BR25G1MF-3GE2 from ROHM Semicon, in a SOP-8-4.4mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CSB	input	Chip select input for the SPI bus.
2	SO	output	Serial data output, which is output in sync with the SCK data fall edge, most significant bit first.
3	WPB	input	Write protect input; when asserted, the write status register command is prohibited.
4	GND	power_in	Common input/output reference voltage, 0V.
5	SI	input	Input for opcode, address, and serial data, taken in on the SCK data rise edge, most significant bit first.
6	SCK	input	Serial clock input, up to 10MHz (max) at 4.5V to 5.5V.
7	HOLDB	input	Hold input; command communication may be suspended temporarily (HOLD status).
8	Vcc	power_in	Power supply input, single supply operation from 1.8V to 5.5V.

Key specifications

Parameter	Value
Manufacturer	ROHM Semicon
Package	SOP-8-4.4mm
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Max	Unit	Conditions	Page
Supply Voltage	VCC	-0.3	6.5	V		2
Power Dissipation (SOP8)	Pd		0.45	W	When using at Ta=25°C or higher; 4.5mW to be reduced per 1°C	2
Storage Temperature	Tstg	-65	150	°C		2
Operating Temperature	Topr	-40	85	°C		2
Input Voltage / Output Voltage		-0.3		V	Max printed as Vcc+1.0 V; max value not over 6.5V; when pulse width is 50ns or less, min value not under -1.0V	2
Junction Temperature	Tjmax		150	°C	Junction temperature at the storage condition	2
Electrostatic Discharge Voltage (human body model)	VESD	-4000	4000	V	Human body model	2
Write Cycles		1e+06		Times	Ta=25°C, Vcc=1.8V to 5.5V; Not 100% tested	2
Data Retention		100		Years	Ta=25°C, Vcc=1.8V to 5.5V; Not 100% tested	2
Power Source Voltage	Vcc	1.8	5.5	V		2
Input Voltage	VIN	0		V	Printed as 0 to Vcc	2
Input Capacity	CIN		8	pF	Ta=25°C, frequency=5MHz, VIN=GND; Not 100% tested	2
Output Capacity	COUT		8	pF	Ta=25°C, frequency=5MHz, VOUT=GND; Not 100% tested	2
Input Low Voltage1	VIL1	-0.3		V	1.8≤Vcc≤5.5V	3
Output Low Voltage1	VOL1	0	0.4	V	IOL=3.0mA, 2.5≤Vcc≤5.5V	3
Output Low Voltage2	VOL2	0	0.2	V	IOL=1.0mA, 1.8≤Vcc<2.5V	3
Input Leakage Current	ILI	-1	1	µA	VIN=0 to Vcc	3
Output Leakage Current	ILO	-1	1	µA	VOUT=0 to Vcc, CSB=Vcc	3
Supply Current (Write)	ICC1		3	mA	Vcc=1.8V, fSCK=3MHz, tE/W=5ms; Byte Write, Page Write, Write Status Register	3
Supply Current (Read)	ICC4		0.7	mA	Vcc=1.8V, fSCK=5MHz, SO=OPEN; Read, Read Status Register	3
Supply Current (Read)	ICC5		1	mA	Vcc=2.5V, fSCK=5MHz, SO=OPEN; Read, Read Status Register	3
Supply Current (Read)	ICC6		3	mA	Vcc=5.5V, fSCK=5MHz, SO=OPEN; Read, Read Status Register	3
Supply Current (Read)	ICC7		4	mA	Vcc=5.5V, fSCK=10MHz, SO=OPEN; Read, Read Status Register	3
Standby Current	ISB		1	µA	Vcc=5.5V, SO=OPEN; CSB=HOLDB=WPB=Vcc, SCK=SI=Vcc or GND	3
SCK Frequency	fSCK	0.01	3	MHz	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SCK High Time	tSCKWH	125		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SCK Low Time	tSCKWL	125		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
CSB High Time	tCS	90		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
CSB Setup Time	tCSS	60		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
CSB Hold Time	tCSH	60		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SCK Setup Time	tSCKS	50		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SCK Hold Time	tSCKH	50		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SI Setup Time	tDIS	20		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SI Hold Time	tDIH	20		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
Data Output Delay Time	tPD		125	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
Output Hold Time	tOH	0		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
Output Disable Time	tOZ		80	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
HOLDB Setting Setup Time	tHFS	0		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
HOLDB Setting Hold Time	tHFH	20		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
HOLDB Release Setup Time	tHRS	0		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
HOLDB Release Hold Time	tHRH	20		ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
Time from HOLDB to Output High-Z	tHOZ		80	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
Time from HOLDB to Output change	tHPD		80	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4
SCK Rise Time	tRC		2	µs	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED	4
SCK Fall Time	tFC		2	µs	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED	4
OUTPUT Rise Time	tRO		40	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED	4
OUTPUT Fall Time	tFO		40	ns	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V; NOT 100% TESTED	4
Write Cycle Time	tE/W		5	ms	Ta=-40°C to +85°C, CL=30pF, 1.8≤Vcc≤5.5V	4

CAD (KiCad official)

Symbol: BR25G1MF-3GE2
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8-4.4mm (KiCad packages3D, STEP)
3D model files: br25g1mf-3ge2-etched.step / br25g1mf-3ge2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br25g1mf-3ge2.step / br25g1mf-3ge2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: ROHM Semicon datasheet (32 pp, sha256 921ac1de6f3475bc, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

BR25G1MF-3GE2

Verified BR25G1MF-3GE2

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README