component
BZT52-B30-QX
Public Made by Adomby adom
Nexperia Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBZT52-B30-QX
Nexperia · Zener Diodes · SOD-123
BZT52-B30-QX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Zener diode; the marking bar on the package indicates the cathode. |
| 2 | A | passive | Anode of the Zener diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working voltage | VZ | 29.4 | 30.6 | V | IZ = 2 mA; Sel B | 5 | |
| Maximum differential resistance | rdif | 250 | Ω | IZ = 1 mA | 5 | ||
| Maximum differential resistance | rdif | 40 | Ω | IZ = 5 mA | 5 | ||
| Reverse current | IR | 0.05 | μA | VR = 21 V | 5 | ||
| Temperature coefficient | SZ | 24.4 | 29.4 | mV/K | IZ = 5 mA | 5 | |
| Diode capacitance | Cd | 50 | pF | f = 1 MHz; VR = 0 V | 5 | ||
| Non-repetitive peak reverse current | IZSM | 1 | A | tp = 100 μs; Tamb = 25 °C | 5 | ||
| Forward voltage | VF | 0.9 | V | IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 | 4 | ||
| Forward current | IF | 250 | mA | 3 | |||
| Non-repetitive peak reverse power dissipation | PZSM | 40 | W | tp = 100 μs; square wave; Tj = 25 °C prior to surge | 3 | ||
| Total power dissipation | Ptot | 350 | mW | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, standard footprint | 3 | ||
| Total power dissipation | Ptot | 590 | mW | FR4 PCB, mounting pad for cathode 1 cm² | 3 | ||
| Junction temperature | Tj | 150 | °C | 3 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 350 | K/W | in free air; FR4 PCB, single-sided copper, standard footprint | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 210 | K/W | FR4 PCB, mounting pad for cathode 1 cm² | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 55 | K/W | soldering point of cathode tab | 3 |
CAD (KiCad official)
- Symbol:
BZT52-B30-QX - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
bzt52-b30-qx-etched.step/bzt52-b30-qx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzt52-b30-qx.step/bzt52-b30-qx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
3b4b96d8d0378fe9, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).