component
CD74AC244M96
Public Made by Adomby adom
Texas Instruments Buffers, Drivers, Receivers, Transceivers, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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|---|---|
| docs | 2h ago |
| viewers | 2h ago |
| cd74ac244m96-etched.glb | 2h ago |
| cd74ac244m96-etched.step | 2h ago |
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| cd74ac244m96-hero.overlay.json | 2h ago |
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CD74AC244M96
Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil
CD74AC244M96 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OE | input | Bank 1 output enable, active low; when high, outputs 1Y0 to 1Y3 go to high impedance. |
| 2 | 1A0 | input | Bank 1 channel 1 data input. |
| 3 | 2Y3 | output | Bank 2 channel 4 3-state output. |
| 4 | 1A1 | input | Bank 1 channel 2 data input. |
| 5 | 2Y2 | output | Bank 2 channel 3 3-state output. |
| 6 | 1A2 | input | Bank 1 channel 3 data input. |
| 7 | 2Y1 | output | Bank 2 channel 2 3-state output. |
| 8 | 1A3 | input | Bank 1 channel 4 data input. |
| 9 | 2Y0 | output | Bank 2 channel 1 3-state output. |
| 10 | GND | power_in | Ground reference for the device. |
| 11 | 2A0 | input | Bank 2 channel 1 data input. |
| 12 | 1Y3 | output | Bank 1 channel 4 3-state output. |
| 13 | 2A1 | input | Bank 2 channel 2 data input. |
| 14 | 1Y2 | output | Bank 1 channel 3 3-state output. |
| 15 | 2A2 | input | Bank 2 channel 3 data input. |
| 16 | 1Y1 | output | Bank 1 channel 2 3-state output. |
| 17 | 2A3 | input | Bank 2 channel 4 data input. |
| 18 | 1Y0 | output | Bank 1 channel 1 3-state output. |
| 19 | 2OE | input | Bank 2 output enable, active low; when high, outputs 2Y0 to 2Y3 go to high impedance. |
| 20 | VCC | power_in | Positive supply; AC types operate from 1.5 V to 5.5 V and ACT types from 4.5 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-20-300mil |
| Category | Logic |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (AC types) | VCC | 1.5 | 5.5 | V | AC types | 5 | |
| Operating temperature (CD74) | TA | -40 | 85 | °C | CD74 device | 5 | |
| Input rise and fall slew rate | dt/dv | 0 | 50 | ns/V | at 1.5 V to 3 V (AC types) | 5 | |
| Input rise and fall slew rate | dt/dv | 0 | 20 | ns/V | at 3.6 V to 5.5 V (AC types) | 5 | |
| Supply voltage | Vcc | -0.5 | 6 | V | 5 | ||
| Input diode current | IIK | -20 | 20 | mA | VI < -0.5 V or VI > VCC + 0.5 V | 5 | |
| Output diode current | IOK | -50 | 50 | mA | Vo < -0.5 V or VO > VCC + 0.5 V | 5 | |
| Output source or sink current per output pin | IO | -50 | 50 | mA | VO > -0.5 V or VO < VCC + 0.5 V | 5 | |
| VCC or ground current | ICC or IGND | -100 | 100 | mA | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 101.2 | °C/W | DW (SOIC) 20 pins | 5 | ||
| High-level input voltage | VIH | 1.2 | V | VCC 1.5 V; TA -40 to +85 °C | 6 | ||
| High-level input voltage | VIH | 2.1 | V | VCC 3 V; TA -40 to +85 °C | 6 | ||
| High-level input voltage | VIH | 3.85 | V | VCC 5.5 V; TA -40 to +85 °C | 6 | ||
| Low-level input voltage | VIL | 0.3 | V | VCC 1.5 V; TA -40 to +85 °C | 6 | ||
| Low-level input voltage | VIL | 0.9 | V | VCC 3 V; TA -40 to +85 °C | 6 | ||
| Low-level input voltage | VIL | 1.65 | V | VCC 5.5 V; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 1.4 | V | IO -0.05 mA; VCC 1.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 2.9 | V | IO -0.05 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 4.4 | V | IO -0.05 mA; VCC 4.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 2.48 | V | IO -4 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 3.8 | V | IO -24 mA; VCC 4.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| High-level output voltage | VOH | 3.85 | V | IO -75 mA; VCC 5.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| Low-level output voltage | VOL | 0.1 | V | IO 0.05 mA; VCC 1.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| Low-level output voltage | VOL | 0.44 | V | IO 12 mA; VCC 3 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| Low-level output voltage | VOL | 1.65 | V | IO 75 mA; VCC 5.5 V; VIH or VIL; TA -40 to +85 °C | 6 | ||
| Input leakage current | II | -1 | 1 | μA | VCC or GND; VCC 5.5 V; TA -40 to +85 °C | 6 | |
| 3-state leakage current | IOZ | -5 | 5 | μA | VIH or VIL; VO = VCC or GND; VCC 5.5 V; TA -40 to +85 °C | 6 | |
| Quiescent supply current, MSI | ICC | 80 | μA | VCC or GND; VCC 5.5 V; TA -40 to +85 °C | 6 | ||
| Propagation delay data to outputs (AC 241, 244), tPLH | tPLH | 93 | ns | VCC 1.5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | ||
| Propagation delay data to outputs (AC 241, 244), tPLH | tPLH | 3 | 10.5 | ns | VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Propagation delay data to outputs (AC 241, 244), tPHL | tPHL | 2.2 | 7.5 | ns | VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Output enable time | tPZL | 136 | ns | VCC 1.5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | ||
| Output enable time | tPZL | 4.6 | 16.4 | ns | VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Output enable time | tPZH | 3.1 | 10.9 | ns | VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Output disable time | tPLZ | 3.9 | 13.6 | ns | VCC 3.3 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Output disable time | tPHZ | 3.1 | 10.9 | ns | VCC 5 V; CL = 50 pF; tr, tf = 3 ns; TA -40 to +85 °C | 8 | |
| Input capacitance | CI | 10 | pF | 8 | |||
| 3-state output capacitance | CO | 15 | pF | 8 | |||
| Power dissipation capacitance (AC241, 244) | CPD | 71 | pF | AC241, 244 | 8 |
CAD (KiCad official)
- Symbol:
CD74AC244M96 - Footprint:
Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm - 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files:
cd74ac244m96-etched.step/cd74ac244m96-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cd74ac244m96.step/cd74ac244m96.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (28 pp, sha256
cdff8a8bd336dece, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).