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docs bss138bk: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
viewers bss138bk: viewers · Ray 1mo ago
bss138bk-etched.fit.json bss138bk: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
bss138bk-etched.glb bss138bk: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
bss138bk-etched.step bss138bk: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
bss138bk.glb Publish 0.1.0 · Ray 1mo ago
bss138bk.kicad_mod Publish 0.1.0 · Ray 1mo ago
bss138bk.kicad_sym Publish 0.1.0 · Ray 1mo ago
bss138bk.lbr Publish 0.1.0 · Ray 1mo ago
bss138bk.step Publish 0.1.0 · Ray 1mo ago
package.json bss138bk: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 1mo ago
page.json bss138bk: specified limits as data (metadata.characteristics, 31 rows from the datasheet) · Ray 27d ago
README.md bss138bk: specified limits as data (metadata.characteristics, 31 rows from the datasheet) · Ray 27d ago

BSS138BK

Nexperia · MOSFETs · SOT-23

BSS138BK from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate control terminal; gate-source voltage range -20 V to +20 V
2 S passive Source terminal of the N-channel MOSFET
3 D passive Drain terminal; maximum drain-source voltage 60 V, maximum drain current 360 mA at VGS = 10 V and Tamb = 25 °C

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 60 V Tj = 25 °C 3
Gate-source voltage VGS -20 20 V 3
Drain current ID 360 mA VGS = 10 V; Tamb = 25 °C; footnote [1] 3
Drain current ID 230 mA VGS = 10 V; Tamb = 100 °C; footnote [1] 3
Peak drain current IDM 1.2 A Tamb = 25 °C; single pulse; tp ≤ 10 µs 3
Total power dissipation Ptot 350 mW Tamb = 25 °C; footnote [2] 3
Total power dissipation Ptot 420 mW footnote [1] 3
Total power dissipation Ptot 1140 mW Tsp = 25 °C 3
Junction temperature Tj -55 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Source current (source-drain diode) IS 360 mA Tamb = 25 °C; footnote [1] 3
Electrostatic discharge voltage VESD 1500 V HBM; footnote [3]: measured between all pins 3
Thermal resistance junction to ambient Rth(j-a) 310 370 K/W in free air; footnote [1]: FR4 PCB, single-sided copper, tin-plated, standard footprint 4
Thermal resistance junction to ambient Rth(j-a) 260 300 K/W footnote [2]: FR4 PCB, mounting pad for drain 1 cm2 4
Thermal resistance junction to solder point Rth(j-sp) 115 K/W 4
Drain-source breakdown voltage V(BR)DSS 60 V ID = 250 µA; VGS = 0 V; Tj = 25 °C 6
Gate-source threshold voltage VGSth 0.48 1.1 1.6 V ID = 250 µA; VDS = VGS; Tj = 25 °C 6
Drain leakage current IDSS 1 µA VDS = 60 V; VGS = 0 V; Tj = 25 °C 6
Drain leakage current IDSS 10 µA VDS = 60 V; VGS = 0 V; Tj = 150 °C 6
Gate leakage current IGSS 10 µA VGS = 20 V; VDS = 0 V; Tj = 25 °C 6
Gate leakage current IGSS 1 µA VGS = 10 V; VDS = 0 V; Tj = 25 °C 6
Drain-source on-state resistance RDSon 1 1.6 Ω VGS = 10 V; ID = 350 mA; Tj = 25 °C 6
Drain-source on-state resistance RDSon 2 3.2 Ω VGS = 10 V; ID = 350 mA; Tj = 150 °C 6
Drain-source on-state resistance RDSon 1.1 2.2 Ω VGS = 4.5 V; ID = 200 mA; Tj = 25 °C 6
Drain-source on-state resistance RDSon 1.4 6.5 Ω VGS = 2.5 V; ID = 10 mA; Tj = 25 °C 6
Total gate charge QG(tot) 0.6 0.7 nC VDS = 30 V; ID = 300 mA; VGS = 4.5 V; Tj = 25 °C 6
Input capacitance Ciss 42 56 pF VDS = 10 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C 6
Turn-on delay time td(on) 5 10 ns VDS = 40 V; RL = 250 Ω; VGS = 10 V; RG(ext) = 6 Ω; Tj = 25 °C 6
Turn-off delay time td(off) 38 76 ns 6
Source-drain voltage VSD 0.47 0.8 1.2 V IS = 300 mA; VGS = 0 V; Tj = 25 °C 6

CAD (KiCad official)

  • Symbol: BSS138BK
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss138bk-etched.step / bss138bk-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss138bk.step / bss138bk.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (16 pp, sha256 7ee99c2ff94d07a9, retrieved 2026-09-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF