br25g256fj-3ge2: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC…
br25g256fj-3ge2: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
br25g256fj-3ge2: laser-etched CAD + chip hero (factory 2.0.0 backfill)
br25g256fj-3ge2: backfill missing artifacts (variants)
br25g256fj-3ge2: publish the laser-etched STEP alongside the bare one
br25g256fj-3ge2: factory component page (tier=lcsc)
Initial commit: component/br25g256fj-3ge2