# CD74HCT21M96

**Texas Instruments** · Logic Gates · SOIC-14

CD74HCT21M96 from Texas Instruments, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1A | input | Channel 1 input A of the 4-input AND gate (Y = A·B·C·D); TTL-compatible inputs with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 2 | 1B | input | Channel 1 input B of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 3 | NC | unconnected | Not internally connected. |
| 4 | 1C | input | Channel 1 input C of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 5 | 1D | input | Channel 1 input D of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 6 | 1Y | output | Channel 1 output Y, high only when all four inputs A, B, C and D are high; balanced CMOS push-pull output. |
| 7 | GND | power_in | Ground reference for the device; continuous current through VCC or GND is limited to ±50 mA (absolute maximum). |
| 8 | 2Y | output | Channel 2 output Y, high only when all four inputs A, B, C and D are high; balanced CMOS push-pull output. |
| 9 | 2A | input | Channel 2 input A of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 10 | 2B | input | Channel 2 input B of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 11 | NC | unconnected | Not internally connected. |
| 12 | 2C | input | Channel 2 input C of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 13 | 2D | input | Channel 2 input D of the 4-input AND gate; TTL-compatible input with VIL max 0.8 V and VIH min 2 V at VCC 4.5 V to 5.5 V. |
| 14 | VCC | power_in | Positive supply, recommended 4.5 V to 5.5 V (Section 6.3); each VCC pin should have a 0.1 µF bypass capacitor. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14 |
| Category | Logic |
| Pins | 14 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 |  | 5.5 | V |  | 4 |
| Supply voltage | VCC | -0.5 |  | 7 | V |  | 4 |
| High-level input voltage | VIH | 2 |  |  | V | VCC = 4.5 V to 5.5 V | 4 |
| Low-level input voltage | VIL |  |  | 0.8 | V | VCC = 4.5 V to 5.5 V | 4 |
| Input voltage | VI | 0 |  |  | V |  | 4 |
| Output voltage | VO | 0 |  |  | V |  | 4 |
| Input transition rise and fall time | tt |  |  | 500 | ns | VCC = 4.5 V | 4 |
| Input transition rise and fall time | tt |  |  | 400 | ns | VCC = 5.5 V | 4 |
| Operating free-air temperature | TA | -55 |  | 125 | °C |  | 4 |
| Input clamp current | IIK | -20 |  | 20 | mA | VI < -0.5 V or VI > VCC + 0.5 V | 4 |
| Output clamp current | IOK | -20 |  | 20 | mA | VO < -0.5 V or VO > VCC + 0.5 V | 4 |
| Continuous output current | IO | -25 |  | 25 | mA | VO > -0.5 V or VO < VCC + 0.5 V | 4 |
| Continuous current through VCC or GND |  | -50 |  | 50 | mA |  | 4 |
| Junction temperature | TJ |  |  | 150 | °C |  | 4 |
| Lead temperature (soldering) |  |  |  | 300 | °C | soldering 10 s, SOIC lead tips only | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| High-level output voltage | VOH | 4.4 |  |  | V | VI = VIH, IOH = -20 µA, VCC = 4.5 V, TA = 25°C | 5 |
| High-level output voltage | VOH | 3.98 |  |  | V | VI = VIH, IOH = -4 mA, VCC = 4.5 V, TA = 25°C | 5 |
| High-level output voltage | VOH | 3.84 |  |  | V | VI = VIH, IOH = -4 mA, VCC = 4.5 V, TA = -40°C to 85°C | 5 |
| High-level output voltage | VOH | 3.7 |  |  | V | VI = VIH, IOH = -4 mA, VCC = 4.5 V, TA = -55°C to 125°C | 5 |
| Low-level output voltage | VOL |  |  | 0.1 | V | VI = VIL, IOL = 20 µA, VCC = 4.5 V, TA = 25°C | 5 |
| Low-level output voltage | VOL |  |  | 0.26 | V | VI = VIL, IOL = 4 mA, VCC = 4.5 V, TA = 25°C | 5 |
| Low-level output voltage | VOL |  |  | 0.33 | V | VI = VIL, IOL = 4 mA, VCC = 4.5 V, TA = -40°C to 85°C | 5 |
| Low-level output voltage | VOL |  |  | 0.4 | V | VI = VIL, IOL = 4 mA, VCC = 4.5 V, TA = -55°C to 125°C | 5 |
| Input leakage current | II | -0.1 |  | 0.1 | µA | VI = VCC and GND, IO = 0, VCC = 5.5 V, TA = 25°C | 5 |
| Input leakage current | II | -1 |  | 1 | µA | VI = VCC and GND, IO = 0, VCC = 5.5 V, TA = -40°C to 85°C | 5 |
| Supply current | ICC |  |  | 2 | µA | VI = VCC or GND, IO = 0, VCC = 5.5 V, TA = 25°C | 5 |
| Supply current | ICC |  |  | 20 | µA | VI = VCC or GND, IO = 0, VCC = 5.5 V, TA = -40°C to 85°C | 5 |
| Supply current | ICC |  |  | 40 | µA | VI = VCC or GND, IO = 0, VCC = 5.5 V, TA = -55°C to 125°C | 5 |
| Additional quiescent device current per input pin | ΔICC |  | 100 | 360 | µA | VI = VCC, 2.1 V, VCC = 4.5 V to 5.5 V, TA = 25°C | 5 |
| Additional quiescent device current per input pin | ΔICC |  |  | 450 | µA | VI = VCC, 2.1 V, VCC = 4.5 V to 5.5 V, TA = -40°C to 85°C | 5 |
| Additional quiescent device current per input pin | ΔICC |  |  | 490 | µA | VI = VCC, 2.1 V, VCC = 4.5 V to 5.5 V, TA = -55°C to 125°C | 5 |
| Input capacitance | Ci |  | 10 |  | pF | VCC = 5 V | 5 |
| Propagation delay A, B, C or D to Y | tpd |  |  | 27 | ns | CL = 50 pF, VCC = 4.5 V, TA = 25°C | 5 |
| Propagation delay A, B, C or D to Y | tpd |  |  | 34 | ns | CL = 50 pF, VCC = 4.5 V, TA = -40°C to 85°C | 5 |
| Propagation delay A, B, C or D to Y | tpd |  |  | 41 | ns | CL = 50 pF, VCC = 4.5 V, TA = -55°C to 125°C | 5 |
| Propagation delay A, B, C or D to Y | tpd |  | 11 |  | ns | CL = 15 pF, VCC = 5 V | 5 |
| Transition-time | tt |  |  | 15 | ns | CL = 50 pF, VCC = 4.5 V, TA = 25°C | 5 |
| Transition-time | tt |  |  | 19 | ns | CL = 50 pF, VCC = 4.5 V, TA = -40°C to 85°C | 5 |
| Transition-time | tt |  |  | 22 | ns | CL = 50 pF, VCC = 4.5 V, TA = -55°C to 125°C | 5 |
| Junction-to-ambient thermal resistance | RθJA |  | 102.3 |  | °C/W | D (SOIC) 14 pins | 4 |
| Junction-to-case (top) thermal resistance | RθJC(top) |  | 58.7 |  | °C/W | D (SOIC) 14 pins | 4 |
| Junction-to-board thermal resistance | RθJB |  | 58.2 |  | °C/W | D (SOIC) 14 pins | 4 |
| Junction-to-top characterization parameter | ΨJT |  | 19.9 |  | °C/W | D (SOIC) 14 pins | 5 |
| Junction-to-board characterization parameter | ΨJB |  | 57.8 |  | °C/W | D (SOIC) 14 pins | 5 |

## CAD (KiCad official)

- Symbol: `CD74HCT21M96`
- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`
- 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files: `cd74hct21m96-etched.step` / `cd74hct21m96-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cd74hct21m96.step` / `cd74hct21m96.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/cd74hct21) (24 pp, sha256 `11fe0afbe009c65b`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cd74hct21m96-datasheet.pdf)