component
BSH205G2AR
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Nexperia MOSFETs, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BSH205G2AR
Nexperia · MOSFETs · TO-236AB
BSH205G2AR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits the gate-source voltage VGS to -8 V to 8 V at Tj = 25 °C. |
| 2 | S | passive | Source terminal; the datasheet limits the source current IS to -1.2 A at Tamb = 25 °C. |
| 3 | D | passive | Drain terminal; the datasheet limits the drain-source voltage VDS to -20 V and the continuous drain current ID to -2.6 A at Tamb = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| drain-source voltage | VDS | -20 | V | 3 | |||
| gate-source voltage | VGS | -8 | 8 | V | Tj = 25 °C | 3 | |
| drain current | ID | -2.6 | A | VGS = -4.5 V; Tamb = 25 °C | 3 | ||
| drain current | ID | -1.6 | A | VGS = -4.5 V; Tamb = 100 °C | 3 | ||
| peak drain current | IDM | -10 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 | ||
| total power dissipation | Ptot | 610 | mW | Tamb = 25 °C; FR4 PCB, standard footprint | 3 | ||
| total power dissipation | Ptot | 1.3 | W | FR4 PCB, mounting pad for drain 6 cm2 | 3 | ||
| total power dissipation | Ptot | 10 | W | Tsp = 25 °C | 3 | ||
| junction temperature | Tj | -55 | 175 | °C | 3 | ||
| ambient temperature | Tamb | -55 | 175 | °C | 3 | ||
| storage temperature | Tstg | -65 | 175 | °C | 3 | ||
| source current | IS | -1.2 | A | Tamb = 25 °C | 3 | ||
| non-repetitive drain-source avalanche energy | EDS(AL)S | 5 | mJ | Tj(init) = 25 °C; ID = -0.5 A; DUT in avalanche (unclamped) | 3 | ||
| drain-source breakdown voltage | V(BR)DSS | -20 | V | ID = -250 µA; VGS = 0 V; Tj = 25 °C | 6 | ||
| gate-source threshold voltage | VGSth | -0.4 | -0.65 | -0.9 | V | ID = -250 µA; VDS = VGS; Tj = 25 °C | 6 |
| drain leakage current | IDSS | -1 | µA | VDS = -20 V; VGS = 0 V; Tj = 25 °C | 6 | ||
| gate leakage current | IGSS | -100 | nA | VGS = -8 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| gate leakage current | IGSS | 100 | nA | VGS = 8 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| drain-source on-state resistance | RDSon | 97 | 118 | mΩ | VGS = -4.5 V; ID = -2.6 A; Tj = 25 °C | 6 | |
| drain-source on-state resistance | RDSon | 153 | 186 | mΩ | VGS = -4.5 V; ID = -2.6 A; Tj = 175 °C | 6 | |
| drain-source on-state resistance | RDSon | 118 | 152 | mΩ | VGS = -2.5 V; ID = -2.3 A; Tj = 25 °C | 6 | |
| drain-source on-state resistance | RDSon | 145 | 240 | mΩ | VGS = -1.8 V; ID = -0.5 A; Tj = 25 °C | 6 | |
| drain-source on-state resistance | RDSon | 170 | 400 | mΩ | VGS = -1.5 V; ID = -0.1 A; Tj = 25 °C | 6 | |
| source-drain voltage | VSD | -0.8 | -1.2 | V | IS = -1.2 A; VGS = 0 V; Tj = 25 °C | 6 | |
| thermal resistance from junction to ambient | Rth(j-a) | 218 | 250 | K/W | in free air; FR4 PCB, standard footprint | 5 | |
| thermal resistance from junction to ambient | Rth(j-a) | 97 | 114 | K/W | FR4 PCB, mounting pad for drain 6 cm2 | 5 | |
| thermal resistance from junction to solder point | Rth(j-sp) | 10 | 15 | K/W | 5 |
CAD (KiCad official)
- Symbol:
BSH205G2AR - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files:
bsh205g2ar-etched.step/bsh205g2ar-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsh205g2ar.step/bsh205g2ar.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (15 pp, sha256
1209173b1f0e5dc1, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BSH205G2AR
**Nexperia** · MOSFETs · TO-236AB
BSH205G2AR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits the gate-source voltage VGS to -8 V to 8 V at Tj = 25 °C. |
| 2 | S | passive | Source terminal; the datasheet limits the source current IS to -1.2 A at Tamb = 25 °C. |
| 3 | D | passive | Drain terminal; the datasheet limits the drain-source voltage VDS to -20 V and the continuous drain current ID to -2.6 A at Tamb = 25 °C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| drain-source voltage | VDS | | | -20 | V | | 3 |
| gate-source voltage | VGS | -8 | | 8 | V | Tj = 25 °C | 3 |
| drain current | ID | | | -2.6 | A | VGS = -4.5 V; Tamb = 25 °C | 3 |
| drain current | ID | | | -1.6 | A | VGS = -4.5 V; Tamb = 100 °C | 3 |
| peak drain current | IDM | | | -10 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| total power dissipation | Ptot | | | 610 | mW | Tamb = 25 °C; FR4 PCB, standard footprint | 3 |
| total power dissipation | Ptot | | | 1.3 | W | FR4 PCB, mounting pad for drain 6 cm2 | 3 |
| total power dissipation | Ptot | | | 10 | W | Tsp = 25 °C | 3 |
| junction temperature | Tj | -55 | | 175 | °C | | 3 |
| ambient temperature | Tamb | -55 | | 175 | °C | | 3 |
| storage temperature | Tstg | -65 | | 175 | °C | | 3 |
| source current | IS | | | -1.2 | A | Tamb = 25 °C | 3 |
| non-repetitive drain-source avalanche energy | EDS(AL)S | | | 5 | mJ | Tj(init) = 25 °C; ID = -0.5 A; DUT in avalanche (unclamped) | 3 |
| drain-source breakdown voltage | V(BR)DSS | -20 | | | V | ID = -250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| gate-source threshold voltage | VGSth | -0.4 | -0.65 | -0.9 | V | ID = -250 µA; VDS = VGS; Tj = 25 °C | 6 |
| drain leakage current | IDSS | | | -1 | µA | VDS = -20 V; VGS = 0 V; Tj = 25 °C | 6 |
| gate leakage current | IGSS | | | -100 | nA | VGS = -8 V; VDS = 0 V; Tj = 25 °C | 6 |
| gate leakage current | IGSS | | | 100 | nA | VGS = 8 V; VDS = 0 V; Tj = 25 °C | 6 |
| drain-source on-state resistance | RDSon | | 97 | 118 | mΩ | VGS = -4.5 V; ID = -2.6 A; Tj = 25 °C | 6 |
| drain-source on-state resistance | RDSon | | 153 | 186 | mΩ | VGS = -4.5 V; ID = -2.6 A; Tj = 175 °C | 6 |
| drain-source on-state resistance | RDSon | | 118 | 152 | mΩ | VGS = -2.5 V; ID = -2.3 A; Tj = 25 °C | 6 |
| drain-source on-state resistance | RDSon | | 145 | 240 | mΩ | VGS = -1.8 V; ID = -0.5 A; Tj = 25 °C | 6 |
| drain-source on-state resistance | RDSon | | 170 | 400 | mΩ | VGS = -1.5 V; ID = -0.1 A; Tj = 25 °C | 6 |
| source-drain voltage | VSD | | -0.8 | -1.2 | V | IS = -1.2 A; VGS = 0 V; Tj = 25 °C | 6 |
| thermal resistance from junction to ambient | Rth(j-a) | | 218 | 250 | K/W | in free air; FR4 PCB, standard footprint | 5 |
| thermal resistance from junction to ambient | Rth(j-a) | | 97 | 114 | K/W | FR4 PCB, mounting pad for drain 6 cm2 | 5 |
| thermal resistance from junction to solder point | Rth(j-sp) | | 10 | 15 | K/W | | 5 |
## CAD (KiCad official)
- Symbol: `BSH205G2AR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files: `bsh205g2ar-etched.step` / `bsh205g2ar-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsh205g2ar.step` / `bsh205g2ar.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://assets.nexperia.com/documents/data-sheet/BSH205G2AR.pdf) (15 pp, sha256 `1209173b1f0e5dc1`, retrieved 2026-10-29, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bsh205g2ar-datasheet.pdf)