component

BR25G1MF-3GE2

Public Made by Adom

by adom

ROHM Semicon EEPROM, SOP-8-4.4mm. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentmemorybr25g1mf-3ge2factory-2.0.0extractor-text

Verified BR25G1MF-3GE2

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BR25G1MF-3GE2 · SOP-8-4.4mm · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 32-page datasheet
  • ✓distributor: lcsc C2061077, digikey BR25G1MF-3GE2TR-ND, mouser 755-BR25G1MF-3GE2
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-7w8cw8oi/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ br25g1mf-3ge2.kicad_sym✓ br25g1mf-3ge2.kicad_mod✓ br25g1mf-3ge2.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 11d ago
viewers br25g1mf-3ge2: viewers · Ray 11d ago
br25g1mf-3ge2-etched.glb Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2-etched.step br25g1mf-3ge2: factory component page (tier=mfr) · Ray 11d ago
br25g1mf-3ge2-hero.glb br25g1mf-3ge2: hero GLB from the etched model (keeps the MPN mark) · Ray 11d ago
br25g1mf-3ge2-hero.overlay.json Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2.glb Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2.kicad_mod Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2.kicad_sym Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2.lbr Publish 0.1.0 · Ray 11d ago
br25g1mf-3ge2.step Publish 0.1.0 · Ray 11d ago
package.json Publish 0.1.0 · Ray 11d ago
page.json Set visibility: public · Ray 11d ago
README.md Publish 0.1.0 · Ray 11d ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 11d ago

BR25G1MF-3GE2

ROHM Semicon · EEPROM · SOP-8-4.4mm

BR25G1MF-3GE2 from ROHM Semicon, in a SOP-8-4.4mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CSB input Chip select input for the SPI bus.
2 SO output Serial data output, which is output in sync with the SCK data fall edge, most significant bit first.
3 WPB input Write protect input; when asserted, the write status register command is prohibited.
4 GND power_in Common input/output reference voltage, 0V.
5 SI input Input for opcode, address, and serial data, taken in on the SCK data rise edge, most significant bit first.
6 SCK input Serial clock input, up to 10MHz (max) at 4.5V to 5.5V.
7 HOLDB input Hold input; command communication may be suspended temporarily (HOLD status).
8 Vcc power_in Power supply input, single supply operation from 1.8V to 5.5V.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOP-8-4.4mm
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6.5 V 2
Power Dissipation (SOP8) Pd 0.45 W When using at Ta=25°C or higher; 4.5mW to be reduced per 1°C 2
Storage Temperature Tstg -65 150 °C 2
Operating Temperature Topr -40 85 °C 2
Input Voltage / Output Voltage -0.3 V Max printed as Vcc+1.0 V; max value not over 6.5V; when pulse width is 50ns or less, min value not under -1.0V 2
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition 2
Electrostatic Discharge Voltage (human body model) VESD -4000 4000 V Human body model 2
Write Cycles 1e+06 Times Ta=25°C, Vcc=1.8V to 5.5V; Not 100% tested 2
Data Retention 100 Years Ta=25°C, Vcc=1.8V to 5.5V; Not 100% tested 2
Power Source Voltage Vcc 1.8 5.5 V 2
Input Voltage VIN 0 V Printed as 0 to Vcc 2
Input Capacity CIN 8 pF Ta=25°C, frequency=5MHz, VIN=GND; Not 100% tested 2
Output Capacity COUT 8 pF Ta=25°C, frequency=5MHz, VOUT=GND; Not 100% tested 2
Input Low Voltage1 VIL1 -0.3 V 1.8≤Vcc≤5.5V 3
Output Low Voltage1 VOL1 0 0.4 V IOL=3.0mA, 2.5≤Vcc≤5.5V 3
Output Low Voltage2 VOL2 0 0.2 V IOL=1.0mA, 1.8≤Vcc<2.5V 3
Input Leakage Current ILI -1 1 µA VIN=0 to Vcc 3
Output Leakage Current ILO -1 1 µA VOUT=0 to Vcc, CSB=Vcc 3
Supply Current (Write) ICC1 3 mA Vcc=1.8V, fSCK=3MHz, tE/W=5ms; Byte Write, Page Write, Write Status Register 3
Supply Current (Read) ICC4 0.7 mA Vcc=1.8V, fSCK=5MHz, SO=OPEN; Read, Read Status Register 3
Supply Current (Read) ICC5 1 mA Vcc=2.5V, fSCK=5MHz, SO=OPEN; Read, Read Status Register 3
Supply Current (Read) ICC6 3 mA Vcc=5.5V, fSCK=5MHz, SO=OPEN; Read, Read Status Register 3
Supply Current (Read) ICC7 4 mA Vcc=5.5V, fSCK=10MHz, SO=OPEN; Read, Read Status Register 3
Standby Current ISB 1 µA Vcc=5.5V, SO=OPEN; CSB=HOLDB=WPB=Vcc, SCK=SI=Vcc or GND 3
SCK Frequency fSCK 0.01 3 MHz Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SCK High Time tSCKWH 125 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SCK Low Time tSCKWL 125 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
CSB High Time tCS 90 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
CSB Setup Time tCSS 60 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
CSB Hold Time tCSH 60 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SCK Setup Time tSCKS 50 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SCK Hold Time tSCKH 50 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SI Setup Time tDIS 20 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SI Hold Time tDIH 20 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
Data Output Delay Time tPD 125 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
Output Hold Time tOH 0 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
Output Disable Time tOZ 80 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
HOLDB Setting Setup Time tHFS 0 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
HOLDB Setting Hold Time tHFH 20 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
HOLDB Release Setup Time tHRS 0 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
HOLDB Release Hold Time tHRH 20 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
Time from HOLDB to Output High-Z tHOZ 80 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
Time from HOLDB to Output change tHPD 80 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4
SCK Rise Time tRC 2 µs Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED 4
SCK Fall Time tFC 2 µs Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED 4
OUTPUT Rise Time tRO 40 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED 4
OUTPUT Fall Time tFO 40 ns Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED 4
Write Cycle Time tE/W 5 ms Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V 4

CAD (KiCad official)

  • Symbol: BR25G1MF-3GE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-4.4mm (KiCad packages3D, STEP)
  • 3D model files: br25g1mf-3ge2-etched.step / br25g1mf-3ge2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br25g1mf-3ge2.step / br25g1mf-3ge2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (32 pp, sha256 921ac1de6f3475bc, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF