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BR25G128FJ-3GE2

Public Made by Adom

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ROHM Semicon EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BR25G128FJ-3GE2

ROHM Semicon · EEPROM · SOIC-8

BR25G128FJ-3GE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CSB input Chip select input for the SPI bus, which must be driven to select the device for command communication.
2 SO output Serial data output, which shifts data out MSB first on the falling edge of SCK.
3 WPB input Write protect input; when asserted, the write status register command is prohibited.
4 GND power_in All input/output reference voltage, 0 V.
5 SI input Serial input for opcode, address and serial data, sampled on the rising edge of SCK with the MSB first.
6 SCK input Serial clock input, operating up to 20 MHz at 4.5 V to 5.5 V Vcc.
7 HOLDB input Hold input; when asserted, command communication is suspended temporarily (HOLD status).
8 Vcc power_in Power supply input; the device operates from a single 1.6 V to 5.5 V supply.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6.5 V 2
Power Dissipation (SOP-J8) Pd 0.45 W When using at Ta=25°C or higher, 4.5mW to be reduced per 1°C 2
Storage Temperature Tstg -65 150 °C 2
Operating Temperature Topr -40 85 °C 2
Input Voltage / Output Voltage VIN/VOUT -0.3 6.5 V Max is Vcc+1.0 V, not over 6.5V; min -1.0V when pulse width is 50ns or less 2
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition 2
Electrostatic Discharge Voltage (human body model) VESD -4000 4000 V Human body model 2
Write Cycles 1e+06 Times Ta=25°C, Vcc=1.6V to 5.5V; not 100% tested 2
Data Retention 100 Years Ta=25°C, Vcc=1.6V to 5.5V; not 100% tested 2
Power Source Voltage Vcc 1.6 5.5 V 2
Input Voltage VIN 0 V 0 to Vcc as printed 2
Input Capacity CIN 8 pF Ta=25°C, frequency=5MHz, VIN=GND; not 100% tested 2
Output Capacity COUT 8 pF Ta=25°C, frequency=5MHz, VOUT=GND; not 100% tested 2
Input Low Voltage1 VIL1 -0.3 V 1.7≤Vcc≤5.5V 3
Input Low Voltage2 VIL2 -0.3 V 1.6≤Vcc<1.7V 3
Output Low Voltage1 VOL1 0 0.4 V IOL=3.0mA, 2.5≤Vcc≤5.5V 3
Output Low Voltage2 VOL2 0 0.2 V IOL=1.0mA, 1.6≤Vcc<2.5V 3
Input Leakage Current ILI -1 1 µA VIN=0 to Vcc 3
Output Leakage Current ILO -1 1 µA VOUT=0 to Vcc, CSB=Vcc 3
Supply Current (Write) ICC1 1 mA Byte Write, Page Write, Write Status Register; Vcc=1.8V, fSCK=5MHz, tE/W=5ms 3
Supply Current (Write) ICC2 1.5 mA Byte Write, Page Write, Write Status Register; Vcc=2.5V, fSCK=10MHz, tE/W=5ms 3
Supply Current (Write) ICC3 2 mA Byte Write, Page Write, Write Status Register; Vcc=5.5V, fSCK=20MHz, tE/W=5ms 3
Supply Current (Read) ICC4 0.7 mA Read, Read Status Register; Vcc=1.8V, fSCK=5MHz, SO=OPEN 3
Supply Current (Read) ICC5 1 mA Read, Read Status Register; Vcc=2.5V, fSCK=5MHz, SO=OPEN 3
Supply Current (Read) ICC6 1.6 mA Read, Read Status Register; Vcc=2.5V, fSCK=10MHz, SO=OPEN 3
Supply Current (Read) ICC7 3 mA Read, Read Status Register; Vcc=5.5V, fSCK=5MHz, SO=OPEN 3
Supply Current (Read) ICC8 4 mA Read, Read Status Register; Vcc=5.5V, fSCK=10MHz, SO=OPEN 3
Supply Current (Read) ICC9 8 mA Read, Read Status Register; Vcc=5.5V, fSCK=20MHz, SO=OPEN 3
Standby Current ISB 2 µA Vcc=5.5V, SO=OPEN; CSB=HOLDB=WPB=Vcc, SCK=SI=Vcc or GND 3
SCK Frequency fSCK 0.01 3 MHz 1.6≤Vcc<1.7V; Ta=-40°C to +85°C, CL=30pF 4
SCK Frequency fSCK 0.01 5 MHz 1.7≤Vcc<2.5V; Ta=-40°C to +85°C, CL=30pF 4
SCK Frequency fSCK 0.01 10 MHz 2.5≤Vcc<4.5V; Ta=-40°C to +85°C, CL=30pF 4
SCK Frequency fSCK 0.01 20 MHz 4.5≤Vcc≤5.5V; Ta=-40°C to +85°C, CL=30pF 4
Data Output Delay Time tPD 125 ns 1.6≤Vcc<1.7V; Ta=-40°C to +85°C, CL=30pF 4
Data Output Delay Time tPD 70 ns 1.7≤Vcc<2.5V; Ta=-40°C to +85°C, CL=30pF 4
Data Output Delay Time tPD 40 ns 2.5≤Vcc<4.5V; Ta=-40°C to +85°C, CL=30pF 4
Data Output Delay Time tPD 20 ns 4.5≤Vcc≤5.5V; Ta=-40°C to +85°C, CL=30pF 4
Output Disable Time tOZ 200 ns 1.6≤Vcc<1.7V; Ta=-40°C to +85°C, CL=30pF 4
Output Disable Time tOZ 80 ns 1.7≤Vcc<2.5V; Ta=-40°C to +85°C, CL=30pF 4
Output Disable Time tOZ 40 ns 2.5≤Vcc<4.5V; Ta=-40°C to +85°C, CL=30pF 4
Output Disable Time tOZ 20 ns 4.5≤Vcc≤5.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Rise Time tRO 100 ns 1.6≤Vcc<1.7V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Rise Time tRO 50 ns 1.7≤Vcc<2.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Rise Time tRO 40 ns 2.5≤Vcc<4.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Rise Time tRO 20 ns 4.5≤Vcc≤5.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Fall Time tFO 100 ns 1.6≤Vcc<1.7V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Fall Time tFO 50 ns 1.7≤Vcc<2.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Fall Time tFO 40 ns 2.5≤Vcc<4.5V; Ta=-40°C to +85°C, CL=30pF 4
OUTPUT Fall Time tFO 20 ns 4.5≤Vcc≤5.5V; Ta=-40°C to +85°C, CL=30pF 4
SCK Rise Time (Note1, not 100% tested) tRC 2 µs All Vcc ranges (1.6≤Vcc≤5.5V); Ta=-40°C to +85°C 4
SCK Fall Time (Note1, not 100% tested) tFC 2 µs All Vcc ranges (1.6≤Vcc≤5.5V); Ta=-40°C to +85°C 4
Write Cycle Time tE/W 5 ms All Vcc ranges (1.6≤Vcc≤5.5V); Ta=-40°C to +85°C 4
Load Capacity CL 30 pF AC timing test condition 4

CAD (KiCad official)

  • Symbol: BR25G128FJ-3GE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: br25g128fj-3ge2-etched.step / br25g128fj-3ge2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br25g128fj-3ge2.step / br25g128fj-3ge2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (35 pp, sha256 5e2057154e91059f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF