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Initial commit: component/br25g256fj-3ge2

Ray ·80b8a8036a ·2mo ago
2 files changed +84
README.mdadded+50
@@ -0,0 +1,50 @@+# BR25G256FJ-3GE2++**ROHM** · EEPROM · SOIC-8++BR25G256FJ-3GE2 from ROHM, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | CSB | input | Active-low chip select input. Drive low to select the device and frame an SPI transaction; drive high to deselect and place SO in high impedance. Referenced to Vcc; VIH >= 0.7*Vcc (>=0.8*Vcc below 1.7V). |+| 2 | SO | output | Serial data output (MISO). Data is shifted out MSB first on the falling edge of SCK. High-impedance when CSB is high or HOLDB is asserted. Drive strength: VOH >= Vcc-0.2 V at IOH = -2 mA (2.5-5.5 V). |+| 3 | WPB | input | Active-low hardware write-protect input. When low, the WRSR (Write Status Register) command is inhibited, locking the block-protection bits BP0/BP1 and preventing changes to write protection. |+| 4 | GND | power_in | Ground reference (0 V) for all inputs, outputs, and internal circuitry. |+| 5 | SI | input | Serial data input (MOSI). Op-code, address, and write data are shifted in MSB first on the rising edge of SCK. Setup time tDIS = 5 ns min at Vcc >= 4.5 V. |+| 6 | SCK | input | Serial clock input. Supports SPI modes (CPOL,CPHA) = (0,0) and (1,1) up to 20 MHz max at Vcc >= 4.5 V (5 MHz max at 1.7-2.5 V, 3 MHz max at 1.6-1.7 V). |+| 7 | HOLDB | input | Active-low hold input. Pulling HOLDB low while CSB is low pauses the current SPI transaction and forces SO to high impedance; the transaction resumes when HOLDB returns high. Allows the master to service higher-priority devices on a shared bus. |+| 8 | Vcc | power_in | Positive supply, 1.6 V to 5.5 V. Recommended bypass capacitor 0.1 uF to GND. Typical read current 0.1 uA standby, 2.0 mA read, 0.6 mA write at 5 V. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | ROHM |+| Package | SOIC-8 |+| Category | Memory |+| Pins | 8 |++## Ordering variants++- `BR25G256FJ-3GE2`+- `BR25G256FJ-3GE2BR25G256F-3GE2`+- `BR25G256FJ-3GE2BR25G256FVT-3GE2`+- `BR25G256FJ-3GE2BR25G256-3`++## CAD (KiCad official)++- Symbol: `BR25G256FJ-3GE2`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [ROHM datasheet](docs/br25g256fj-3ge2-datasheet.pdf) (37 pp, sha256 `6e0b88fc30c2ef44`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/br25g256fj-3ge2-datasheet.pdf)
page.jsonadded+34
@@ -0,0 +1,34 @@+{+  "slug": "br25g256fj-3ge2",+  "version": "0.1.0",+  "type": "component",+  "description": "ROHM EEPROM, SOIC-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "memory",+    "br25g256fj-3ge2"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "br25g256fj-3ge2.kicad_sym",+    "br25g256fj-3ge2.kicad_mod",+    "br25g256fj-3ge2.glb",+    "br25g256fj-3ge2.step",+    "br25g256fj-3ge2.lbr",+    "docs/hero.png",+    "docs/br25g256fj-3ge2-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html"+  ],+  "visibility": "public",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file