component
BQ40Z60RHBR
Public Made by Adomby adom
Texas Instruments Battery Management ICs, VQFN-32(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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BQ40Z60RHBR
Texas Instruments · Battery Management ICs · VQFN-32(5x5)
BQ40Z60RHBR from Texas Instruments, in a VQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BAT | power_in | Battery input pin and primary power supply (2.2 V to 26 V recommended, absolute maximum 30 V). |
| 2 | PBI | power_in | Power supply backup input pin (2.2 V to 26 V recommended, absolute maximum 30 V). |
| 3 | VC4 | input | Sense voltage input for the most positive cell, balance current input for that cell, and battery stack measurement input. |
| 4 | VC3 | input | Sense voltage input for the third most positive cell, balance current input for that cell, and return balance current for the most positive cell. |
| 5 | VC2 | input | Sense voltage input for the second most positive cell, balance current input for that cell, and return balance current for the most positive cell. |
| 6 | VC1 | input | Sense voltage input for the least positive cell, balance current input for that cell, and return balance current for the second most positive cell. |
| 7 | SRN | input | Analog input to the internal coulomb counter for integrating the small voltage between SRP and SRN (absolute maximum -0.3 V to 0.3 V). |
| 8 | SRP | input | Analog input to the internal coulomb counter for integrating the small voltage between SRP and SRN, where SRP is the top of the sense resistor (absolute maximum -0.3 V to 0.3 V). |
| 9 | VSS | power_in | Device ground. |
| 10 | TS1 | input | Thermistor input for temperature sensor channel 1 (absolute maximum -0.3 V to VREG + 0.3 V). |
| 11 | TS2 | input | Thermistor input for temperature sensor channel 2 (absolute maximum -0.3 V to VREG + 0.3 V). |
| 12 | TS3 | input | Thermistor input for temperature sensor channel 3 (absolute maximum -0.3 V to VREG + 0.3 V). |
| 13 | TS4 | input | Thermistor input for temperature sensor channel 4 (absolute maximum -0.3 V to VREG + 0.3 V). |
| 14 | GPIO0 | bidirectional | Multi-function open-drain I/O (absolute maximum 30 V); see IO Configuration in the bq40z60 Technical Reference Manual (SLUUA04). |
| 15 | GPIO1 | bidirectional | Multi-function open-drain I/O (absolute maximum 30 V); see IO Configuration in the bq40z60 Technical Reference Manual (SLUUA04). |
| 16 | SMBD | bidirectional | SMBus data pin, open-drain input/output (absolute maximum 30 V). |
| 17 | SMBC | bidirectional | SMBus clock pin, open-drain input/output (absolute maximum 30 V). |
| 18 | VFB | input | Feedback sense input for the charger control loop (absolute maximum 16 V). |
| 19 | HSRN | input | High sense resistor negative node input (absolute maximum 30 V). |
| 20 | HSRP | input | High sense resistor positive node input (absolute maximum 30 V). |
| 21 | AFEFUSE | output | Fuse drive output pin (absolute maximum 30 V). |
| 22 | VCC | power_in | Power supply input (2.2 V to 26 V recommended, absolute maximum 30 V). |
| 23 | REGN | power_out | Charger FET gate drive regulator output (0 V to 6.5 V recommended, absolute maximum 7 V). |
| 24 | PGND | power_in | Power ground. |
| 25 | LODRV | output | Low-side charging FET gate control output (absolute maximum 7 V). |
| 26 | PH | bidirectional | Charger phase signal input (absolute maximum 32 V). |
| 27 | HIDRV | output | High-side charging FET gate control output (absolute maximum 36 V). |
| 28 | BTST | input | High-side bootstrap capacitor input (0 V to 35 V recommended, absolute maximum 36 V). |
| 29 | ACFET | output | AC FET gate control output (0 V to 35 V recommended, absolute maximum 36 V). |
| 30 | DSG | output | N-channel discharge FET drive output pin (absolute maximum 32 V). |
| 31 | ACP | input | Adapter input pin (absolute maximum 30 V). |
| 32 | CHG | output | N-channel charge FET drive output pin (absolute maximum 32 V). |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32(5x5) |
| Category | Power Supply Chip |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage BAT, VCC, PBI (abs max) | VSupply | -0.3 | 30 | V | BAT, VCC, PBI | 5 | |
| Supply voltage REGN (abs max) | VSupply | -0.3 | 7 | V | REGN | 5 | |
| Input voltage ACP, SMBC, SMBD, GPIO0, GPIO1 (abs max) | VIN | -0.3 | 30 | V | 5 | ||
| Input voltage SRP, SRN (abs max) | VIN | -0.3 | 0.3 | V | 5 | ||
| Input voltage HSRP, HSRN (abs max) | VIN | -0.3 | 30 | V | 5 | ||
| Input voltage PH (abs max) | VIN | -0.3 | 32 | V | 5 | ||
| Input voltage VFB (abs max) | VIN | -0.3 | 16 | V | 5 | ||
| Output voltage CHG, DSG (abs max) | VO | -0.3 | 32 | V | 5 | ||
| Output voltage HIDRV, BTST, ACFET (abs max) | VO | -0.3 | 36 | V | 5 | ||
| Output voltage LODRV (abs max) | VO | -0.3 | 7 | V | 5 | ||
| Output voltage AFEFUSE (abs max) | VO | -0.3 | 30 | V | 5 | ||
| Maximum VSS current | ISS | 50 | mA | 5 | |||
| Functional temperature | TFUNC | -40 | 110 | °C | 5 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | HBM | 5 | |
| ESD CDM | V(ESD) | -500 | 500 | V | CDM | 5 | |
| Supply voltage BAT, VCC, PBI | VSupply | 2.2 | 26 | V | BAT, VCC, PBI | 5 | |
| Supply voltage ACFET, BTST | VSupply | 0 | 35 | V | ACFET, BTST | 5 | |
| Supply voltage REGN | VSupply | 0 | 6.5 | V | REGN | 5 | |
| Shutdown voltage | VSHUTDOWN- | 1.8 | 2 | 2.2 | V | VACP < VSHUTDOWN- | 5 |
| Start-up voltage | VSHUTDOWN+ | 2.05 | 2.25 | 2.45 | V | VACP > VSHUTDOWN- + VHYS | 5 |
| Shutdown voltage hysteresis | VHYS | 250 | mV | VSHUTDOWN+, VSHUTDOWN- | 5 | ||
| Input voltage SRP, SRN | VIN | -0.2 | 0.2 | V | 6 | ||
| Input voltage HSRP, HSRN | VIN | -0.5 | 0.5 | V | 6 | ||
| Input voltage VFB | VIN | 0 | 14 | V | 6 | ||
| Output voltage LODRV | VO | 0 | 6.5 | V | 6 | ||
| External PBI capacitor | CPBI | 2.2 | µF | 6 | |||
| Operating temperature | TOPR | -40 | 85 | °C | 6 | ||
| Junction-to-ambient thermal resistance, High K | RθJA | 36 | °C/W | RHB (VQFN) 32 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 31.5 | °C/W | 6 | |||
| Junction-to-board thermal resistance | RθJB | 8 | °C/W | 6 | |||
| Junction-to-top characterization parameter | ψJT | 0.5 | °C/W | 6 | |||
| Junction-to-board characterization parameter | ψJB | 7.9 | °C/W | 6 | |||
| Junction-to-case (bottom) thermal resistance | RθJCbot | 2.2 | °C/W | 6 | |||
| VCC operating range, charger enabled | VCC | 4 | 25 | V | Operation with charger enabled | 6 | |
| VCC operating range, charger disabled | VCC | 2.5 | 25 | V | Operation with charger disabled | 6 | |
| Undervoltage lock out | VCC-UV | 2.2 | 2.45 | V | VCC falling | 6 | |
| NORMAL mode current, charger enabled | INORMAL | 1250 | 1850 | µA | CPU = ACTIVE, Charger Enabled, No Communication | 7 | |
| NORMAL mode current, charger disabled | INORMAL | 310 | 445 | µA | CPU = HALT, Charger Disabled, No Communication | 7 | |
| SLEEP mode current, HFO ON, CHG/DSG ON | ISLEEP | 122 | 183 | µA | CPU = HALT, HFO = ON, CHG = ON, DSG = ON | 7 | |
| SLEEP mode current, HFO OFF, CHG/DSG ON | ISLEEP | 92 | 138 | µA | CPU = HALT, HFO = OFF, CHG = ON, DSG = ON | 7 | |
| SLEEP mode current, HFO ON, CHG/DSG OFF | ISLEEP | 82 | 128 | µA | CPU = HALT, HFO = ON, CHG = OFF, DSG = OFF | 7 | |
| SLEEP mode current, HFO OFF, CHG/DSG OFF | ISLEEP | 52 | 83 | µA | CPU = HALT, HFO = OFF, CHG = OFF, DSG = OFF | 7 | |
| SHUTDOWN mode current | ISHUTDOWN | 0.5 | 2 | µA | CPU = HALT, HFO = OFF, LFO = OFF, REG18 = OFF, Charger Disabled, No Communication | 7 | |
| BAT to VCC switchover voltage | VSWITCHOVER- | 2 | 2.1 | 2.2 | V | VBAT < VSWITCHOVER- | 7 |
| VCC to BAT switchover voltage | VSWITCHOVER+ | 3 | 3.1 | 3.2 | V | VBAT > VSWITCHOVER- + VHYS | 7 |
| Switchover voltage hysteresis | VHYS | 1000 | mV | VSWITCHOVER+, VSWITCHOVER- | 7 | ||
| Input leakage current, BAT pin | ILKG | 1 | µA | BAT = 0 V, VCC = 25 V | 7 | ||
| Input leakage current, VCC pin | ILKG | 1 | µA | BAT = 25 V, VCC = 0 V | 7 | ||
| Input leakage current, BAT and VCC pins | ILKG | 1 | µA | BAT = 0 V, VCC = 0 V, PBI = 25 V | 7 | ||
| Internal pulldown resistance ACP | RPD | 30 | 40 | 50 | kΩ | ACP | 7 |
| SMBus input voltage high | VIH | 1.3 | V | SMBC, SMBD, VREG = 1.8 V | 17 | ||
| SMBus input voltage low | VIL | 0.8 | V | SMBC, SMBD, VREG = 1.8 V | 17 | ||
| SMBus output low voltage | VOL | 0.4 | V | SMBC, SMBD, VREG = 1.8 V, IOL = 1.5 mA | 17 | ||
| SMBus input capacitance | CIN | 5 | pF | 17 | |||
| SMBus input leakage current | ILKG | 1 | µA | 17 | |||
| SMBus pulldown resistance | RPD | 0.7 | 1 | 1.3 | MΩ | 17 | |
| SMBus operating frequency | fSMB | 10 | 100 | kHz | SLAVE mode, SMBC 50% duty cycle | 17 | |
| SMBus XL operating frequency | fSMBXL | 40 | 400 | kHz | SLAVE mode | 17 | |
| OCD detection delay time | tOCD | 1 | 31 | ms | 18 | ||
| SCC detection delay time | tSCC | 0 | 915 | µs | 18 | ||
| Current fault delay time accuracy | tACC | -10 | 10 | % | Max delay setting | 18 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 3. Place the inductor input pin as close as possible to the switching MOSFET output pin. Minimize the copper | 34 |
CAD (KiCad official)
- Symbol:
BQ40Z60RHBR - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: VQFN-32(5x5) (KiCad packages3D, STEP)
- 3D model files:
bq40z60rhbr-etched.step/bq40z60rhbr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq40z60rhbr.step/bq40z60rhbr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (46 pp, sha256
f6cbeec32ec982dc, retrieved 2026-11-02, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).