# BQ24616RGER

**Texas Instruments** · Battery Management · VQFN-24-EP(4x4)

BQ24616RGER from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ACN | input | Adapter current-sense resistor negative input with differential-mode filtering via 0.1-μF capacitor to ACP and optional common-mode filtering to GND. |
| 2 | ACP | input | Adapter current-sense resistor positive input with differential-mode filtering via 0.1-μF capacitor to ACN and common-mode filtering to GND. |
| 3 | ACDRV | output | AC adapter-to-system MOSFET driver output connected through 1-kΩ resistor to ACFET gate with asymmetrical drive and optional slew-control capacitor. |
| 4 | CE | input | Charge-enable active-HIGH logic input with internal 1-MΩ pulldown; high enables charge, low disables charge and resets timers. |
| 5 | STAT1 | tri_state | Open-drain charge-status output indicating charger operation for LED drive or host processor communication. |
| 6 | TS | input | Temperature qualification voltage input for battery thermistor with resistor-divider programming of hot and cold temperature window from VREF to TS to GND. |
| 7 | TTC | input | Fast-charge safety timer and termination control capacitor node where LOW disables both and HIGH disables only fast-charge timer. |
| 8 | PG | tri_state | Open-drain power-good status output active-LOW when VCC is valid (not in UVLO, ACOV, or SLEEP mode) for LED or host processor. |
| 9 | STAT2 | tri_state | Open-drain charge-status output indicating charger operation for LED drive or host processor communication. |
| 10 | VREF | power_out | 3.3-V regulated voltage output with 1-μF capacitor to GND close to IC for voltage/current regulation and TS threshold programming. |
| 11 | ISET1 | input | Fast-charge current-set input with voltage programming fast-charge current regulation set-point; must be higher than 2× termination current. |
| 12 | VFB | input | Output voltage analog feedback adjustment input from resistive voltage divider connected to battery terminals for battery regulation voltage adjustment. |
| 13 | SRN | bidirectional | Charge current-sense resistor negative input with differential-mode filtering via 0.1-μF capacitor to SRP and optional common-mode filtering to GND. |
| 14 | SRP | bidirectional | Charge current-sense resistor positive input with differential-mode filtering via 0.1-μF capacitor to SRN and common-mode filtering to GND. |
| 15 | ISET2 | input | Precharge and termination current-set input with voltage programming precharge current regulation set-point and termination current trigger point. |
| 16 | ACSET | input | Adapter current-set input with voltage programming input current-regulation set-point during dynamic power management (DPM). |
| 17 | GND | power_in | Low-current sensitive analog/digital ground with exposed thermal pad soldered to board and vias connecting to ground plane for heat dissipation. |
| 18 | REGN | power_out | PWM low-side driver positive 6-V supply output with 1-μF capacitor to GND close to IC and Schottky diode to BTST for bootstrap. |
| 19 | LODRV | output | PWM low-side driver output connected with short trace to low-side power MOSFET gate. |
| 20 | PH | input | PWM high-side driver negative supply connected to phase-switching node (low-side drain, high-side source, and output inductor junction). |
| 21 | HIDRV | output | PWM high-side driver output connected with short trace to high-side power MOSFET gate. |
| 22 | BTST | input | PWM high-side driver positive supply with 0.1-μF bootstrap capacitor from PH and Schottky diode from REGN to BTST. |
| 23 | BATDRV | output | Battery-to-system MOSFET driver output connected through 1-kΩ resistor to BATFET gate with asymmetrical drive and optional slew-control capacitor. |
| 24 | VCC | power_in | IC power positive supply connected through 10-Ω resistor to common-source diode-OR point with 1-μF capacitor to GND. |
| 25 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | Power Management (PMIC) |
| Pins | 25 |

## CAD (KiCad official)

- Symbol: `BQ24616RGER`
- Footprint: `Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm`
- 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `bq24616rger-etched.step` / `bq24616rger-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq24616rger.step` / `bq24616rger.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com.cn/cn/lit/ds/symlink/bq24616.pdf) (43 pp, sha256 `481c7492f39e1622`, retrieved 2026-10-03, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bq24616rger-datasheet.pdf)