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C8051F912-D-GM

SKYWORKS/SILICON LABS · Microcontroller Units (MCUs/MPUs/SOCs) · QFN-24(4x4)

C8051F912-D-GM from SKYWORKS/SILICON LABS, in a QFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DC-/GND power_in DC-DC converter return current path, typically not connected to ground in single-cell battery mode and must be connected directly to ground in dual-cell battery mode.
2 GND power_in Required ground connection.
3 VDD/DC+ power_in Power supply voltage that must be 1.8 to 3.6 V and always be greater than VBAT; in single-cell mode this pin is the positive dc-dc converter output and needs a 1 uF ceramic capacitor between DC+ and DC- (it can supply external devices in single-cell mode).
4 DCEN power_in DC-DC enable pin: in single-cell battery mode it must be connected to VBAT through a 0.68 uH inductor, and in dual-cell battery mode it must be connected directly to ground.
5 VBAT power_in Battery supply voltage: must be 0.9 to 1.8 V in single-cell and 1.8 to 3.6 V in dual-cell mode on C8051F911/01, and 0.9 to 3.6 V in single-cell and 1.8 to 3.6 V in dual-cell mode on C8051F912/02.
6 RST/C2CK bidirectional Open-drain reset output from the internal POR or VDD monitor that an external source can drive low for at least 15 us to reset the device, with a 1 k to 5 k pullup to VDD recommended; the same pin is the C2 debug interface clock.
7 P2.7/C2D bidirectional Port 2.7 GPIO only (the Crossbar cannot route to it and it cannot be an analog input), also serving as the C2 debug data signal; available only on C8051F912/02.
8 XTAL4 output SmaRTClock oscillator crystal output.
9 XTAL3 input SmaRTClock oscillator crystal input.
10 P1.6 bidirectional Port 1.6 GPIO pin (digital I/O or analog input per Port I/O configuration).
11 P1.5 bidirectional Port 1.5 GPIO pin (digital I/O or analog input per Port I/O configuration).
12 P1.4 bidirectional Port 1.4 GPIO pin (digital I/O or analog input per Port I/O configuration).
13 P1.3 bidirectional Port 1.3 GPIO pin; may also be used as NSS for SPI1.
14 P1.2 bidirectional Port 1.2 GPIO pin; may also be used as MOSI for SPI1.
15 P1.1 bidirectional Port 1.1 GPIO pin; may also be used as MISO for SPI1.
16 P1.0 bidirectional Port 1.0 GPIO pin; may also be used as SCK for SPI1.
17 P0.7/IREF0 bidirectional Port 0.7 GPIO pin; alternatively the IREF0 current reference output.
18 P0.6/CNVSTR bidirectional Port 0.6 GPIO pin; alternatively the external convert start input for ADC0.
19 P0.5/RX bidirectional Port 0.5 GPIO pin; alternatively the UART RX input.
20 P0.4/TX bidirectional Port 0.4 GPIO pin; alternatively the UART TX output.
21 P0.3/XTAL2/WAKEOUT bidirectional Port 0.3 GPIO pin; alternatively the external oscillator excitation driver (XTAL2), an external clock input, or the WAKEOUT wake-up request signal (C8051F912/02 only).
22 P0.2/XTAL1/RTCOUT bidirectional Port 0.2 GPIO pin; alternatively the external oscillator return for a crystal or resonator (XTAL1), or the buffered SmaRTClock output RTCOUT (C8051F912/02 only).
23 P0.1/AGND bidirectional Port 0.1 GPIO pin; alternatively the optional analog ground reference AGND.
24 P0.0/VREF bidirectional Port 0.0 GPIO pin; alternatively the external VREF input or the internal VREF output, with external VREF decoupling capacitors recommended.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer SKYWORKS/SILICON LABS
Package QFN-24(4x4)
Category Single Chip Microcomputer/Microcontroller
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias -55 125 °C 36
Storage Temperature -65 150 °C 36
Voltage on any Port I/O Pin or RST with respect to GND -0.3 5.8 V VDD > 2.2 V 36
Voltage on any Port I/O Pin or RST with respect to GND -0.3 V VDD < 2.2 V (max printed as VDD + 3.6 V) 36
Voltage on VBAT with respect to GND VBAT -0.3 4 V One-Cell Mode (F912/02) 36
Voltage on VDD/DC+ with respect to GND VDD/DC+ -0.3 4 V 36
Maximum total current through VBAT, DCEN, VDD/DC+ or GND 500 mA 36
Maximum current through RST or any Port pin 100 mA 36
Maximum total current through all Port pins 200 mA 36
DC-DC Converter Output Power 110 mW 36
Battery Supply Voltage (VBAT) VBAT 0.9 1.2 3.6 V One-Cell Mode (F912/02) 37
Battery Supply Voltage (VBAT) VBAT 1.8 2.4 3.6 V Two-Cell Mode 37
Supply Voltage (VDD/DC+) VDD/DC+ 1.8 1.9 3.6 V One-Cell Mode 37
Supply Voltage (VDD/DC+) VDD/DC+ 1.8 2.4 3.6 V Two-Cell Mode 37
Minimum RAM Data Retention Voltage (VBAT in Sleep Mode) 0.3 0.5 V VBAT (in Sleep Mode) 37
SYSCLK (System Clock) SYSCLK 0 25 MHz 37
TSYSH (SYSCLK High Time) TSYSH 18 ns 37
TSYSL (SYSCLK Low Time) TSYSL 18 ns 37
Specified Operating Temperature Range -40 85 °C 37
Digital Supply Current, CPU Active (Normal Mode) IDD 4 5 mA VDD = 1.8-3.6 V, F = 24.5 MHz (includes precision oscillator current) 38
Digital Supply Current, CPU Inactive (Idle Mode) IDD 2.1 3 mA VDD = 1.8-3.6 V, F = 24.5 MHz (includes precision oscillator current) 38
RST Output Low Voltage 0.6 V IOL = 1.4 mA 52
RST Input Low Voltage 0.6 V VDD = 2.0 to 3.6 V 52
RST Input Pullup Current 20 35 µA RST = 0.0 V, VDD = 3.6 V 52
VDD/DC+ Monitor Threshold (VRST) VRST 1.8 1.85 1.9 V Early Warning 52
VDD/DC+ Monitor Threshold (VRST) VRST 1.7 1.75 1.8 V Reset Trigger (all power modes except Sleep) 52
VBAT Ramp Time for Power On 3 ms VBAT Ramp from 0-0.9 V 52
VBAT Monitor Threshold (VPOR) VPOR 0.9 1 1.1 V Early Warning 52
VBAT Monitor Threshold (VPOR) VPOR 0.7 0.8 0.9 V Brownout Condition (VBAT Falling) 52
Missing Clock Detector Timeout 100 525 1000 µs Time from last system clock rising edge to reset initiation 52
Minimum System Clock w/ Missing Clock Detector Enabled 2 10 kHz System clock frequency which triggers a missing clock detector timeout 52
Minimum RST Low Time to Generate a System Reset 15 µs 52
Idle Mode Wake-up Time 2 3 SYSCLKs 53
Flash Size 16384 bytes C8051F912/1 53
Scratchpad Size 512 512 bytes 53
Endurance 1 90 k Erase/Write Cycles 53
Erase Cycle Time 28 32 36 ms 53
Write Cycle Time 57 64 71 µs 53
Oscillator Frequency (internal precision oscillator) 24 24.5 25 MHz -40 to +85 °C, VDD = 1.8-3.6 V 53
Oscillator Frequency (internal low-power oscillator) 18 20 22 MHz -40 to +85 °C, VDD = 1.8-3.6 V 53
Oscillator Frequency (LFO) 13.1 16.4 19.7 kHz 54
Integral Nonlinearity -1.5 1 1.5 LSB 12-bit mode 54
Integral Nonlinearity -1 0.5 1 LSB 10-bit mode 54
Differential Nonlinearity (Guaranteed Monotonic) -1 0.8 1 LSB 12-bit mode 54
Differential Nonlinearity (Guaranteed Monotonic) -1 0.5 1 LSB 10-bit mode 54
Full Scale Error -4 1 4 LSB 12-bit mode 54
Full Scale Error -2.5 1 2.5 LSB 10-bit mode 54
Signal-to-Noise Plus Distortion 62 65 dB 10 kHz sine-wave single-ended input, 1 dB below Full Scale, maximum sampling rate; 12-bit mode 54
SAR Conversion Clock (Normal Mode) 8.33 MHz Normal Mode 54
SAR Conversion Clock (Low Power Mode) 4.4 MHz Low Power Mode 54
Throughput Rate 300 ksps 10-bit mode 54
ADC Input Voltage Range, Single Ended (AIN+, GND) 0 V 55
Input Low Voltage 0.6 V VDD = 2.0 to 3.6 V 47
Output Low Voltage 0.6 V High Drive Strength, PnDRV.n = 1, IOL = 8.5 mA 47
Input Leakage Current -1 1 µA Weak Pullup Off 47
Input Voltage Range (DC-DC Converter, C8051F912/02) 0.9 3.6 V C8051F912/02 60
Output Voltage Range 1.73 1.8 1.87 V Target Output = 1.8 V 60
Clocking Frequency (DC-DC Converter) 1.6 2.4 3.2 MHz 60
Input Offset Voltage -7 7 mV 58

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body 34

CAD (KiCad official)

  • Symbol: C8051F912-D-GM
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: QFN-24(4x4) (KiCad packages3D, STEP)
  • 3D model files: c8051f912-d-gm-etched.step / c8051f912-d-gm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); c8051f912-d-gm.step / c8051f912-d-gm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SKYWORKS/SILICON LABS datasheet (318 pp, sha256 d9f48e8306647ff2, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF