component
BSS138BK
Public Made by Adomby adom
Nexperia MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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bss138bk: specified limits as data (metadata.characteristics, 31 rows from the datasheet)
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27d ago
BSS138BK
Nexperia · MOSFETs · SOT-23
BSS138BK from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate control terminal; gate-source voltage range -20 V to +20 V |
| 2 | S | passive | Source terminal of the N-channel MOSFET |
| 3 | D | passive | Drain terminal; maximum drain-source voltage 60 V, maximum drain current 360 mA at VGS = 10 V and Tamb = 25 °C |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 60 | V | Tj = 25 °C | 3 | ||
| Gate-source voltage | VGS | -20 | 20 | V | 3 | ||
| Drain current | ID | 360 | mA | VGS = 10 V; Tamb = 25 °C; footnote [1] | 3 | ||
| Drain current | ID | 230 | mA | VGS = 10 V; Tamb = 100 °C; footnote [1] | 3 | ||
| Peak drain current | IDM | 1.2 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 | ||
| Total power dissipation | Ptot | 350 | mW | Tamb = 25 °C; footnote [2] | 3 | ||
| Total power dissipation | Ptot | 420 | mW | footnote [1] | 3 | ||
| Total power dissipation | Ptot | 1140 | mW | Tsp = 25 °C | 3 | ||
| Junction temperature | Tj | -55 | 150 | °C | 3 | ||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Source current (source-drain diode) | IS | 360 | mA | Tamb = 25 °C; footnote [1] | 3 | ||
| Electrostatic discharge voltage | VESD | 1500 | V | HBM; footnote [3]: measured between all pins | 3 | ||
| Thermal resistance junction to ambient | Rth(j-a) | 310 | 370 | K/W | in free air; footnote [1]: FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 | |
| Thermal resistance junction to ambient | Rth(j-a) | 260 | 300 | K/W | footnote [2]: FR4 PCB, mounting pad for drain 1 cm2 | 4 | |
| Thermal resistance junction to solder point | Rth(j-sp) | 115 | K/W | 4 | |||
| Drain-source breakdown voltage | V(BR)DSS | 60 | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 | ||
| Gate-source threshold voltage | VGSth | 0.48 | 1.1 | 1.6 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 | ||
| Drain leakage current | IDSS | 10 | µA | VDS = 60 V; VGS = 0 V; Tj = 150 °C | 6 | ||
| Gate leakage current | IGSS | 10 | µA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | 1 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Drain-source on-state resistance | RDSon | 1 | 1.6 | Ω | VGS = 10 V; ID = 350 mA; Tj = 25 °C | 6 | |
| Drain-source on-state resistance | RDSon | 2 | 3.2 | Ω | VGS = 10 V; ID = 350 mA; Tj = 150 °C | 6 | |
| Drain-source on-state resistance | RDSon | 1.1 | 2.2 | Ω | VGS = 4.5 V; ID = 200 mA; Tj = 25 °C | 6 | |
| Drain-source on-state resistance | RDSon | 1.4 | 6.5 | Ω | VGS = 2.5 V; ID = 10 mA; Tj = 25 °C | 6 | |
| Total gate charge | QG(tot) | 0.6 | 0.7 | nC | VDS = 30 V; ID = 300 mA; VGS = 4.5 V; Tj = 25 °C | 6 | |
| Input capacitance | Ciss | 42 | 56 | pF | VDS = 10 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 | |
| Turn-on delay time | td(on) | 5 | 10 | ns | VDS = 40 V; RL = 250 Ω; VGS = 10 V; RG(ext) = 6 Ω; Tj = 25 °C | 6 | |
| Turn-off delay time | td(off) | 38 | 76 | ns | 6 | ||
| Source-drain voltage | VSD | 0.47 | 0.8 | 1.2 | V | IS = 300 mA; VGS = 0 V; Tj = 25 °C | 6 |
CAD (KiCad official)
- Symbol:
BSS138BK - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bss138bk-etched.step/bss138bk-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bss138bk.step/bss138bk.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (16 pp, sha256
7ee99c2ff94d07a9, retrieved 2026-09-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BSS138BK
**Nexperia** · MOSFETs · SOT-23
BSS138BK from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate control terminal; gate-source voltage range -20 V to +20 V |
| 2 | S | passive | Source terminal of the N-channel MOSFET |
| 3 | D | passive | Drain terminal; maximum drain-source voltage 60 V, maximum drain current 360 mA at VGS = 10 V and Tamb = 25 °C |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | | | 60 | V | Tj = 25 °C | 3 |
| Gate-source voltage | VGS | -20 | | 20 | V | | 3 |
| Drain current | ID | | | 360 | mA | VGS = 10 V; Tamb = 25 °C; footnote [1] | 3 |
| Drain current | ID | | | 230 | mA | VGS = 10 V; Tamb = 100 °C; footnote [1] | 3 |
| Peak drain current | IDM | | | 1.2 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot | | | 350 | mW | Tamb = 25 °C; footnote [2] | 3 |
| Total power dissipation | Ptot | | | 420 | mW | footnote [1] | 3 |
| Total power dissipation | Ptot | | | 1140 | mW | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 | | 150 | °C | | 3 |
| Ambient temperature | Tamb | -55 | | 150 | °C | | 3 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 3 |
| Source current (source-drain diode) | IS | | | 360 | mA | Tamb = 25 °C; footnote [1] | 3 |
| Electrostatic discharge voltage | VESD | | | 1500 | V | HBM; footnote [3]: measured between all pins | 3 |
| Thermal resistance junction to ambient | Rth(j-a) | | 310 | 370 | K/W | in free air; footnote [1]: FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 |
| Thermal resistance junction to ambient | Rth(j-a) | | 260 | 300 | K/W | footnote [2]: FR4 PCB, mounting pad for drain 1 cm2 | 4 |
| Thermal resistance junction to solder point | Rth(j-sp) | | | 115 | K/W | | 4 |
| Drain-source breakdown voltage | V(BR)DSS | 60 | | | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| Gate-source threshold voltage | VGSth | 0.48 | 1.1 | 1.6 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | | | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | | | 10 | µA | VDS = 60 V; VGS = 0 V; Tj = 150 °C | 6 |
| Gate leakage current | IGSS | | | 10 | µA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS | | | 1 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon | | 1 | 1.6 | Ω | VGS = 10 V; ID = 350 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon | | 2 | 3.2 | Ω | VGS = 10 V; ID = 350 mA; Tj = 150 °C | 6 |
| Drain-source on-state resistance | RDSon | | 1.1 | 2.2 | Ω | VGS = 4.5 V; ID = 200 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon | | 1.4 | 6.5 | Ω | VGS = 2.5 V; ID = 10 mA; Tj = 25 °C | 6 |
| Total gate charge | QG(tot) | | 0.6 | 0.7 | nC | VDS = 30 V; ID = 300 mA; VGS = 4.5 V; Tj = 25 °C | 6 |
| Input capacitance | Ciss | | 42 | 56 | pF | VDS = 10 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Turn-on delay time | td(on) | | 5 | 10 | ns | VDS = 40 V; RL = 250 Ω; VGS = 10 V; RG(ext) = 6 Ω; Tj = 25 °C | 6 |
| Turn-off delay time | td(off) | | 38 | 76 | ns | | 6 |
| Source-drain voltage | VSD | 0.47 | 0.8 | 1.2 | V | IS = 300 mA; VGS = 0 V; Tj = 25 °C | 6 |
## CAD (KiCad official)
- Symbol: `BSS138BK`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bss138bk-etched.step` / `bss138bk-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bss138bk.step` / `bss138bk.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://assets.nexperia.com/documents/data-sheet/BSS138BK.pdf) (16 pp, sha256 `7ee99c2ff94d07a9`, retrieved 2026-09-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bss138bk-datasheet.pdf)