component
BYD167
Public Made by Adomby adom
YFW Fast Recovery / High Efficiency Diodes, SOD-123FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBYD167
YFW · Fast Recovery / High Efficiency Diodes · SOD-123FL
BYD167 from YFW, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the two-lead SOD-123FL package, as numbered in the simplified outline; the provided text does not state whether it is the anode or the cathode. |
| 2 | 2 | passive | Terminal 2 of the two-lead SOD-123FL package, as numbered in the simplified outline; the provided text does not state whether it is the anode or the cathode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | YFW |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 600 | V | 1 | |||
| Average forward current | IF(AV) | 1 | A | TL = 110°C | 1 | ||
| Peak forward surge current | IFSM | 25 | A | 8.3ms single half sine-wave | 1 | ||
| Forward voltage | VF | 1.4 | 1.7 | V | IF = 1.0A | 1 | |
| Repetitive peak reverse current | IRRM | 0.2 | 5 | uA | VR = Max. VRRM, Ta = 25°C | 1 | |
| Operating storage temperature range | Tj,TSTG | -65 | 175 | °C | 1 | ||
| Thermal resistance junction to ambient | Rth(JA) | 80 | °C/W | Junction to ambient (NOTE 1), P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas | 1 | ||
| Thermal resistance junction to lead | Rth(JL) | 40 | °C/W | Junction to lead (NOTE 1), P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | NOTES : (1) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas. | 1 |
CAD (KiCad official)
- Symbol:
BYD167 - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
byd167-etched.step/byd167-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);byd167.step/byd167.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: YFW datasheet (3 pp, sha256
5640bc41fbecc3f4, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).