component
CC2500RGPR
Public Made by Adomby adom
Texas Instruments RF Transceiver ICs, QFN-20-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+57@@ -0,0 +1,57 @@+# CC2500RGPR++**Texas Instruments** · RF Transceiver ICs · QFN-20-EP(4x4)++CC2500RGPR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | SCLK | input | SPI clock input, maximum frequency 10 MHz (9 MHz for single-access mode without delay between address and data bytes). |+| 2 | SO (GDO1) | tri_state | SPI serial data output (default high-impedance tri-state), configurable as general-purpose output when chip select is high. |+| 3 | GDO2 | output | Configurable digital output for FIFO status signals, clear channel indicator, sync word detection, or downsampled crystal oscillator clock outputs. |+| 4 | DVDD | power_in | Digital power supply input, 1.8 to 3.6 V, requires external 100 nF decoupling capacitor. |+| 5 | DCOUPL | power_out | Digital core voltage regulator output, 1.6 to 2.0 V; intended for CC2500 internal decoupling only and must not be used to supply external devices. |+| 6 | GDO0 (ATEST) | bidirectional | Configurable digital input/output for general-purpose signals, FIFO status, serial TX data input, or on-chip analog temperature sensor output (enable with PTEST register). |+| 7 | CSn | input | SPI chip select input (active low); must be held low during all SPI header and data transfers. |+| 8 | XOSC_Q1 | bidirectional | Crystal oscillator pin 1 (26 to 27 MHz) or external reference clock input (full-swing digital or sine wave up to 1 V peak-peak). |+| 9 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V; all supply pins must have the same voltage. |+| 10 | XOSC_Q2 | bidirectional | Crystal oscillator pin 2 (26 to 27 MHz), used with loading capacitors (typically 27 pF for 10 pF crystal load capacitance). |+| 11 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |+| 12 | RF_P | bidirectional | Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |+| 13 | RF_N | bidirectional | Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω. |+| 14 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |+| 15 | AVDD | power_in | Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance). |+| 16 | GND | power_in | Analog ground connection for RF and low-noise analog circuits, connected to main ground plane. |+| 17 | RBIAS | bidirectional | External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits. |+| 18 | DGUARD | power_in | Isolated digital power supply for digital noise isolation guard ring, 1.8 to 3.6 V; must match other supply pins. |+| 19 | GND | power_in | Isolated digital ground for digital noise isolation guard ring, connected to main ground plane. |+| 20 | SI | input | SPI serial data input; carries address and data bytes for chip configuration and register access. |+| 21 | Exposed Die Attach Pad (EP) | power_in | Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | QFN-20-EP(4x4) |+| Category | RF And Wireless |+| Pins | 21 |++## CAD (KiCad official)++- Symbol: `CC2500RGPR`+- Footprint: `Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm`+- 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)+- 3D model files: `cc2500rgpr-etched.step` / `cc2500rgpr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cc2500rgpr.step` / `cc2500rgpr.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/cc2500) (99 pp, sha256 `27364e9593879ec0`, retrieved 2026-09-23, tier: lcsc)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/cc2500rgpr-datasheet.pdf)
page.jsonadded+221@@ -0,0 +1,221 @@+{+ "slug": "cc2500rgpr",+ "version": "0.1.0",+ "type": "component",+ "description": "Texas Instruments RF Transceiver ICs, QFN-20-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.",+ "tags": [+ "component",+ "rf and wireless",+ "cc2500rgpr",+ "factory-2.0.0",+ "extractor-text"+ ],+ "dependencies": {},+ "hero": {+ "type": "image",+ "path": "docs/hero.png"+ },+ "files": [+ "page.json",+ "README.md",+ "cc2500rgpr.kicad_sym",+ "cc2500rgpr.kicad_mod",+ "cc2500rgpr.glb",+ "cc2500rgpr.step",+ "cc2500rgpr.lbr",+ "docs/hero.png",+ "docs/cc2500rgpr-datasheet.pdf",+ "viewers/symbol.html",+ "viewers/footprint.html"+ ],+ "component": {+ "mpn": "CC2500RGPR",+ "manufacturer": "Texas Instruments",+ "package": "QFN-20-EP(4x4)",+ "pin_count": 21,+ "category": "RF And Wireless",+ "subcategory": "RF Transceiver ICs",+ "datasheet": "https://www.ti.com/cn/lit/gpn/cc2500",+ "parts": {+ "symbol": "cc2500rgpr.kicad_sym",+ "footprint": "cc2500rgpr.kicad_mod",+ "model_3d": "cc2500rgpr-etched.glb",+ "model_3d_plain": "cc2500rgpr.glb",+ "model_3d_step": "cc2500rgpr-etched.step",+ "model_3d_step_plain": "cc2500rgpr.step",+ "lbr": "cc2500rgpr.lbr"+ },+ "distributor_links": {+ "lcsc": "C57494"+ },+ "pins": [+ {+ "number": "1",+ "name": "SCLK",+ "type": "input",+ "description": "SPI clock input, maximum frequency 10 MHz (9 MHz for single-access mode without delay between address and data bytes)."+ },+ {+ "number": "2",+ "name": "SO (GDO1)",+ "type": "tri_state",+ "description": "SPI serial data output (default high-impedance tri-state), configurable as general-purpose output when chip select is high."+ },+ {+ "number": "3",+ "name": "GDO2",+ "type": "output",+ "description": "Configurable digital output for FIFO status signals, clear channel indicator, sync word detection, or downsampled crystal oscillator clock outputs."+ },+ {+ "number": "4",+ "name": "DVDD",+ "type": "power_in",+ "description": "Digital power supply input, 1.8 to 3.6 V, requires external 100 nF decoupling capacitor."+ },+ {+ "number": "5",+ "name": "DCOUPL",+ "type": "power_out",+ "description": "Digital core voltage regulator output, 1.6 to 2.0 V; intended for CC2500 internal decoupling only and must not be used to supply external devices."+ },+ {+ "number": "6",+ "name": "GDO0 (ATEST)",+ "type": "bidirectional",+ "description": "Configurable digital input/output for general-purpose signals, FIFO status, serial TX data input, or on-chip analog temperature sensor output (enable with PTEST register)."+ },+ {+ "number": "7",+ "name": "CSn",+ "type": "input",+ "description": "SPI chip select input (active low); must be held low during all SPI header and data transfers."+ },+ {+ "number": "8",+ "name": "XOSC_Q1",+ "type": "bidirectional",+ "description": "Crystal oscillator pin 1 (26 to 27 MHz) or external reference clock input (full-swing digital or sine wave up to 1 V peak-peak)."+ },+ {+ "number": "9",+ "name": "AVDD",+ "type": "power_in",+ "description": "Analog power supply input, 1.8 to 3.6 V; all supply pins must have the same voltage."+ },+ {+ "number": "10",+ "name": "XOSC_Q2",+ "type": "bidirectional",+ "description": "Crystal oscillator pin 2 (26 to 27 MHz), used with loading capacitors (typically 27 pF for 10 pF crystal load capacitance)."+ },+ {+ "number": "11",+ "name": "AVDD",+ "type": "power_in",+ "description": "Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance)."+ },+ {+ "number": "12",+ "name": "RF_P",+ "type": "bidirectional",+ "description": "Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."+ },+ {+ "number": "13",+ "name": "RF_N",+ "type": "bidirectional",+ "description": "Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."+ },+ {+ "number": "14",+ "name": "AVDD",+ "type": "power_in",+ "description": "Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance)."+ },+ {+ "number": "15",+ "name": "AVDD",+ "type": "power_in",+ "description": "Analog power supply input, 1.8 to 3.6 V (duplicate pin for enhanced power distribution and lower inductance)."+ },+ {+ "number": "16",+ "name": "GND",+ "type": "power_in",+ "description": "Analog ground connection for RF and low-noise analog circuits, connected to main ground plane."+ },+ {+ "number": "17",+ "name": "RBIAS",+ "type": "bidirectional",+ "description": "External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits."+ },+ {+ "number": "18",+ "name": "DGUARD",+ "type": "power_in",+ "description": "Isolated digital power supply for digital noise isolation guard ring, 1.8 to 3.6 V; must match other supply pins."+ },+ {+ "number": "19",+ "name": "GND",+ "type": "power_in",+ "description": "Isolated digital ground for digital noise isolation guard ring, connected to main ground plane."+ },+ {+ "number": "20",+ "name": "SI",+ "type": "input",+ "description": "SPI serial data input; carries address and data bytes for chip configuration and register access."+ },+ {+ "number": "21",+ "name": "Exposed Die Attach Pad (EP)",+ "type": "power_in",+ "description": "Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path."+ }+ ],+ "provenance": {+ "extractor": "extract_pins 0.2",+ "factory_chain": {+ "factory": "2.0.0",+ "extractor": "extract_pins 0.2",+ "primary_model": "claude-haiku-4-5-20251001",+ "primary_mode": "text",+ "consensus_model": "claude-sonnet-5",+ "consensus": "agreed",+ "guards": "pin_guards 0.1: passed",+ "guard_notes": [+ "extractor flagged: Pin 5 (DCOUPL): Listed as 'Power (Digital)' pin type in datasheet table, but functionally is a volta; Exposed die attach pad (pin 21): Not explicitly numbered in datasheet Table 13 but is documented in "+ ],+ "pages_sent": 99,+ "cost_usd": 0.905,+ "at": "2026-09-23T09:59:22"+ },+ "datasheet": {+ "url": "https://www.ti.com/cn/lit/gpn/cc2500",+ "pages": 99,+ "sha256": "27364e9593879ec0",+ "source_tier": "lcsc"+ },+ "cad": "KiCad official (CC-BY-SA 4.0)",+ "pins": {+ "total": 21,+ "described": 21,+ "cites_pages": true,+ "refuses_to_fabricate": true+ }+ },+ "viewers": {+ "symbol": "viewers/symbol.html",+ "footprint": "viewers/footprint.html"+ }+ },+ "visibility": "public",+ "org": "adom",+ "author": {+ "name": "Ray",+ "email": "[email protected]"+ }+}