# BSH111BKR

**Nexperia** · MOSFETs · SOT-23

BSH111BKR from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the MOSFET; the gate-source voltage is limited to -10 V to 10 V (Table 5). |
| 2 | S | passive | Source terminal of the MOSFET; the source current is limited to 200 mA at Tamb = 25 °C (Table 5). |
| 3 | D | passive | Drain terminal of the MOSFET; the drain-source voltage is limited to 55 V and the drain current to 210 mA at Tamb = 25 °C with VGS = 4.5 V (Table 5). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS |  |  | 55 | V |  | 3 |
| Gate-source voltage | VGS | -10 |  | 10 | V | Tj = 25 °C | 3 |
| Drain current | ID |  |  | 210 | mA | VGS = 4.5 V; Tamb = 25 °C [1] | 3 |
| Drain current | ID |  |  | 130 | mA | VGS = 4.5 V; Tamb = 100 °C [1] | 3 |
| Drain current | ID |  |  | 335 | mA | VGS = 4.5 V; Tsp = 25 °C | 3 |
| Peak drain current | IDM |  |  | 0.85 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot |  |  | 302 | mW | Tamb = 25 °C [2] | 3 |
| Total power dissipation | Ptot |  |  | 364 | mW | Tamb = 25 °C [1] | 3 |
| Total power dissipation | Ptot |  |  | 1449 | mW | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 |  | 150 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Source current | IS |  |  | 200 | mA | Tamb = 25 °C [1] | 3 |
| Thermal resistance junction to ambient | Rth(j-a) |  | 351 | 404 | K/W | in free air; standard footprint [1] | 4 |
| Thermal resistance junction to ambient | Rth(j-a) |  | 271 | 311 | K/W | in free air; mounting pad for drain 1 cm2 [2] | 4 |
| Thermal resistance junction to solder point | Rth(j-sp) |  | 65 | 75 | K/W |  | 4 |
| Drain-source breakdown voltage | V(BR)DSS | 55 |  |  | V | ID = 250 µA; VGS = 0 V; Tj = 25 °C | 6 |
| Gate-source threshold voltage | VGSth | 0.6 | 1 | 1.3 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS |  |  | 1 | µA | VDS = 55 V; VGS = 0 V; Tj = 25 °C | 6 |
| Drain leakage current | IDSS |  |  | 5 | µA | VGS = 10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain leakage current | IDSS |  |  | -5 | µA | VGS = -10 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | 0.3 | µA | VGS = 4.5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Gate leakage current | IGSS |  |  | -0.3 | µA | VGS = -4.5 V; VDS = 0 V; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 2.3 | 4 | Ω | VGS = 4.5 V; ID = 200 mA; Tj = 25 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 4.7 | 8.1 | Ω | VGS = 4.5 V; ID = 200 mA; Tj = 150 °C | 6 |
| Drain-source on-state resistance | RDSon |  | 2.7 | 5 | Ω | VGS = 2.5 V; ID = 75 mA; Tj = 25 °C | 6 |
| Input capacitance | Ciss |  | 19.1 | 30 | pF | VDS = 30 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Output capacitance | Coss |  | 2.7 | 10 | pF | VDS = 30 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Reverse transfer capacitance | Crss |  | 1.5 | 7 | pF | VDS = 30 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C | 6 |
| Turn-on delay time | td(on) |  | 8.3 | 12 | ns | VDS = 30 V; ID = 200 mA; VGS = 4.5 V; RG(ext) = 6 Ω; Tj = 25 °C | 6 |
| Turn-off delay time | td(off) |  | 12.6 | 16 | ns | VDS = 30 V; ID = 200 mA; VGS = 4.5 V; RG(ext) = 6 Ω; Tj = 25 °C | 6 |
| Source-drain voltage | VSD |  | 0.86 | 1.2 | V | IS = 200 mA; VGS = 0 V; Tj = 25 °C | 6 |

## CAD (KiCad official)

- Symbol: `BSH111BKR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bsh111bkr-etched.step` / `bsh111bkr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsh111bkr.step` / `bsh111bkr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588885376203571200) (16 pp, sha256 `1f64e6fe63df5e0d`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bsh111bkr-datasheet.pdf)