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Ray Publish 0.1.0 a084a39 4h ago

BZT52-B30-QX

Nexperia · Zener Diodes · SOD-123

BZT52-B30-QX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ 29.4 30.6 V IZ = 2 mA; Sel B 5
Maximum differential resistance rdif 250 Ω IZ = 1 mA 5
Maximum differential resistance rdif 40 Ω IZ = 5 mA 5
Reverse current IR 0.05 μA VR = 21 V 5
Temperature coefficient SZ 24.4 29.4 mV/K IZ = 5 mA 5
Diode capacitance Cd 50 pF f = 1 MHz; VR = 0 V 5
Non-repetitive peak reverse current IZSM 1 A tp = 100 μs; Tamb = 25 °C 5
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward current IF 250 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 3
Total power dissipation Ptot 350 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, standard footprint 3
Total power dissipation Ptot 590 mW FR4 PCB, mounting pad for cathode 1 cm² 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 350 K/W in free air; FR4 PCB, single-sided copper, standard footprint 3
Thermal resistance from junction to ambient Rth(j-a) 210 K/W FR4 PCB, mounting pad for cathode 1 cm² 3
Thermal resistance from junction to solder point Rth(j-sp) 55 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZT52-B30-QX
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: bzt52-b30-qx-etched.step / bzt52-b30-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52-b30-qx.step / bzt52-b30-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 3b4b96d8d0378fe9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF