component
BL814B
Public Made by Adomby adom
GME(银河微电) , DIP-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBL814B
GME(银河微电) · IC · DIP-4L
BL814B from GME(银河微电), in a DIP-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode/Cathode | passive | LED input terminal (anode/cathode, AC-input antiparallel LEDs), forward current IF up to ±60 mA with VF typ. 1.2 V at ±20 mA. |
| 2 | Cathode/Anode | passive | LED input terminal (cathode/anode, AC-input antiparallel LEDs), forward current IF up to ±60 mA with VF typ. 1.2 V at ±20 mA. |
| 3 | Emitter | passive | Phototransistor emitter; emitter-collector voltage VECO max 7 V. |
| 4 | Collector | passive | Phototransistor collector; VCEO max 80 V and collector current IC max 50 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | DIP-4L |
| Category | |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Current Transfer Ratio (Bank B) | CTR | 100 | 300 | % | IF=±1mA, VCE=5V | 3 | |
| Forward Voltage | VF | 1.2 | 1.4 | V | IF=±20mA | 3 | |
| Terminal Capacitance | Ct | 30 | 250 | pF | V=0, f=1kHz | 3 | |
| Collector-Emitter Dark Current | ICEO | 100 | nA | VCE = 20V, IF = 0 | 3 | ||
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC = 0.1mA, IF = 0 | 3 | ||
| Emitter-Collector Breakdown Voltage | BVECO | 7 | V | IE = 10μA, IF = 0 | 3 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 | 0.2 | V | IF=±20mA, IC=1mA | 3 | |
| Floating Capacitance | Cf | 0.6 | 1 | pF | V=0, f=1MHz | 3 | |
| Rise Time | Tr | 18 | μs | VCE=2V, RL=100Ω, IC=2mA | 3 | ||
| Fall Time | Tf | 18 | μs | 3 | |||
| Forward Current | IF | -60 | 60 | mA | 2 | ||
| Power Dissipation | PD | 100 | mW | 2 | |||
| Output Power Dissipation | PC | 150 | mW | 2 | |||
| Collector Current | IC | 50 | mA | 2 | |||
| Collector-Emitter Voltage | VCEO | 80 | V | 2 | |||
| Emitter-Collector Voltage | VECO | 7 | V | 2 | |||
| Total Power Dissipation | PTOT | 200 | mW | 3 | |||
| Isolation Voltage | VISO | 5000 | Vrms | 40 to 60% RH, AC for 1 minute | 3 | ||
| Operating Temperature | TOPR | -55 | 110 | °C | 3 | ||
| Storage Temperature Range | TSTG | -55 | 125 | °C | 3 | ||
| Soldering Temperature | TSOL | 260 | °C | For 10 seconds | 3 | ||
| Thermal Resistance Junction-Ambient | RthJ-A | 325 | °C/W | 2 | |||
| Thermal Resistance Junction-Case | RthJ-C | 200 | °C/W | 2 | |||
| Cut-off Frequency | Fc | 80 | kHz | VCE=5V, IC=2mA, RL=100Ω, -3dB | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin-plated leads; solderability-per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BL814B - Footprint:
Package_DIP:DIP-4_W7.62mm - 3D model: DIP-4L (KiCad packages3D, STEP)
- 3D model files:
bl814b-etched.step/bl814b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bl814b.step/bl814b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GME(银河微电) datasheet (9 pp, sha256
ab54e7dcddd351ab, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).