# BYD167

**YFW** · Fast Recovery / High Efficiency Diodes · SOD-123FL

BYD167 from YFW, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the two-lead SOD-123FL package, as numbered in the simplified outline; the provided text does not state whether it is the anode or the cathode. |
| 2 | 2 | passive | Terminal 2 of the two-lead SOD-123FL package, as numbered in the simplified outline; the provided text does not state whether it is the anode or the cathode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | YFW |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM |  |  | 600 | V |  | 1 |
| Average forward current | IF(AV) |  |  | 1 | A | TL = 110°C | 1 |
| Peak forward surge current | IFSM |  |  | 25 | A | 8.3ms single half sine-wave | 1 |
| Forward voltage | VF |  | 1.4 | 1.7 | V | IF = 1.0A | 1 |
| Repetitive peak reverse current | IRRM |  | 0.2 | 5 | uA | VR = Max. VRRM, Ta = 25°C | 1 |
| Operating storage temperature range | Tj,TSTG | -65 |  | 175 | °C |  | 1 |
| Thermal resistance junction to ambient | Rth(JA) |  | 80 |  | °C/W | Junction to ambient (NOTE 1), P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas | 1 |
| Thermal resistance junction to lead | Rth(JL) |  | 40 |  | °C/W | Junction to lead (NOTE 1), P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | NOTES :	 (1)	Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas. | 1 |

## CAD (KiCad official)

- Symbol: `BYD167`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `byd167-etched.step` / `byd167-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `byd167.step` / `byd167.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [YFW datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590197202581815296) (3 pp, sha256 `5640bc41fbecc3f4`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/byd167-datasheet.pdf)