component
BQ24381DSGT
Public Made by Adomby adom
Texas Instruments Battery Management ICs, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ24381DSGT
Texas Instruments · Battery Management ICs · WSON-8-EP(2x2)
BQ24381DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power connected to the external DC supply (absolute max 30 V); bypass IN to VSS with a ceramic capacitor of 1 μF minimum. |
| 2 | VSS | power_in | Ground terminal; connect to the thermal pad and to the ground rail of the circuit, and it must be connected to ground at all times. |
| 3 | NC | unconnected | Do not connect to any external circuits; these pins may have internal connections used for test purposes. |
| 4 | FAULT | output | Open-drain status output pulled to VSS internally when the pass FET is off due to input overvoltage, output short circuit, overtemperature or battery voltage outside safe limits, and high impedance during normal operation. |
| 5 | CE | input | Active-low chip enable input with an internal pull-down of approximately 200 kΩ; CE high turns the pass FET off and CE low turns it on. |
| 6 | VBAT | power_in | Battery voltage sense input connected to the pack positive terminal through a 100-kΩ resistor. |
| 7 | NC | unconnected | Do not connect to any external circuits; these pins may have internal connections used for test purposes. |
| 8 | OUT | power_out | Output terminal to the charging system; bypass OUT to VSS with a ceramic capacitor of 1 μF minimum. |
| 9 | PAD | passive | Exposed thermal pad internally connected to VSS; it must be connected to the same potential as VSS on the PCB and not used as the primary ground input. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Supply Chip |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN voltage | VI | -0.3 | 30 | V | IN with respect to VSS | 4 | |
| OUT voltage | VI | -0.3 | 12 | V | OUT with respect to VSS | 4 | |
| FAULT, CE, VBAT voltage | VI | -0.3 | 7 | V | with respect to VSS | 4 | |
| Output source current | IOUTmax | 2 | A | OUT | 4 | ||
| Output sink current | 15 | mA | FAULT | 4 | |||
| Junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD CDM | V(ESD) | -500 | 500 | V | Charged-device model, JESD22-C101 | 4 | |
| IN voltage range | VI | 3.3 | 30 | V | 4 | ||
| Output current, OUT pin | IO | 1.7 | A | 4 | |||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 64 | °C/W | DSG (WSON) 8 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 84.1 | °C/W | DSG (WSON) 8 pins | 4 | ||
| Junction-to-board thermal resistance | RθJB | 33.9 | °C/W | DSG (WSON) 8 pins | 4 | ||
| Junction-to-top characterization parameter | ψJT | 1.9 | °C/W | 4 | |||
| Junction-to-board characterization parameter | ψJB | 34.3 | °C/W | 4 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 5.8 | °C/W | 4 | |||
| UVLO input power detected threshold | UVLO | 2.5 | 2.8 | V | CE = LO or HI, VIN: 0 V → 3 V | 5 | |
| Hysteresis on UVLO | Vhys(UVLO) | 200 | 300 | mV | CE = LO or HI, VIN: 3 V → 0 V | 5 | |
| Operating current | IDD | 300 | μA | CE = LO, no load on OUT pin, VIN = 5 V, bq24381 | 5 | ||
| Standby current | ISTDBY | 100 | μA | CE = HI, VIN = 5.5 V | 5 | ||
| Dropout voltage IN to OUT | VDO | 280 | mV | CE = LO, VIN = 5 V, I(OUT) = 1 A | 5 | ||
| Q1 off-state leakage current | IOFF | 10 | μA | CE = HI, VIN = 5.5 V | 5 | ||
| Output voltage | VO(REG) | 4.8 | 5 | 5.2 | V | CE = LO, VIN = 6 V, bq24381 | 5 |
| Input overvoltage protection threshold | VOVP | 6.88 | 7.1 | 7.31 | V | CE = LO, VIN: 5 V → 8 V | 5 |
| Hysteresis on OVP | Vhys(OVP) | 25 | 120 | mV | CE = LO or HI, VIN: 7 V → 5 V | 5 | |
| Short-circuit detection threshold | IO(SC) | 1.3 | 1.5 | 1.7 | A | 3 V < VIN < VOVP - Vhys(OVP) | 5 |
| Retry interval if short-circuit detected | tREC(SC) | 64 | ms | 5 | |||
| Battery overvoltage protection threshold | BVOVP | 4.3 | 4.35 | 4.4 | V | VIN > 4.5 V, CE = LO | 5 |
| Hysteresis on BV(OVP) | Vhys(BVovp) | 200 | 320 | mV | VIN > 4.5 V, CE = LO | 5 | |
| Input bias current on VBAT pin | I(VBAT) | 10 | nA | TJ = 25°C | 5 | ||
| Thermal shutdown temperature | TJ(OFF) | 140 | 150 | °C | 5 | ||
| Thermal shutdown hysteresis | TJ(OFF-HYS) | 20 | °C | 5 | |||
| Logic LOW input voltage CE | VIL | 0 | 0.4 | V | 5 | ||
| Logic HIGH input voltage CE | VIH | 1.4 | V | 5 | |||
| CE input low current | IIL | 1 | μA | 5 | |||
| CE input high current | IIH | 15 | μA | V CE = 1.8 V | 5 | ||
| FAULT output LOW voltage | VOL | 0.2 | V | ISINK = 5 mA | 5 | ||
| FAULT off-state leakage current, HI-Z | Ilkg | 10 | μA | V FAULT = 5 V | 5 | ||
| Deglitch time, input power detected | tDGL(PGOOD) | 8 | ms | CE = LO or HI, VIN 0 V → 5 V, 1-μs rise-time | 6 | ||
| Input OV propagation delay | tPD(OVP) | 200 | ns | VIN: 5 V → 10 V; not tested, specified by design | 6 | ||
| Recovery time from input overvoltage condition | tREC(OVP) | 8 | ms | CE = LO, VIN: 7 V → 5 V, 1-μs fall-time | 6 | ||
| Deglitch time, battery overvoltage detected | tDGL(BVovp) | 176 | μs | VIN > 4.5 V, CE = LO, VBAT rising from 4.1 V to 4.4 V to FAULT going low | 6 |
CAD (KiCad official)
- Symbol:
BQ24381DSGT - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
bq24381dsgt-etched.step/bq24381dsgt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq24381dsgt.step/bq24381dsgt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (25 pp, sha256
68b98db1e60807c1, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).