# BGA2818

**NXP SEMICONDUCTORS** · Global Sourcing Parts · SOT-363-6

BGA2818 from NXP SEMICONDUCTORS, in a SOT-363-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Supply voltage pin, 3.0 V to 3.6 V operating (3.3 V typical, absolute max 5.0 V), to be decoupled with a 22 nF capacitor placed close to the MMIC. |
| 2 | GND2 | power_in | Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC. |
| 3 | RF_OUT | output | RF output, internally matched to 50 ohm, requires a DC blocking capacitor of no more than 100 pF above 100 MHz. |
| 4 | GND1 | power_in | Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC. |
| 5 | GND2 | power_in | Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC. |
| 6 | RF_IN | input | RF input, internally matched to 50 ohm, requires a DC blocking capacitor of no more than 100 pF above 100 MHz. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | NXP SEMICONDUCTORS |
| Package | SOT-363-6 |
| Category | Global Sourcing Parts |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | -0.5 |  | 5 | V | RF input AC coupled | 2 |
| Supply current | ICC |  |  | 55 | mA |  | 2 |
| Total power dissipation | Ptot |  |  | 200 | mW | Tsp = 90 °C | 2 |
| Storage temperature | Tstg | -40 |  | 125 | °C |  | 2 |
| Junction temperature | Tj |  |  | 125 | °C |  | 2 |
| Drive power | Pdrive |  |  | -10 | dBm |  | 2 |
| Thermal resistance junction to solder point | Rth(j-sp) |  | 300 |  | K/W | Ptot = 200 mW; Tsp = 90 °C | 2 |
| Supply voltage | VCC | 3 | 3.3 | 3.6 | V |  | 2 |
| Supply current | ICC | 16.9 | 19.9 | 22.7 | mA |  | 2 |
| Power gain | Gp | 29.5 | 30.1 | 30.7 | dB | f = 250 MHz | 3 |
| Power gain | Gp | 29.1 | 29.8 | 30.6 | dB | f = 950 MHz | 3 |
| Power gain | Gp | 28.5 | 30 | 31.4 | dB | f = 2150 MHz | 3 |
| Input return loss | RLin | 9 | 11 |  | dB | f = 250 MHz | 3 |
| Input return loss | RLin | 10 | 12 |  | dB | f = 950 MHz | 3 |
| Input return loss | RLin | 7 | 14 |  | dB | f = 2150 MHz | 3 |
| Output return loss | RLout | 15 | 19 |  | dB | f = 250 MHz | 3 |
| Output return loss | RLout | 14 | 15 |  | dB | f = 950 MHz | 3 |
| Output return loss | RLout | 8 | 11 |  | dB | f = 2150 MHz | 3 |
| Isolation | ISL | 49 | 70 |  | dB | f = 250 MHz | 3 |
| Isolation | ISL | 49 | 51 |  | dB | f = 950 MHz | 3 |
| Isolation | ISL | 34 | 36 |  | dB | f = 2150 MHz | 3 |
| Noise figure | NF |  | 3.5 | 4 | dB | f = 250 MHz | 3 |
| Noise figure | NF |  | 3.3 | 3.8 | dB | f = 950 MHz | 3 |
| 3 dB bandwidth | B3dB | 2.7 | 2.9 | 3.1 | GHz | 3 dB below gain at 1 GHz | 3 |
| Rollett stability factor | K | 28 | 43 |  |  | f = 250 MHz | 3 |
| Rollett stability factor | K | 4 | 5 |  |  | f = 950 MHz | 3 |
| Rollett stability factor | K | 1 | 1 |  |  | f = 2150 MHz | 3 |
| Saturated output power | PL(sat) | 9 | 10 |  | dBm | f = 250 MHz | 3 |
| Saturated output power | PL(sat) | 7 | 8 |  | dBm | f = 950 MHz | 3 |
| Saturated output power | PL(sat) | 5 | 6 |  | dBm | f = 2150 MHz | 3 |
| Output power at 1 dB gain compression | PL(1dB) | 7 | 7 |  | dBm | f = 250 MHz | 3 |
| Output power at 1 dB gain compression | PL(1dB) | 5 | 6 |  | dBm | f = 950 MHz | 3 |
| Output power at 1 dB gain compression | PL(1dB) | 3 | 4 |  | dBm | f = 2150 MHz | 3 |
| Input third-order intercept point | IP3I | -13 | -11 |  | dBm | Pdrive = -43 dBm each tone; f1 = 250 MHz; f2 = 251 MHz | 3 |
| Input third-order intercept point | IP3I | -14 | -12 |  | dBm | Pdrive = -43 dBm each tone; f1 = 950 MHz; f2 = 951 MHz | 3 |
| Input third-order intercept point | IP3I | -19 | -16 |  | dBm | Pdrive = -43 dBm each tone; f1 = 2150 MHz; f2 = 2151 MHz | 3 |
| Output third-order intercept point | IP3O | 17 | 19 |  | dBm | Pdrive = -43 dBm each tone; f1 = 250 MHz; f2 = 251 MHz | 3 |
| Output third-order intercept point | IP3O | 15 | 18 |  | dBm | Pdrive = -43 dBm each tone; f1 = 950 MHz; f2 = 951 MHz | 3 |
| Output third-order intercept point | IP3O | 11 | 14 |  | dBm | Pdrive = -43 dBm each tone; f1 = 2150 MHz; f2 = 2151 MHz | 3 |
| Second harmonic output power | PL(2H) |  | -37 | -35 | dBm | Pdrive = -31 dBm; f1H = 250 MHz; f2H = 500 MHz | 3 |
| Second harmonic output power | PL(2H) |  | -32 | -28 | dBm | Pdrive = -31 dBm; f1H = 950 MHz; f2H = 1900 MHz | 3 |
| Second-order intermodulation distance | IM2 | 35 | 37 |  | dBc | Pdrive = -34 dBm each tone; f1 = 250 MHz; f2 = 251 MHz | 3 |
| Second-order intermodulation distance | IM2 | 26 | 32 |  | dBc | Pdrive = -34 dBm each tone; f1 = 950 MHz; f2 = 951 MHz | 3 |

## CAD (KiCad official)

- Symbol: `BGA2818`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363-6 (KiCad packages3D, STEP)
- 3D model files: `bga2818-etched.step` / `bga2818-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bga2818.step` / `bga2818.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [NXP SEMICONDUCTORS datasheet](https://www.nxp.com/docs/en/data-sheet/BGA2818.pdf) (13 pp, sha256 `05fbf4d7bfd233d1`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bga2818-datasheet.pdf)