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BLP05N08G-B
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BL Shanghai Belling MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BLP05N08G-B
BL Shanghai Belling · MOSFETs · TO-263
BLP05N08G-B from BL Shanghai Belling, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS limited to ±20 V and a threshold of 2.0 to 4.0 V at ID=250µA. |
| 2 | D | passive | Drain, also the exposed tab; VDSS is 85 V and continuous current is 120 A (package limited). |
| 3 | S | passive | Source; continuous source (body-diode) current is 120 A and pulsed current is 480 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BL Shanghai Belling |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 85 | V | TC=25°C | 2 | ||
| Continuous Drain Current, Silicon Limited | ID | 138 | A | TC=25°C | 2 | ||
| Continuous Drain Current, Package Limited | ID | 120 | A | TC=25°C | 2 | ||
| Continuous Drain Current, Silicon Limited | ID | 87.4 | A | TC=100°C | 2 | ||
| Pulsed Drain Current | IDM | 480 | A | Note1: pulse width limited by max junction temperature | 2 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC=25°C | 2 | |
| Avalanche Energy | EAS | 156 | mJ | Note2: L=0.5mH, Ias=25A, Start TJ=25°C | 2 | ||
| Power Dissipation | PD | 173.6 | W | TC=25°C | 2 | ||
| Operating Junction and Storage Temperature Range | TJ,Tstg | -55 | 150 | ℃ | 2 | ||
| Maximum Temperature for Soldering | TL | 260 | ℃ | 2 | |||
| Thermal resistance, Junction-Case | RθJC | 0.72 | ℃/W | 2 | |||
| Thermal resistance, Junction-Ambient | RθJA | 62.5 | ℃/W | 2 | |||
| Drain-Source Breakdown Voltage | VDSS | 85 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-Source Leakage Current | IDSS | 1 | µA | VDS=85V, VGS=0V | 2 | ||
| Drain-Source Leakage Current | IDSS | 100 | µA | VDS=68V, VGS=0V, @TC=125°C | 2 | ||
| Gate-Source Forward Leakage | IGSS(F) | 100 | nA | VGS=+20V | 2 | ||
| Gate-Source Reverse Leakage | IGSS(R) | -100 | nA | VGS=-20V | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 4.4 | 5 | mΩ | VGS=10V, ID=50A | 3 | |
| Gate Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | VDS=VGS, ID=250µA | 3 |
| Continuous Source Current | IS | 120 | A | 3 | |||
| Maximum Pulsed Current | ISM | 480 | A | 3 | |||
| Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=50A | 3 |
CAD (KiCad official)
- Symbol:
BLP05N08G-B - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
blp05n08g-b-etched.step/blp05n08g-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);blp05n08g-b.step/blp05n08g-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BL Shanghai Belling datasheet (12 pp, sha256
97e106559d1c26c8, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BLP05N08G-B
**BL Shanghai Belling** · MOSFETs · TO-263
BLP05N08G-B from BL Shanghai Belling, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS limited to ±20 V and a threshold of 2.0 to 4.0 V at ID=250µA. |
| 2 | D | passive | Drain, also the exposed tab; VDSS is 85 V and continuous current is 120 A (package limited). |
| 3 | S | passive | Source; continuous source (body-diode) current is 120 A and pulsed current is 480 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BL Shanghai Belling |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 85 | V | TC=25°C | 2 |
| Continuous Drain Current, Silicon Limited | ID | | | 138 | A | TC=25°C | 2 |
| Continuous Drain Current, Package Limited | ID | | | 120 | A | TC=25°C | 2 |
| Continuous Drain Current, Silicon Limited | ID | | | 87.4 | A | TC=100°C | 2 |
| Pulsed Drain Current | IDM | | | 480 | A | Note1: pulse width limited by max junction temperature | 2 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | TC=25°C | 2 |
| Avalanche Energy | EAS | | | 156 | mJ | Note2: L=0.5mH, Ias=25A, Start TJ=25°C | 2 |
| Power Dissipation | PD | | | 173.6 | W | TC=25°C | 2 |
| Operating Junction and Storage Temperature Range | TJ,Tstg | -55 | | 150 | ℃ | | 2 |
| Maximum Temperature for Soldering | TL | | | 260 | ℃ | | 2 |
| Thermal resistance, Junction-Case | RθJC | | | 0.72 | ℃/W | | 2 |
| Thermal resistance, Junction-Ambient | RθJA | | | 62.5 | ℃/W | | 2 |
| Drain-Source Breakdown Voltage | VDSS | 85 | | | V | VGS=0V, ID=250µA | 2 |
| Drain-Source Leakage Current | IDSS | | | 1 | µA | VDS=85V, VGS=0V | 2 |
| Drain-Source Leakage Current | IDSS | | | 100 | µA | VDS=68V, VGS=0V, @TC=125°C | 2 |
| Gate-Source Forward Leakage | IGSS(F) | | | 100 | nA | VGS=+20V | 2 |
| Gate-Source Reverse Leakage | IGSS(R) | | | -100 | nA | VGS=-20V | 2 |
| Drain-Source On-Resistance | RDS(on) | | 4.4 | 5 | mΩ | VGS=10V, ID=50A | 3 |
| Gate Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | VDS=VGS, ID=250µA | 3 |
| Continuous Source Current | IS | | | 120 | A | | 3 |
| Maximum Pulsed Current | ISM | | | 480 | A | | 3 |
| Diode Forward Voltage | VSD | | | 1.2 | V | VGS=0V, IS=50A | 3 |
## CAD (KiCad official)
- Symbol: `BLP05N08G-B`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `blp05n08g-b-etched.step` / `blp05n08g-b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `blp05n08g-b.step` / `blp05n08g-b.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [BL Shanghai Belling datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588954581103751169) (12 pp, sha256 `97e106559d1c26c8`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/blp05n08g-b-datasheet.pdf)