# BSN20BKR

**Nexperia** · MOSFETs · SOT-23

BSN20BKR from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; control input with VGS = -20 to 20 V (Tj = 25 °C) and gate-source threshold voltage VGS(th) = 0.6 to 1.4 V. |
| 2 | S | passive | Source terminal; includes intrinsic body diode with maximum source current IS = 200 mA at Tamb = 25 °C. |
| 3 | D | passive | Drain terminal; absolute maximum drain-source voltage VDS = 60 V and continuous drain current ID = 265 mA at Tamb = 25 °C on FR4 PCB. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS |  |  | 60 | V |  | 3 |
| Gate-source voltage | VGS | -20 |  | 20 | V | Tj = 25 °C | 3 |
| Drain current | ID |  |  | 265 | mA | VGS = 10 V; Tamb = 25 °C [1] | 3 |
| Drain current | ID |  |  | 170 | mA | VGS = 10 V; Tamb = 100 °C [1] | 3 |
| Drain current | ID |  |  | 330 | mA | VGS = 10 V; Tsp = 25 °C | 3 |
| Peak drain current | IDM |  |  | 0.9 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot |  |  | 310 | mW | Tamb = 25 °C [2] | 3 |
| Total power dissipation | Ptot |  |  | 402 | mW | [1] | 3 |
| Total power dissipation | Ptot |  |  | 1672 | mW | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 |  | 150 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Source current (source-drain diode) | IS |  |  | 200 | mA | Tamb = 25 °C [1] | 3 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 351 | 404 | K/W | in free air [1] | 4 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 271 | 311 | K/W | [2] | 4 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 210 | 241 | K/W | t ≤ 5 s [2] | 4 |
| Thermal resistance from junction to solder point | Rth(j-sp) |  | 65 | 75 | K/W |  | 4 |
| Drain-source breakdown voltage | V(BR)DSS | 60 |  |  | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| Gate-source threshold voltage | VGSth | 0.6 | 1 | 1.4 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS |  |  | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | 10 | µA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | -10 | µA | VGS = -20 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | 1 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | -1 | µA | VGS = -10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | 0.3 | µA | VGS = 5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | -0.3 | µA | VGS = -5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 2.1 | 2.8 | Ω | VGS = 10 V; ID = 200 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 4.3 | 5.7 | Ω | VGS = 10 V; ID = 200 mA; Tj = 150 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 2.2 | 3.2 | Ω | VGS = 5 V; ID = 200 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 2.6 | 4 | Ω | VGS = 2.5 V; ID = 75 mA; Tj = 25 °C | 6 |
| Output capacitance | Coss |  | 3.1 | 10 | pF | VDS = 30 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Reverse transfer capacitance | Crss |  | 2 | 7 | pF | VDS = 30 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Source-drain voltage | VSD |  | 0.86 | 1.2 | V | IS = 200 mA; VGS = 0 V; Tj = 25 °C | 6 |

## CAD (KiCad official)

- Symbol: `BSN20BKR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bsn20bkr-etched.step` / `bsn20bkr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsn20bkr.step` / `bsn20bkr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586181897756291072) (16 pp, sha256 `995e2719cc48f1fb`, retrieved 2026-09-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bsn20bkr-datasheet.pdf)