BUF16821BIPWPR from Texas Instruments, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCOM2	output	VCOM channel 2 programmable output, rail-to-rail, able to source/sink 100mA.
2	OUT1	output	DAC output 1 (gamma channel), rail-to-rail.
3	OUT2	output	DAC output 2 (gamma channel), rail-to-rail.
4	OUT3	output	DAC output 3 (gamma channel), rail-to-rail.
5	OUT4	output	DAC output 4 (gamma channel), rail-to-rail.
6	OUT5	output	DAC output 5 (gamma channel), rail-to-rail.
7	OUT6	output	DAC output 6 (gamma channel), rail-to-rail.
8	GNDA	power_in	Analog ground; must be connected to digital ground (GNDD).
9	VS	power_in	Analog supply connection, operating range 9V to 20V.
10	OUT7	output	DAC output 7 (gamma channel), rail-to-rail.
11	OUT8	output	DAC output 8 (gamma channel), rail-to-rail.
12	OUT9	output	DAC output 9 (gamma channel), rail-to-rail.
13	VSD	power_in	Digital supply; connect to logic supply, operating range 2.0V to 5.5V.
14	SCL	input	Serial clock input; open-drain, connect to pull-up resistor.
15	SDA	bidirectional	Serial data I/O; open-drain, connect to pull-up resistor.
16	A0	input	I2C address pin; connect to either logic 1 or logic 0.
17	BKSEL	input	Selects memory bank; connect to logic 1 to select bank 1 or logic 0 to select bank 0.
18	GNDD	power_in	Digital ground; must be connected to analog ground (GNDA).
19	OUT10	output	DAC output 10 (gamma channel), rail-to-rail.
20	OUT11	output	DAC output 11 (gamma channel), rail-to-rail.
21	OUT12	output	DAC output 12 (gamma channel), rail-to-rail.
22	OUT13	output	DAC output 13 (gamma channel), rail-to-rail.
23	VS	power_in	Analog supply connection, operating range 9V to 20V.
24	GNDA	power_in	Analog ground; must be connected to digital ground (GNDD).
25	OUT14	output	DAC output 14 (gamma channel), rail-to-rail.
26	OUT15	output	DAC output 15 (gamma channel), rail-to-rail.
27	OUT16	output	DAC output 16 (gamma channel), rail-to-rail.
28	VCOM1	output	VCOM channel 1 programmable output, rail-to-rail, able to source/sink 100mA.
29	PowerPAD	power_in	Exposed lead-frame die pad on underside; must connect to GNDA and GNDD.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	HTSSOP-28-EP
Category	Operational Amplifier/Comparator
Pins	29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Output Swing High		17.7	17.85		V	Code = 1023, Sourcing 10mA	3
Output Swing Low			0.07	0.3	V	Code = 0, Sinking 10mA	3
Continuous Output Current				30	mA	Note (2)	3
Output Accuracy		-50	20	50	mV		3
Output Accuracy vs Temperature		-25		25	μV/°C	Code 512	3
Integral Nonlinearity	INL			0.3	LSB		3
Differential Nonlinearity	DNL			0.3	LSB		3
Load Regulation			0.5	1.5	mV/mA	Code 512 or VCC/2, IOUT = +5mA to -5mA Step	3
Analog Power Supply Operating Range	VS	9		20	V		3
Total Analog Supply Current	IS		12	14	mA	Outputs at Reset Values, No Load	3
Total Analog Supply Current Over Temperature	IS			18	mA	Over temperature	3
Logic 0 Output Voltage	VOL		0.15	0.4	V	ISINK = 3mA	3
Input Leakage		-10	0.01	10	μA		3
Clock Frequency Standard/Fast Mode	fCLK			400	kHz	Standard/Fast Mode	3
Clock Frequency High-Speed Mode	fCLK			3.4	MHz	High-Speed Mode	3
Digital Power Supply Operating Range	VSD	2		5.5	V		3
Digital Supply Current	ISD		115	150	μA	Outputs at Reset Values, No Load, Two-Wire Bus Inactive	3
Digital Supply Current Over Temperature	ISD			115	μA	Over temperature	3
Specified Temperature Range		-40		85	°C		3
Operating Range Junction Temperature		-40		95	°C	Junction temperature < +125°C	3
Storage Range		-65		150	°C		3
Thermal Resistance Junction-to-Ambient	θJA		40		°C/W	HTSSOP-28; thermal pad attached to PCB, 0lfm airflow, 76mm × 76mm copper area	3
Supply Voltage	VS			22	V		2
Supply Voltage Digital	VSD			6	V		2
Digital Input Pins Voltage (SCL, SDA, AO, BKSEL)		-0.5		6	V		2
Digital Input Pins Current (SCL, SDA, AO, BKSEL)		-10		10	mA		2
Ambient Operating Temperature		-40		95	°C		2
Ambient Storage Temperature		-65		150	°C		2
Junction Temperature	TJ			125	°C		2
ESD Human Body Model				3000	V	HBM	2
ESD Charged Device Model				1000	V	CDM	2
ESD Machine Model				200	V	MM	2

CAD (KiCad official)

Symbol: BUF16821BIPWPR
Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
3D model files: buf16821bipwpr-etched.step / buf16821bipwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); buf16821bipwpr.step / buf16821bipwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (29 pp, sha256 6f35fd53b4597964, retrieved 2026-11-10, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

BUF16821BIPWPR

Verified BUF16821BIPWPR

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README