# CBM810LST3

**Corebai Microelectronics** · Monitors & Reset Circuits · SOT-23-3

CBM810LST3 from Corebai Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference; all signals are referenced to ground (0 V). |
| 2 | RESET | output | Logic-high push-pull reset output that is driven high while VCC is below the reset threshold and stays high for 240 ms (typical) after VCC rises above the threshold. |
| 3 | VCC | power_in | Monitored supply voltage; the device operates from 1.0 V to 5.5 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Corebai Microelectronics |
| Package | SOT-23-3 |
| Category | Power Management ICs |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | 1 |  | 5.5 | V |  | 4 |
| Reset threshold voltage (CBM810L) | VRST | 4.56 | 4.63 | 4.7 | V | CBM803L/CBM809L/CBM810L | 4 |
| Reset pulse width |  | 140 | 240 | 460 | ms |  | 4 |
| Supply current |  |  | 24 | 35 | μA | VCC < 5.5V, CBM8XXL/M/J | 4 |
| RESET output low voltage (CBM810L) | VOL |  |  | 0.4 | V | VCC = VTH min, ISINK = 3.2 mA, CBM810L/M/J | 5 |
| Absolute maximum supply voltage VCC | VCC | -0.3 |  | 6 | V |  | 5 |
| RESET, RESET (push-pull) voltage |  | -0.3 |  |  | V |  | 5 |
| Input current (VCC) |  |  |  | 20 | mA |  | 5 |
| Output current (RESET, RESET) |  |  |  | 20 | mA |  | 5 |
| Rise rate, VCC |  |  |  | 100 | V/μs |  | 5 |
| Lead temperature (soldering, 10 sec) |  |  |  | 300 | ℃ | soldering, 10 sec | 5 |
| Vapor phase soldering (60 sec) |  |  |  | 215 | ℃ | vapor phase, 60 sec | 5 |
| Infrared soldering (15 sec) |  |  |  | 220 | ℃ | infrared, 15 sec | 5 |
| Storage temperature range |  | -65 |  | 150 | ℃ |  | 5 |
| Thermal resistance junction-to-ambient θJA | θJA |  | 270 |  | °C/W | SOT-23 package | 5 |
| Operating ambient temperature range | TA | -40 |  | 85 | ℃ | Ordering temperature range for CBM810LST3 | 12 |

## CAD (land: KiCad; 3D: generated from the datasheet)

- Symbol: `CBM810LST3`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files: `cbm810lst3-etched.step` / `cbm810lst3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cbm810lst3.step` / `cbm810lst3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Corebai Microelectronics datasheet](docs/cbm810lst3-datasheet.pdf) (13 pp, sha256 `185a6d7df019adba`, retrieved 2026-11-12, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

[Datasheet PDF](docs/cbm810lst3-datasheet.pdf)