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CC2500RGPR
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Texas Instruments RF Transceiver ICs, QFN-20-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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CC2500RGPR
Texas Instruments · RF Transceiver ICs · QFN-20-EP(4x4)
CC2500RGPR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCLK | input | SPI clock input, maximum frequency 10 MHz (9 MHz for single-access mode without delay between address and data bytes). |
| 2 | SO (GDO1) | tri_state | SPI serial data output (default high-impedance tri-state), configurable as general-purpose output when chip select is high. |
| 3 | GDO2 | output | Configurable digital output for FIFO status signals, clear channel indicator, sync word detection, or downsampled crystal oscillator clock outputs. |
| 4 | DVDD | power_in | Digital power supply input, 1.8 to 3.6 V, requires external 100 nF decoupling capacitor. |
| 5 | DCOUPL | power_out | Digital core voltage regulator output, 1.6 to 2.0 V; intended for CC2500 internal decoupling only and must not be used to supply external devices. |
| 6 | GDO0 (ATEST) | bidirectional | Configurable digital input/output for general-purpose signals, FIFO status, serial TX data input, or on-chip analog temperature sensor output (enable with PTEST register). |
| 7 | CSn | input | SPI chip select input (active low); must be held low during all SPI header and data transfers. |
| 8 | XOSC_Q1 | bidirectional | Crystal oscillator pin 1 (26 to 27 MHz) or external reference clock input (full-swing digital or sine wave up to 1 V peak-peak). |
| 9 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V; all supply pins must have the same voltage. |
| 10 | XOSC_Q2 | bidirectional | Crystal oscillator pin 2 (26 to 27 MHz), used with loading capacitors (typically 27 pF for 10 pF crystal load capacitance). |
| 11 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 12 | RF_P | bidirectional | Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |
| 13 | RF_N | bidirectional | Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |
| 14 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 15 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 16 | GND | power_in | Analog ground connection for RF and low-noise analog circuits, connected to main ground plane. |
| 17 | RBIAS | bidirectional | External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits. |
| 18 | DGUARD | power_in | Isolated digital power supply for digital noise isolation guard ring, 1.8 to 3.6 V; must match other supply pins. |
| 19 | GND | power_in | Isolated digital ground for digital noise isolation guard ring, connected to main ground plane. |
| 20 | SI | input | SPI serial data input; carries address and data bytes for chip configuration and register access. |
| 21 | Exposed Die Attach Pad (EP) | power_in | Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-20-EP(4x4) |
| Category | RF And Wireless |
| Pins | 21 |
CAD (KiCad official)
- Symbol:
CC2500RGPR - Footprint:
Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
cc2500rgpr-etched.step/cc2500rgpr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cc2500rgpr.step/cc2500rgpr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (99 pp, sha256
27364e9593879ec0, retrieved 2026-09-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# CC2500RGPR
**Texas Instruments** · RF Transceiver ICs · QFN-20-EP(4x4)
CC2500RGPR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCLK | input | SPI clock input, maximum frequency 10 MHz (9 MHz for single-access mode without delay between address and data bytes). |
| 2 | SO (GDO1) | tri_state | SPI serial data output (default high-impedance tri-state), configurable as general-purpose output when chip select is high. |
| 3 | GDO2 | output | Configurable digital output for FIFO status signals, clear channel indicator, sync word detection, or downsampled crystal oscillator clock outputs. |
| 4 | DVDD | power_in | Digital power supply input, 1.8 to 3.6 V, requires external 100 nF decoupling capacitor. |
| 5 | DCOUPL | power_out | Digital core voltage regulator output, 1.6 to 2.0 V; intended for CC2500 internal decoupling only and must not be used to supply external devices. |
| 6 | GDO0 (ATEST) | bidirectional | Configurable digital input/output for general-purpose signals, FIFO status, serial TX data input, or on-chip analog temperature sensor output (enable with PTEST register). |
| 7 | CSn | input | SPI chip select input (active low); must be held low during all SPI header and data transfers. |
| 8 | XOSC_Q1 | bidirectional | Crystal oscillator pin 1 (26 to 27 MHz) or external reference clock input (full-swing digital or sine wave up to 1 V peak-peak). |
| 9 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V; all supply pins must have the same voltage. |
| 10 | XOSC_Q2 | bidirectional | Crystal oscillator pin 2 (26 to 27 MHz), used with loading capacitors (typically 27 pF for 10 pF crystal load capacitance). |
| 11 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 12 | RF_P | bidirectional | Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |
| 13 | RF_N | bidirectional | Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |
| 14 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 15 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |
| 16 | GND | power_in | Analog ground connection for RF and low-noise analog circuits, connected to main ground plane. |
| 17 | RBIAS | bidirectional | External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits. |
| 18 | DGUARD | power_in | Isolated digital power supply for digital noise isolation guard ring, 1.8 to 3.6 V; must match other supply pins. |
| 19 | GND | power_in | Isolated digital ground for digital noise isolation guard ring, connected to main ground plane. |
| 20 | SI | input | SPI serial data input; carries address and data bytes for chip configuration and register access. |
| 21 | Exposed Die Attach Pad (EP) | power_in | Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-20-EP(4x4) |
| Category | RF And Wireless |
| Pins | 21 |
## CAD (KiCad official)
- Symbol: `CC2500RGPR`
- Footprint: `Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm`
- 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `cc2500rgpr-etched.step` / `cc2500rgpr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cc2500rgpr.step` / `cc2500rgpr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/cc2500) (99 pp, sha256 `27364e9593879ec0`, retrieved 2026-09-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/cc2500rgpr-datasheet.pdf)