component

BGU7007

Public Made by Adom

by adom

NXP Semicon RF Amplifiers, XSON-6(1x1.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentrf & radiobgu7007factory-2.0.0extractor-text

Verified BGU7007

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 6 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BGU7007 · XSON-6(1x1.5) · 6 pins
  • ✓copper: 6 copper pads, none touching another net
  • ✓datasheet: all 6 pin names found in the 19-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: Texas_USON-6_1x1.45mm_P0.5mm_SMD
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-xikpfvuv/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 6 pins = 6 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 6 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ bgu7007.kicad_sym✓ bgu7007.kicad_mod✓ bgu7007.step
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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 9d ago
viewers bgu7007: viewers · Ray 9d ago
bgu7007-etched.glb Publish 0.1.0 · Ray 9d ago
bgu7007-etched.step bgu7007: factory component page (tier=mfr) · Ray 9d ago
bgu7007-hero.glb bgu7007: hero GLB from the etched model (keeps the MPN mark) · Ray 9d ago
bgu7007-hero.overlay.json Publish 0.1.0 · Ray 9d ago
bgu7007.glb Publish 0.1.0 · Ray 9d ago
bgu7007.kicad_mod Publish 0.1.0 · Ray 9d ago
bgu7007.kicad_sym Publish 0.1.0 · Ray 9d ago
bgu7007.lbr Publish 0.1.0 · Ray 9d ago
bgu7007.step Publish 0.1.0 · Ray 9d ago
package.json Publish 0.1.0 · Ray 9d ago
page.json Set visibility: public · Ray 9d ago
README.md Publish 0.1.0 · Ray 9d ago
verification.json Verified: Published by the parts factory: tier mfr, 6 pins · Ray 9d ago

BGU7007

NXP Semicon · RF Amplifiers · XSON-6(1x1.5)

BGU7007 from NXP Semicon, in a XSON-6(1x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; pins 1 and 2 are both GND.
2 GND power_in Ground pin; pins 1 and 2 are both GND.
3 RF_IN input RF input, AC coupled through internal DC blocking capacitors; DC voltage must not exceed VCC + 0.6 V and shall not exceed 5.0 V.
4 VCC power_in Supply voltage of 1.5 V to 3.1 V with RF input AC coupled.
5 ENABLE input Enable pin: VENABLE of 0.8 V or higher switches the device ON and 0.35 V or lower switches it OFF.
6 RF_OUT output RF output, AC coupled through internal DC blocking capacitors; DC voltage must not exceed VCC + 0.6 V and shall not exceed 5.0 V.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package XSON-6(1x1.5)
Category RF & Radio
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 5 V RF input AC coupled 3
Voltage on pin ENABLE VENABLE -0.5 5 V VENABLE <VCC + 0.6 3
Voltage on pin RF_IN VRF_IN -0.5 5 V DC; VRF_IN <VCC + 0.6 3
Voltage on pin RF_OUT VRF_OUT -0.5 5 V DC; VRF_OUT <VCC + 0.6 3
Input power Pi 0 dBm 3
Total power dissipation Ptot 55 mW Tsp <= 130 C 3
Storage temperature Tstg -65 150 C 3
Junction temperature Tj 150 C 3
Electrostatic discharge voltage HBM VESD 4 kV Human Body Model (HBM); JEDEC 22-A114E 3
Electrostatic discharge voltage CDM VESD 1 kV Charged Device Model (CDM); JEDEC 22-C101B 3
Supply voltage VCC 1.5 3.1 V RF input AC coupled 4
Supply current ICC 3.4 4.8 6.1 mA VENABLE >= 0.8 V; Pi < 40 dBm 4
Supply current ICC 8.9 12.8 15.9 mA VENABLE >= 0.8 V; Pi = 20 dBm 4
Supply current in power-down ICC 1 A VENABLE <= 0.35 V 4
Ambient temperature Tamb -40 25 85 C 4
Power gain Gp 16.5 18.5 20.5 dB Tamb = 25 C; Pi < 40 dBm, no jammer 4
Power gain Gp 17.5 19.5 21.5 dB Tamb = 25 C; Pi = 20 dBm, no jammer 4
Power gain Gp 16 21 dB 40 C <= Tamb <= +85 C; Pi < 40 dBm, no jammer 4
Power gain Gp 17 22 dB 40 C <= Tamb <= +85 C; Pi = 20 dBm, no jammer 4
Input return loss RLin 5 7 dB Pi < 40 dBm 4
Input return loss RLin 7 10 dB Pi = 20 dBm 4
Output return loss RLout 12 18 dB Pi < 40 dBm 4
Output return loss RLout 15 24 dB Pi = 20 dBm 4
Isolation ISL 22 24 dB 4
Noise figure NF 0.85 1.2 dB Tamb = 25 C; Pi < 40 dBm, no jammer; PCB losses subtracted 4
Noise figure NF 0.9 1.3 dB Tamb = 25 C; Pi < 40 dBm, no jammer; including PCB losses 4
Noise figure NF 1.2 1.6 dB Tamb = 25 C; Pi = 20 dBm, no jammer 4
Noise figure NF 1.1 1.5 dB Tamb = 25 C; Pjam = 20 dBm; fjam = 850 MHz 4
Noise figure NF 1.3 1.7 dB Tamb = 25 C; Pjam = 20 dBm; fjam = 1850 MHz 4
Noise figure NF 1.7 dB 40 C <= Tamb <= +85 C; Pi < 40 dBm, no jammer 4
Noise figure NF 1.9 dB 40 C <= Tamb <= +85 C; Pi = 20 dBm, no jammer 4
Noise figure NF 1.8 dB 40 C <= Tamb <= +85 C; Pjam = 20 dBm; fjam = 850 MHz 4
Noise figure NF 2 dB 40 C <= Tamb <= +85 C; Pjam = 20 dBm; fjam = 1850 MHz 4
Input power at 1 dB gain compression Pi(1dB) 16 13 dBm f = 1559 MHz to 1610 MHz; VCC = 1.5 V 5
Input power at 1 dB gain compression Pi(1dB) 15 12 dBm f = 1559 MHz to 1610 MHz; VCC = 1.8 V 5
Input power at 1 dB gain compression Pi(1dB) 14 11 dBm f = 1559 MHz to 1610 MHz; VCC = 2.85 V 5
Input power at 1 dB gain compression Pi(1dB) 13 10 dBm f = 1612 MHz to 1909 MHz; VCC = 1.8 V; out of band 5
Input power at 1 dB gain compression Pi(1dB) 11 8 dBm f = 1612 MHz to 1909 MHz; VCC = 2.85 V; out of band 5
Input third-order intercept point IP3i 1 4 dBm f = 1.575 GHz; VCC = 1.5 V 5
Input third-order intercept point IP3i 2 5 dBm f = 1.575 GHz; VCC = 2.85 V 5
Turn-on time ton 2 s Within 10 % of the final gain 5
Turn-off time toff 1 s Within 10 % of the final gain 5
Rollett stability factor K 1 5
Thermal resistance from junction to solder point Rth(j-sp) 225 K/W 3

CAD (KiCad official)

  • Symbol: BGU7007
  • Footprint: Package_SON:Texas_USON-6_1x1.45mm_P0.5mm_SMD
  • 3D model: XSON-6(1x1.5) (KiCad packages3D, STEP)
  • 3D model files: bgu7007-etched.step / bgu7007-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bgu7007.step / bgu7007.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (19 pp, sha256 d1eab7ea2457d2f7, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF