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CD74AC244M96

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Texas Instruments Buffers, Drivers, Receivers, Transceivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentlogiccd74ac244m96factory-2.0.0extractor-text

Verified CD74AC244M96

by Ray · last 5 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

5 Nov 2026RayPublished by the parts factory: tier mfr, 20 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: CD74AC244M96 · SOIC-20-300mil · 20 pins
  • ✓copper: 20 copper pads, none touching another net
  • ✓datasheet: all 20 pin names found in the 28-page datasheet
  • ✓distributor: lcsc C2872395, digikey 296-14479-2-ND, mouser 595-CD74AC244M96
  • ✓family: SOIC-20W_7.5x12.8mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-6xak3ze8/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 20 pins = 20 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 20 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ cd74ac244m96.kicad_sym✓ cd74ac244m96.kicad_mod✓ cd74ac244m96.step
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CD74AC244M96

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil

CD74AC244M96 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Bank 1 output enable, active low; when high, outputs 1Y0 to 1Y3 go to high impedance.
2 1A0 input Bank 1 channel 1 data input.
3 2Y3 output Bank 2 channel 4 3-state output.
4 1A1 input Bank 1 channel 2 data input.
5 2Y2 output Bank 2 channel 3 3-state output.
6 1A2 input Bank 1 channel 3 data input.
7 2Y1 output Bank 2 channel 2 3-state output.
8 1A3 input Bank 1 channel 4 data input.
9 2Y0 output Bank 2 channel 1 3-state output.
10 GND power_in Ground reference for the device.
11 2A0 input Bank 2 channel 1 data input.
12 1Y3 output Bank 1 channel 4 3-state output.
13 2A1 input Bank 2 channel 2 data input.
14 1Y2 output Bank 1 channel 3 3-state output.
15 2A2 input Bank 2 channel 3 data input.
16 1Y1 output Bank 1 channel 2 3-state output.
17 2A3 input Bank 2 channel 4 data input.
18 1Y0 output Bank 1 channel 1 3-state output.
19 2OE input Bank 2 output enable, active low; when high, outputs 2Y0 to 2Y3 go to high impedance.
20 VCC power_in Positive supply; AC types operate from 1.5 V to 5.5 V and ACT types from 4.5 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (AC types) VCC 1.5 5.5 V AC types 5
Operating temperature (CD74) TA -40 85 °C CD74 device 5
Input rise and fall slew rate dt/dv 0 50 ns/V at 1.5 V to 3 V (AC types) 5
Input rise and fall slew rate dt/dv 0 20 ns/V at 3.6 V to 5.5 V (AC types) 5
Supply voltage Vcc -0.5 6 V 5
Input diode current IIK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 5
Output diode current IOK -50 50 mA Vo < -0.5 V or VO > VCC + 0.5 V 5
Output source or sink current per output pin IO -50 50 mA VO > -0.5 V or VO < VCC + 0.5 V 5
VCC or ground current ICC or IGND -100 100 mA 5
Storage temperature Tstg -65 150 °C 5
Junction-to-ambient thermal resistance RθJA 101.2 °C/W DW (SOIC) 20 pins 5
High-level input voltage VIH 1.2 V VCC 1.5 V; TA -40 to +85 °C 6
High-level input voltage VIH 2.1 V VCC 3 V; TA -40 to +85 °C 6
High-level input voltage VIH 3.85 V VCC 5.5 V; TA -40 to +85 °C 6
Low-level input voltage VIL 0.3 V VCC 1.5 V; TA -40 to +85 °C 6
Low-level input voltage VIL 0.9 V VCC 3 V; TA -40 to +85 °C 6
Low-level input voltage VIL 1.65 V VCC 5.5 V; TA -40 to +85 °C 6
High-level output voltage VOH 1.4 V IO -0.05 mA; VCC 1.5 V; VIH or VIL; TA -40 to +85 °C 6
High-level output voltage VOH 2.9 V IO -0.05 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C 6
High-level output voltage VOH 4.4 V IO -0.05 mA; VCC 4.5 V; VIH or VIL; TA -40 to +85 °C 6
High-level output voltage VOH 2.48 V IO -4 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C 6
High-level output voltage VOH 3.8 V IO -24 mA; VCC 4.5 V; VIH or VIL; TA -40 to +85 °C 6
High-level output voltage VOH 3.85 V IO -75 mA; VCC 5.5 V; VIH or VIL; TA -40 to +85 °C 6
Low-level output voltage VOL 0.1 V IO 0.05 mA; VCC 1.5 V; VIH or VIL; TA -40 to +85 °C 6
Low-level output voltage VOL 0.44 V IO 12 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C 6
Low-level output voltage VOL 1.65 V IO 75 mA; VCC 5.5 V; VIH or VIL; TA -40 to +85 °C 6
Input leakage current II -1 1 μA VCC or GND; VCC 5.5 V; TA -40 to +85 °C 6
3-state leakage current IOZ -5 5 μA VIH or VIL; VO = VCC or GND; VCC 5.5 V; TA -40 to +85 °C 6
Quiescent supply current, MSI ICC 80 μA VCC or GND; VCC 5.5 V; TA -40 to +85 °C 6
Propagation delay data to outputs (AC 241, 244), tPLH tPLH 93 ns VCC 1.5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Propagation delay data to outputs (AC 241, 244), tPLH tPLH 3 10.5 ns VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Propagation delay data to outputs (AC 241, 244), tPHL tPHL 2.2 7.5 ns VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Output enable time tPZL 136 ns VCC 1.5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Output enable time tPZL 4.6 16.4 ns VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Output enable time tPZH 3.1 10.9 ns VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Output disable time tPLZ 3.9 13.6 ns VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Output disable time tPHZ 3.1 10.9 ns VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C 8
Input capacitance CI 10 pF 8
3-state output capacitance CO 15 pF 8
Power dissipation capacitance (AC241, 244) CPD 71 pF AC241, 244 8

CAD (KiCad official)

  • Symbol: CD74AC244M96
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: cd74ac244m96-etched.step / cd74ac244m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74ac244m96.step / cd74ac244m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 cdff8a8bd336dece, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF