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BYC30W-600PT2Q

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WeEn Semiconductors Diodes - General Purpose, TO-247-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BYC30W-600PT2Q

WeEn Semiconductors · Diodes - General Purpose · TO-247-2

BYC30W-600PT2Q from WeEn Semiconductors, in a TO-247-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the diode; the repetitive peak reverse voltage VRRM is 600 V, and the mounting base is connected to this cathode.
2 A passive Anode of the diode; the average forward current IF(AV) is rated at 30 A for Tmb ≤ 117 °C (square-wave, δ = 0.5).

Key specifications

Parameter Value
Manufacturer WeEn Semiconductors
Package TO-247-2
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
repetitive peak reverse voltage VRRM 600 V 3
crest working reverse voltage VRWM 600 V 3
reverse voltage DC VR 600 V 3
average forward current IF(AV) 30 A δ = 0.5; square-wave pulse; Tmb ≤ 117 °C; Fig. 1; Fig. 2; Fig. 3 3
repetitive peak forward current IFRM 60 A δ = 0.5; tp = 25 μs; Tmb ≤ 117 °C; square-wave pulse 3
non-repetitive peak forward current IFSM 270 A tp = 10 ms; Tj(init) = 25 °C; sine-wave pulse; Fig. 4 3
non-repetitive peak forward current IFSM 295 A tp = 8.3 ms; Tj(init) = 25 °C; sine-wave pulse 3
storage temperature Tstg -55 175 °C 3
junction temperature Tj 175 °C 3
thermal resistance from junction to mounting base Rth(j-mb) 0.8 K/W Fig. 5 5
forward voltage VF 2 2.75 V IF = 30 A; Tj = 25 °C; Fig. 6 6
forward voltage VF 1.38 2 V IF = 30 A; Tj = 150 °C; Fig. 6 6
reverse current IR 10 μA VR = 600 V; Tj = 25 °C 6
reverse current IR 1 mA VR = 600 V; Tj = 150 °C 6
thermal resistance from junction to ambient free air Rth(j-a) 40 K/W in free air 5

CAD (KiCad official)

  • Symbol: BYC30W-600PT2Q
  • Footprint: Package_TO_SOT_THT:TO-247-2_Vertical
  • 3D model: TO-247-2 (KiCad packages3D, STEP)
  • 3D model files: byc30w-600pt2q-etched.step / byc30w-600pt2q-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); byc30w-600pt2q.step / byc30w-600pt2q.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WeEn Semiconductors datasheet (10 pp, sha256 13c0f895bf1113cb, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF