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CBM810LST3

Corebai Microelectronics · Monitors & Reset Circuits · SOT-23-3

CBM810LST3 from Corebai Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 GND power_in Ground reference; all signals are referenced to ground (0 V).
2 RESET output Logic-high push-pull reset output that is driven high while VCC is below the reset threshold and stays high for 240 ms (typical) after VCC rises above the threshold.
3 VCC power_in Monitored supply voltage; the device operates from 1.0 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Corebai Microelectronics
Package SOT-23-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC 1 5.5 V 4
Reset threshold voltage (CBM810L) VRST 4.56 4.63 4.7 V CBM803L/CBM809L/CBM810L 4
Reset pulse width 140 240 460 ms 4
Supply current 24 35 μA VCC < 5.5V, CBM8XXL/M/J 4
RESET output low voltage (CBM810L) VOL 0.4 V VCC = VTH min, ISINK = 3.2 mA, CBM810L/M/J 5
Absolute maximum supply voltage VCC VCC -0.3 6 V 5
RESET, RESET (push-pull) voltage -0.3 V 5
Input current (VCC) 20 mA 5
Output current (RESET, RESET) 20 mA 5
Rise rate, VCC 100 V/μs 5
Lead temperature (soldering, 10 sec) 300 ℃ soldering, 10 sec 5
Vapor phase soldering (60 sec) 215 ℃ vapor phase, 60 sec 5
Infrared soldering (15 sec) 220 ℃ infrared, 15 sec 5
Storage temperature range -65 150 ℃ 5
Thermal resistance junction-to-ambient θJA θJA 270 °C/W SOT-23 package 5
Operating ambient temperature range TA -40 85 ℃ Ordering temperature range for CBM810LST3 12

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: CBM810LST3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: cbm810lst3-etched.step / cbm810lst3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cbm810lst3.step / cbm810lst3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Corebai Microelectronics datasheet (13 pp, sha256 185a6d7df019adba, retrieved 2026-11-12, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF