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CD74HCT367M96

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Texas Instruments Buffers, Drivers, Receivers, Transceivers, SOIC-16. Pinout settled in review by an AI reviewer against the manufacturer's datasheet, KiCad symbol/footprint/3D.

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CD74HCT367M96

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-16

CD74HCT367M96 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ~{OE1} input Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 1: buffers 1 to 4.
2 1A input Buffer data input.
3 1Y tri_state Buffer 3-state output, same polarity as its input.
4 2A input Buffer data input.
5 2Y tri_state Buffer 3-state output, same polarity as its input.
6 3A input Buffer data input.
7 3Y tri_state Buffer 3-state output, same polarity as its input.
8 GND power_in Ground.
9 4Y tri_state Buffer 3-state output, same polarity as its input.
10 4A input Buffer data input.
11 5Y tri_state Buffer 3-state output, same polarity as its input.
12 5A input Buffer data input.
13 6Y tri_state Buffer 3-state output, same polarity as its input.
14 6A input Buffer data input.
15 ~{OE2} input Output enable, active low: high puts the outputs of this group in the high-impedance state. Group 2: buffers 5 and 6.
16 VCC power_in Supply, 4.5 V to 5.5 V for HCT.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Logic
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC -0.5 7 V over operating free-air temperature range 4
Input clamp current IIK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 4
Output clamp current IOK -20 20 mA VO < -0.5 V or VO > VCC + 0.5 V 4
Continuous output current IO -35 35 mA -0.5 V < VO < VCC + 0.5 V 4
Continuous current through VCC or GND -50 50 mA 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Lead temperature (soldering) 300 °C soldering 10 s 4
Temperature range TA -55 125 °C 4
Supply voltage range (HCT types) VCC 4.5 5.5 V HCT types 4
Input rise and fall time (HCT types) tt 500 ns VCC = 4.5 V 4
Junction-to-ambient thermal resistance, D (SOIC) 16 pins RθJA 73 °C/W D (SOIC) package, 16 pins 4
High level input voltage VIH 2 V VCC = 4.5 to 5.5 V 5
Low level input voltage VIL 0.8 V VCC = 4.5 to 5.5 V 5
High level output voltage VOH 4.4 V IOH =, 20 μA; VCC = 4.5 V; TA = -55 to 125°C 5
High level output voltage VOH 3.98 V IOH =, 4 mA; VCC = 4.5 V; TA = 25°C 5
High level output voltage VOH 3.84 V IOH =, 4 mA; VCC = 4.5 V; TA = -40 to 85°C 5
High level output voltage VOH 3.7 V IOH =, 4 mA; VCC = 4.5 V; TA = -55 to 125°C 5
Low level output voltage VOL 0.1 V IOL = 20 μA; VCC = 4.5 V; TA = -55 to 125°C 5
Low level output voltage VOL 0.26 V IOL = 4 mA; VCC = 4.5 V; TA = 25°C 5
Low level output voltage VOL 0.33 V IOL = 4 mA; VCC = 4.5 V; TA = -40 to 85°C 5
Low level output voltage VOL 0.4 V IOL = 4 mA; VCC = 4.5 V; TA = -55 to 125°C 5
Input leakage current II -0.1 0.1 μA VI = VCC to GND; VCC = 5.5 V; TA = 25°C 5
Input leakage current II -1 1 μA VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C 5
Supply current ICC 8 μA VI = VCC to GND; VCC = 5.5 V; TA = 25°C 5
Supply current ICC 80 μA VI = VCC to GND; VCC = 5.5 V; TA = -40 to 85°C 5
Supply current ICC 160 μA VI = VCC to GND; VCC = 5.5 V; TA = -55 to 125°C 5
Additional supply current per input pin (OE1 input) ΔICC 100 216 μA OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C 5
Additional supply current per input pin (OE1 input) ΔICC 270 μA OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C 5
Additional supply current per input pin (OE1 input) ΔICC 294 μA OE1 input held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C 5
Additional supply current per input pin (all other inputs) ΔICC 100 198 μA All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = 25°C 5
Additional supply current per input pin (all other inputs) ΔICC 247.5 μA All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -40 to 85°C 5
Additional supply current per input pin (all other inputs) ΔICC 269.5 μA All other inputs held at VCC, 2.1 V; VCC = 4.5 to 5.5 V; TA = -55 to 125°C 5
Three-state leakage current IOZ -0.5 0.5 μA VO = VCC or GND; VCC = 5.5 V; TA = 25°C 5
Three-state leakage current IOZ -5 5 μA VO = VCC or GND; VCC = 5.5 V; TA = -40 to 85°C 5
Three-state leakage current IOZ -10 10 μA VO = VCC or GND; VCC = 5.5 V; TA = -55 to 125°C 5
Data to outputs (HC/HCT367) propagation delay tpd 25 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C 6
Data to outputs (HC/HCT367) propagation delay tpd 31 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C 6
Data to outputs (HC/HCT367) propagation delay tpd 38 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C 6
Data to outputs (HC/HCT368) propagation delay tpd 30 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C 6
Data to outputs (HC/HCT368) propagation delay tpd 38 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C 6
Data to outputs (HC/HCT368) propagation delay tpd 45 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C 6
Output enable and disable to outputs 35 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C 6
Output enable and disable to outputs 44 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C 6
Output enable and disable to outputs 53 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C 6
Output transition time tt 12 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = 25°C 6
Output transition time tt 15 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -40 to 85°C 6
Output transition time tt 18 ns Input tr, tf = 6 ns; CL = 50 pF; VCC = 4.5 V; TA = -55 to 125°C 6

CAD (KiCad official)

  • Symbol: CD74HCT367M96
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: cd74hct367m96-etched.step / cd74hct367m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hct367m96.step / cd74hct367m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (22 pp, sha256 4abbff03c67ff005, retrieved 2026-11-09, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF