | 18 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 |
CAD (KiCad official)
- Symbol:
CD74HCT367M96 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
cd74hct367m96-etched.step/cd74hct367m96-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cd74hct367m96.step/cd74hct367m96.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (22 pp, sha256
4abbff03c67ff005, retrieved 2026-11-09, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# CD74HCT367M96
**Texas Instruments** · Buffers, Drivers, Receivers, Transceivers · SOIC-16
CD74HCT367M96 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ~{OE1} | input | Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 1: buffers 1 to 4. |
| 2 | 1A | input | Buffer data input. |
| 3 | 1Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 4 | 2A | input | Buffer data input. |
| 5 | 2Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 6 | 3A | input | Buffer data input. |
| 7 | 3Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 8 | GND | power_in | Ground. |
| 9 | 4Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 10 | 4A | input | Buffer data input. |
| 11 | 5Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 12 | 5A | input | Buffer data input. |
| 13 | 6Y | tri_state | Buffer 3-state output, same polarity as its input. |
| 14 | 6A | input | Buffer data input. |
| 15 | ~{OE2} | input | Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 2: buffers 5 and 6. |
| 16 | VCC | power_in | Supply, 4.5 V to 5.5 V for HCT. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16 |
| Category | Logic |
| Pins | 16 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | -0.5 | | 7 | V | over operating free-air temperature range | 4 |
| Input clamp current | IIK | -20 | | 20 | mA | VI < -0.5 V or VI > VCC + 0.5 V | 4 |
| Output clamp current | IOK | -20 | | 20 | mA | VO < -0.5 V or VO > VCC + 0.5 V | 4 |
| Continuous output current | IO | -35 | | 35 | mA | -0.5 V < VO < VCC + 0.5 V | 4 |
| Continuous current through VCC or GND | | -50 | | 50 | mA | | 4 |
| Junction temperature | TJ | | | 150 | °C | | 4 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 4 |
| Lead temperature (soldering) | | | | 300 | °C | soldering 10 s | 4 |
| Temperature range | TA | -55 | | 125 | °C | | 4 |
| Supply voltage range (HCT types) | VCC | 4.5 | | 5.5 | V | HCT types | 4 |
| Input rise and fall time (HCT types) | tt | | | 500 | ns | VCC = 4.5 V | 4 |
| Junction-to-ambient thermal resistance, D (SOIC) 16 pins | RθJA | | 73 | | °C/W | D (SOIC) package, 16 pins | 4 |
| High level input voltage | VIH | 2 | | | V | VCC = 4.5 to 5.5 V | 5 |
| Low level input voltage | VIL | | | 0.8 | V | VCC = 4.5 to 5.5 V | 5 |
| High level output voltage | VOH | 4.4 | | | V | IOH =, 20 μA; VCC = 4.5 V; TA = -55 to 125°C | 5 |
| High level output voltage | VOH | 3.98 | | | V | IOH =, 4 mA; VCC = 4.5 V; TA = 25°C | 5 |
| High level output voltage | VOH | 3.84 | | | V | IOH =, 4 mA; VCC = 4.5 V; TA = -40 to 85°C | 5 |
| High level output voltage | VOH | 3.7 | | | V | IOH =, 4 mA; VCC = 4.5 V; TA = -55 to 125°C | 5 |
| Low level output voltage | VOL | | | 0.1 | V | IOL = 20 μA; VCC = 4.5 V; TA = -55 to 125°C | 5 |
| Low level output voltage | VOL | | | 0.26 | V | IOL = 4 mA; VCC = 4.5 V; TA = 25°C | 5 |
| Low level output voltage | VOL | | | 0.33 | V | IOL = 4 mA; VCC = 4.5 V; TA = -40 to 85°C | 5 |
| Low level output voltage | VOL | | | 0.4 | V | IOL = 4 mA; VCC = 4.5 V; TA = -55 to 125°C | 5 |
| Input leakage current | II | -0.1 | | 0.1 | μA | VI = VCC to GND; VCC = 5.5 V; TA = 25°C | 5 |
| Input leakage current | II | -1 | | 1 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C | 5 |
| Supply current | ICC | | | 8 | μA | VI = VCC to GND; VCC = 5.5 V; TA = 25°C | 5 |
| Supply current | ICC | | | 80 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C | 5 |
| Supply current | ICC | | | 160 | μA | VI = VCC to GND; VCC = 5.5 V; TA = -55 to 125°C | 5 |
| Additional supply current per input pin (OE1 input) | ΔICC | | 100 | 216 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C | 5 |
| Additional supply current per input pin (OE1 input) | ΔICC | | | 270 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C | 5 |
| Additional supply current per input pin (OE1 input) | ΔICC | | | 294 | μA | OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C | 5 |
| Additional supply current per input pin (all other inputs) | ΔICC | | 100 | 198 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C | 5 |
| Additional supply current per input pin (all other inputs) | ΔICC | | | 247.5 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C | 5 |
| Additional supply current per input pin (all other inputs) | ΔICC | | | 269.5 | μA | All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C | 5 |
| Three-state leakage current | IOZ | -0.5 | | 0.5 | μA | VO = VCC or GND; VCC = 5.5 V; TA = 25°C | 5 |
| Three-state leakage current | IOZ | -5 | | 5 | μA | VO = VCC or GND; VCC = 5.5 V; TA = -40 to 85°C | 5 |
| Three-state leakage current | IOZ | -10 | | 10 | μA | VO = VCC or GND; VCC = 5.5 V; TA = -55 to 125°C | 5 |
| Data to outputs (HC/HCT367) propagation delay | tpd | | | 25 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 |
| Data to outputs (HC/HCT367) propagation delay | tpd | | | 31 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 |
| Data to outputs (HC/HCT367) propagation delay | tpd | | | 38 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 |
| Data to outputs (HC/HCT368) propagation delay | tpd | | | 30 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 |
| Data to outputs (HC/HCT368) propagation delay | tpd | | | 38 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 |
| Data to outputs (HC/HCT368) propagation delay | tpd | | | 45 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 |
| Output enable and disable to outputs | | | | 35 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 |
| Output enable and disable to outputs | | | | 44 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 |
| Output enable and disable to outputs | | | | 53 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 |
| Output transition time | tt | | | 12 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C | 6 |
| Output transition time | tt | | | 15 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C | 6 |
| Output transition time | tt | | | 18 | ns | Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C | 6 |
## CAD (KiCad official)
- Symbol: `CD74HCT367M96`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files: `cd74hct367m96-etched.step` / `cd74hct367m96-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cd74hct367m96.step` / `cd74hct367m96.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/cd74hct367m96.pdf) (22 pp, sha256 `4abbff03c67ff005`, retrieved 2026-11-09, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/cd74hct367m96-datasheet.pdf)