component
BSS308PEH6327
Public Made by Adomby adom
Infineon Technologies MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BSS308PEH6327
Infineon Technologies · MOSFETs · SOT-23
BSS308PEH6327 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel enhancement-mode MOSFET, logic level (4.5 V rated), ESD protected (HBM class 2), with VGS maximum ±20 V and VGS(th) -1.0 to -2.0 V. |
| 2 | S | passive | Source of the P-channel MOSFET, connected to the body diode, with continuous diode forward current IS of -0.4 A. |
| 3 | D | passive | Drain of the P-channel MOSFET, rated VDS -30 V, continuous ID -2.0 A at TA=25 °C and RDS(on) max 80 mΩ at VGS=-10 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOT-23 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating and storage temperature | Tj, Tstg | -55 | 150 | °C | 1 | ||
| Gate source voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous drain current | ID | -2 | A | TA=25 °C | 1 | ||
| Continuous drain current | ID | -1.6 | A | TA=70 °C | 1 | ||
| Pulsed drain current | ID,pulse | -8 | A | TA=25 °C | 1 | ||
| Avalanche energy, single pulse | EAS | -10.7 | mJ | ID=-2 A, RGS=25 Ω | 1 | ||
| Reverse diode dv/dt | dv/dt | 6 | kV/µs | ID=-2 A, VDS=-16V, di/dt=-200A/µs, Tj,max=150 °C | 1 | ||
| Power dissipation | Ptot | 0.5 | W | TA=25 °C | 1 | ||
| Soldering temperature | 260 | °C | 1 | ||||
| Thermal resistance, junction - ambient | RthJA | 250 | K/W | minimal footprint | 2 | ||
| Drain-source breakdown voltage | V(BR)DSS | -30 | V | VGS=0V, ID=-250µA | 2 | ||
| Gate threshold voltage | VGS(th) | -2 | -1.5 | -1 | V | VDS=VGS, ID=-11µA | 2 |
| Drain-source leakage current | IDSS | -1 | µA | VDS=-30V, VGS=0 V, Tj=25 °C | 2 | ||
| Drain-source leakage current | IDSS | -100 | μA | VDS=-30V, VGS=0V, Tj=150 °C | 2 | ||
| Gate-source leakage current | IGSS | -5 | µA | VGS=-20V, VDS=0V | 2 | ||
| Drain-source on-state resistance | RDS(on) | 88 | 130 | mΩ | VGS=-4.5 V, ID=-1.7 A | 2 | |
| Drain-source on-state resistance | RDS(on) | 62 | 80 | mΩ | VGS=-10 V, ID=-2 A | 2 | |
| Diode continuous forward current | IS | -0.4 | A | 3 | |||
| Diode pulse current | IS,pulse | -8.4 | A | 3 | |||
| Input capacitance | Ciss | 376 | 500 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 | |
| Output capacitance | Coss | 196 | 261 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 | |
| Reverse transfer capacitance | Crss | 12 | 18 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 | |
| Diode forward voltage | VSD | -0.8 | -1.1 | V | VGS=0 V, IF=-2 A, Tj=25 °C | 3 | |
| Transconductance | gfs | 4.6 | S | /VDS/>2/ID/RDS(on)max, ID=-1.6 A | 2 | ||
| Turn-on delay time | td(on) | 5.6 | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 | ||
| Rise time | tr | 7.7 | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 | ||
| Turn-off delay time | td(off) | 15.3 | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 | ||
| Fall time | tf | 2.8 | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 | ||
| Gate to source charge | Qgs | -1.2 | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 | ||
| Gate to drain charge | Qgd | -0.6 | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 | ||
| Gate charge total | Qg | -5 | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 | ||
| Gate plateau voltage | Vplateau | -3.1 | V | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 | ||
| Reverse recovery time | trr | 14 | ns | VR=10 V, IF=-2 A, diF/dt=100 A/µs, TA=25 °C | 3 | ||
| Reverse recovery charge | Qrr | -5.9 | nC | VR=10 V, IF=-2 A, diF/dt=100 A/µs, TA=25 °C | 3 |
CAD (KiCad official)
- Symbol:
BSS308PEH6327 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bss308peh6327-etched.step/bss308peh6327-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bss308peh6327.step/bss308peh6327.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (9 pp, sha256
5d989dba6a41c2be, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BSS308PEH6327
**Infineon Technologies** · MOSFETs · SOT-23
BSS308PEH6327 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel enhancement-mode MOSFET, logic level (4.5 V rated), ESD protected (HBM class 2), with VGS maximum ±20 V and VGS(th) -1.0 to -2.0 V. |
| 2 | S | passive | Source of the P-channel MOSFET, connected to the body diode, with continuous diode forward current IS of -0.4 A. |
| 3 | D | passive | Drain of the P-channel MOSFET, rated VDS -30 V, continuous ID -2.0 A at TA=25 °C and RDS(on) max 80 mΩ at VGS=-10 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOT-23 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating and storage temperature | Tj, Tstg | -55 | | 150 | °C | | 1 |
| Gate source voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous drain current | ID | | | -2 | A | TA=25 °C | 1 |
| Continuous drain current | ID | | | -1.6 | A | TA=70 °C | 1 |
| Pulsed drain current | ID,pulse | | | -8 | A | TA=25 °C | 1 |
| Avalanche energy, single pulse | EAS | | | -10.7 | mJ | ID=-2 A, RGS=25 Ω | 1 |
| Reverse diode dv/dt | dv/dt | | | 6 | kV/µs | ID=-2 A, VDS=-16V, di/dt=-200A/µs, Tj,max=150 °C | 1 |
| Power dissipation | Ptot | | | 0.5 | W | TA=25 °C | 1 |
| Soldering temperature | | | | 260 | °C | | 1 |
| Thermal resistance, junction - ambient | RthJA | | | 250 | K/W | minimal footprint | 2 |
| Drain-source breakdown voltage | V(BR)DSS | -30 | | | V | VGS=0V, ID=-250µA | 2 |
| Gate threshold voltage | VGS(th) | -2 | -1.5 | -1 | V | VDS=VGS, ID=-11µA | 2 |
| Drain-source leakage current | IDSS | | | -1 | µA | VDS=-30V, VGS=0 V, Tj=25 °C | 2 |
| Drain-source leakage current | IDSS | | | -100 | μA | VDS=-30V, VGS=0V, Tj=150 °C | 2 |
| Gate-source leakage current | IGSS | | | -5 | µA | VGS=-20V, VDS=0V | 2 |
| Drain-source on-state resistance | RDS(on) | | 88 | 130 | mΩ | VGS=-4.5 V, ID=-1.7 A | 2 |
| Drain-source on-state resistance | RDS(on) | | 62 | 80 | mΩ | VGS=-10 V, ID=-2 A | 2 |
| Diode continuous forward current | IS | | | -0.4 | A | | 3 |
| Diode pulse current | IS,pulse | | | -8.4 | A | | 3 |
| Input capacitance | Ciss | | 376 | 500 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 |
| Output capacitance | Coss | | 196 | 261 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 |
| Reverse transfer capacitance | Crss | | 12 | 18 | pF | VGS=0 V, VDS=-15 V, f=1 MHz | 3 |
| Diode forward voltage | VSD | | -0.8 | -1.1 | V | VGS=0 V, IF=-2 A, Tj=25 °C | 3 |
| Transconductance | gfs | | 4.6 | | S | /VDS/>2/ID/RDS(on)max, ID=-1.6 A | 2 |
| Turn-on delay time | td(on) | | 5.6 | | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 |
| Rise time | tr | | 7.7 | | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 |
| Turn-off delay time | td(off) | | 15.3 | | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 |
| Fall time | tf | | 2.8 | | ns | VDD=-15V, VGS=-10 V, ID=-2 A, RG=6 Ω | 3 |
| Gate to source charge | Qgs | | -1.2 | | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 |
| Gate to drain charge | Qgd | | -0.6 | | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 |
| Gate charge total | Qg | | -5 | | nC | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 |
| Gate plateau voltage | Vplateau | | -3.1 | | V | VDD=-15 V, ID=-2 A, VGS=0 to -10 V | 3 |
| Reverse recovery time | trr | | 14 | | ns | VR=10 V, IF=-2 A, diF/dt=100 A/µs, TA=25 °C | 3 |
| Reverse recovery charge | Qrr | | -5.9 | | nC | VR=10 V, IF=-2 A, diF/dt=100 A/µs, TA=25 °C | 3 |
## CAD (KiCad official)
- Symbol: `BSS308PEH6327`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bss308peh6327-etched.step` / `bss308peh6327-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bss308peh6327.step` / `bss308peh6327.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Infineon Technologies datasheet](docs/bss308peh6327-datasheet.pdf) (9 pp, sha256 `5d989dba6a41c2be`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bss308peh6327-datasheet.pdf)