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BSP315P

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UMW MOSFETs, SOT-223. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BSP315P

UMW · MOSFETs · SOT-223

BSP315P from UMW, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input GATE: gate-source voltage is rated ±20 V (VGS absolute maximum), and the device is an enhancement-mode, logic-level type with VGS(th) of -1 V to -2 V at VDS = VGS, ID = -160 µA.
2 D passive DRAIN: continuous drain current is -1.17 A at TA = 25 °C (-0.94 A at TA = 70 °C) for a -60 V P-channel device, with pulsed drain current -4.68 A.
3 S passive SOURCE: the body reverse diode has a continuous forward current IS of -1.17 A and a pulsed current of -4.68 A.

Key specifications

Parameter Value
Manufacturer UMW
Package SOT-223
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS -60 V VGS=0V, ID=-250μA 3
Gate threshold voltage VGS(th) -1 -1.5 -2 V VDS=VGS, ID=-160μA 3
Zero gate voltage drain current (TJ=25°C) IDSS -0.1 -1 µA VDS=-60V, VGS=0V, TJ=25°C 3
Zero gate voltage drain current (TJ=125°C) IDSS -10 -100 µA VDS=-60V, VGS=0V, TJ=125°C 3
Gate-source leakage current IGSS -10 -100 nA VGS=-20V, VDS=0V 3
Drain-source on-state resistance (VGS=-4.5V) RDS(ON) 0.8 1.4 Ω VGS=-4.5V, ID=-0.89A 3
Drain-source on-state resistance (VGS=-10V) RDS(ON) 0.5 0.8 Ω VGS=-10V, ID=-1.17A 3
Transconductance gFS 0.7 1.4 S VDS≤2IDRDS(ON)max, ID=-0.89A 3
Input capacitance Ciss 130 160 pF VGS=0V, VDS=-25V, f=1MHz 3
Output capacitance Coss 40 50 pF VGS=0V, VDS=-25V, f=1MHz 3
Reverse transfer capacitance Crss 17 21 pF VGS=0V, VDS=-25V, f=1MHz 3
Turn-on delay time tD(on) 9 14 ns VDD=-30V, VGS=-4.5V; ID=-0.89A, RG=18Ω 3
Rise time tr 24 36 ns VDD=-30V, VGS=-4.5V; ID=-0.89A, RG=18Ω 3
Turn-off delay time tD(off) 32 48 ns VDD=-30V, VGS=-4.5V; ID=-0.89A, RG=18Ω 3
Fall time tf 19 28 ns VDD=-30V, VGS=-4.5V; ID=-0.89A, RG=18Ω 3
Gate to source charge Qgs 0.7 1.1 nC VDD=-48V, ID=-1.17A, VGS=0 to -10V 3
Gate to drain charge Qgd 1.8 2.6 nC VDD=-48V, ID=-1.17A, VGS=0 to -10V 3
Gate charge total Qg 5.2 7.8 nC VDD=-48V, ID=-1.17A, VGS=0 to -10V 3
Inverse diode continuous forward current IS -0.97 -1.17 A TA=25°C 4
Inverse diode direct current, pulsed IS,pulse -4.68 A TA=25°C 4
Inverse diode forward voltage VSD -1.3 V VGS=0 V, IF=-1.17A 4
Reverse recovery time trr 30.5 46 ns VR=-30V, IF=IS, diF/dt=100A/µs 4
Reverse recovery charge Qrr 36 54 µC VR=-30V, IF=IS, diF/dt=100A/µs 4
Continuous drain current (TA=25°C) ID -1.17 A TA=25°C 1
Continuous drain current (TA=70°C) ID -0.94 A TA=70°C 1
Pulsed drain current ID,pulse -4.68 A TA=25°C 1
Avalanche energy, single pulse EAS 24 mJ ID=-1.17A, VDD=-25V, RGS=25Ω 1
Avalanche energy, periodic limited by Tjmax EAR 0.18 mJ 1
Reverse diode dv/dt dv/dt -6 kV/µs IS=-1.17A, VDS=-48V, di/dt=200A/µs, Tjmax=150°C 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 1.8 W 1
Operating and storage temperature TJ,TSTG -55 150 °C 1
Thermal resistance, junction - soldering point (Pin 4) RthJS 25 K/W Junction - soldering point (Pin 4) 2
Thermal resistance, junction - ambient (SMD, min. footprint) RthJA 115 K/W SMD version, device on PCB: @ min. footprint 2
Thermal resistance, junction - ambient (SMD, 6 cm2 cooling area) RthJA 70 K/W SMD version, device on PCB: @ 6 cm2 cooling area 2

CAD (KiCad official)

  • Symbol: BSP315P
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: bsp315p-etched.step / bsp315p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bsp315p.step / bsp315p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (11 pp, sha256 68d149e9bdf2fc43, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF