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BUF16821BIPWPR

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Texas Instruments Video Amplifiers, HTSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentoperational amplifier-comparatorbuf16821bipwprfactory-2.0.0extractor-text

Verified BUF16821BIPWPR

by Ray · last 10 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

10 Nov 2026RayPublished by the parts factory: tier mfr, 29 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BUF16821BIPWPR · HTSSOP-28-EP · 29 pins
  • ✓copper: 29 copper pads, none touching another net
  • ✓datasheet: all 29 pin names found in the 29-page datasheet
  • ✓distributor: lcsc C2870165, digikey 296-24179-2-ND, mouser 595-BUF16821BIPWPR
  • ✓family: TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-xrmxlsir/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 29 pins = 29 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 29 pins agree
  • ✓symbol_text: no pin names collide
  • ✓viewers: viewers/footprint.html 51 kB, viewers/symbol.html 21 kB
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ buf16821bipwpr.kicad_sym✓ buf16821bipwpr.kicad_mod✓ buf16821bipwpr.step
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Ray Publish 0.1.0 276f6b5 2d ago

BUF16821BIPWPR

Texas Instruments · Video Amplifiers · HTSSOP-28-EP

BUF16821BIPWPR from Texas Instruments, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCOM2 output VCOM channel 2 programmable output, rail-to-rail, able to source/sink 100mA.
2 OUT1 output DAC output 1 (gamma channel), rail-to-rail.
3 OUT2 output DAC output 2 (gamma channel), rail-to-rail.
4 OUT3 output DAC output 3 (gamma channel), rail-to-rail.
5 OUT4 output DAC output 4 (gamma channel), rail-to-rail.
6 OUT5 output DAC output 5 (gamma channel), rail-to-rail.
7 OUT6 output DAC output 6 (gamma channel), rail-to-rail.
8 GNDA power_in Analog ground; must be connected to digital ground (GNDD).
9 VS power_in Analog supply connection, operating range 9V to 20V.
10 OUT7 output DAC output 7 (gamma channel), rail-to-rail.
11 OUT8 output DAC output 8 (gamma channel), rail-to-rail.
12 OUT9 output DAC output 9 (gamma channel), rail-to-rail.
13 VSD power_in Digital supply; connect to logic supply, operating range 2.0V to 5.5V.
14 SCL input Serial clock input; open-drain, connect to pull-up resistor.
15 SDA bidirectional Serial data I/O; open-drain, connect to pull-up resistor.
16 A0 input I2C address pin; connect to either logic 1 or logic 0.
17 BKSEL input Selects memory bank; connect to logic 1 to select bank 1 or logic 0 to select bank 0.
18 GNDD power_in Digital ground; must be connected to analog ground (GNDA).
19 OUT10 output DAC output 10 (gamma channel), rail-to-rail.
20 OUT11 output DAC output 11 (gamma channel), rail-to-rail.
21 OUT12 output DAC output 12 (gamma channel), rail-to-rail.
22 OUT13 output DAC output 13 (gamma channel), rail-to-rail.
23 VS power_in Analog supply connection, operating range 9V to 20V.
24 GNDA power_in Analog ground; must be connected to digital ground (GNDD).
25 OUT14 output DAC output 14 (gamma channel), rail-to-rail.
26 OUT15 output DAC output 15 (gamma channel), rail-to-rail.
27 OUT16 output DAC output 16 (gamma channel), rail-to-rail.
28 VCOM1 output VCOM channel 1 programmable output, rail-to-rail, able to source/sink 100mA.
29 PowerPAD power_in Exposed lead-frame die pad on underside; must connect to GNDA and GNDD.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-28-EP
Category Operational Amplifier/Comparator
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Swing High 17.7 17.85 V Code = 1023, Sourcing 10mA 3
Output Swing Low 0.07 0.3 V Code = 0, Sinking 10mA 3
Continuous Output Current 30 mA Note (2) 3
Output Accuracy -50 20 50 mV 3
Output Accuracy vs Temperature -25 25 μV/°C Code 512 3
Integral Nonlinearity INL 0.3 LSB 3
Differential Nonlinearity DNL 0.3 LSB 3
Load Regulation 0.5 1.5 mV/mA Code 512 or VCC/2, IOUT = +5mA to -5mA Step 3
Analog Power Supply Operating Range VS 9 20 V 3
Total Analog Supply Current IS 12 14 mA Outputs at Reset Values, No Load 3
Total Analog Supply Current Over Temperature IS 18 mA Over temperature 3
Logic 0 Output Voltage VOL 0.15 0.4 V ISINK = 3mA 3
Input Leakage -10 0.01 10 μA 3
Clock Frequency Standard/Fast Mode fCLK 400 kHz Standard/Fast Mode 3
Clock Frequency High-Speed Mode fCLK 3.4 MHz High-Speed Mode 3
Digital Power Supply Operating Range VSD 2 5.5 V 3
Digital Supply Current ISD 115 150 μA Outputs at Reset Values, No Load, Two-Wire Bus Inactive 3
Digital Supply Current Over Temperature ISD 115 μA Over temperature 3
Specified Temperature Range -40 85 °C 3
Operating Range Junction Temperature -40 95 °C Junction temperature < +125°C 3
Storage Range -65 150 °C 3
Thermal Resistance Junction-to-Ambient θJA 40 °C/W HTSSOP-28; thermal pad attached to PCB, 0lfm airflow, 76mm × 76mm copper area 3
Supply Voltage VS 22 V 2
Supply Voltage Digital VSD 6 V 2
Digital Input Pins Voltage (SCL, SDA, AO, BKSEL) -0.5 6 V 2
Digital Input Pins Current (SCL, SDA, AO, BKSEL) -10 10 mA 2
Ambient Operating Temperature -40 95 °C 2
Ambient Storage Temperature -65 150 °C 2
Junction Temperature TJ 125 °C 2
ESD Human Body Model 3000 V HBM 2
ESD Charged Device Model 1000 V CDM 2
ESD Machine Model 200 V MM 2

CAD (KiCad official)

  • Symbol: BUF16821BIPWPR
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
  • 3D model files: buf16821bipwpr-etched.step / buf16821bipwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); buf16821bipwpr.step / buf16821bipwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (29 pp, sha256 6f35fd53b4597964, retrieved 2026-11-10, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF