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BSS308PE

UMW · MOSFETs · SOT-23

BSS308PE from UMW, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input GATE terminal; the datasheet states the device operates with gate voltages as low as 2.5V and the gate-source voltage is rated at ±20V.
2 S passive SOURCE terminal of the P-channel MOSFET, part of the device rated at VDS = -30V.
3 D passive DRAIN terminal of the P-channel MOSFET; the datasheet rates continuous drain current ID at -2 A at TA=25°C.

Key specifications

Parameter Value
Manufacturer UMW
Package SOT-23
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS -30 V VGS=0V, ID=-250µA 2
Gate threshold voltage VGS(th) -1 -1.5 -2 V VDS=VGS, ID=-11µA 2
Drain-source leakage current IDSS -1 μA VDS=-30V,VGS=0V,TJ=25°C 2
Gate-source leakage current IGSS -100 nA VGS=-20V, VDS=0V 2
Drain-source on-state resistance RDS(on) 90 mΩ VGS=-4.5V, ID=-1.7A 2
Drain-source on-state resistance RDS(on) 70 mΩ VGS=-10V, ID=-2A 2
Input capacitance Ciss 376 500 pF VDS=0V, VGS=-15V, f=1MHz 3
Output capacitance Coss 196 261 pF VDS=0V, VGS=-15V, f=1MHz 3
Reverse transfer capacitance Crss 12 18 pF VDS=0V, VGS=-15V, f=1MHz 3
Diode forward voltage VSD -1.1 V VGS=0V, IF=-2V, TJ=25°C 3
Drain current (TA=25°C) ID -2 A TA=25 °C 1
Drain current (TA=70°C) ID -1.6 A TA=70 °C 1
Pulsed drain current ID, pulse -8 A TA=25 °C 1
Avalanche energy, single pulse EAS -10.7 mJ ID=-2 A, RGS=25 Ω 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 0.5 W TA=25 °C 1
Operating and storage temperature TJ, TSTG -55 150 °C 1
Reverse diode dv/dt dv/dt 6 kV/µs ID=-2 A, VDS=-16V; di/dt=-200A/µs, Tj,max=150 °C 1
Soldering temperature 260 °C 1
Thermal resistance, junction - ambient (minimal footprint) RthJA 250 K/W minimal footprint 2
Thermal resistance, junction - ambient (40mm² FR4 PCB) RthJA 62 K/W Performed on 40mm² FR4 PCB (footnote 1) 2

CAD (KiCad official)

  • Symbol: BSS308PE
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss308pe-etched.step / bss308pe-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss308pe.step / bss308pe.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (10 pp, sha256 7ba470bbb0d70162, retrieved 2026-11-12, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF