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BGA2818

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NXP SEMICONDUCTORS Global Sourcing Parts, SOT-363-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BGA2818

NXP SEMICONDUCTORS · Global Sourcing Parts · SOT-363-6

BGA2818 from NXP SEMICONDUCTORS, in a SOT-363-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin, 3.0 V to 3.6 V operating (3.3 V typical, absolute max 5.0 V), to be decoupled with a 22 nF capacitor placed close to the MMIC.
2 GND2 power_in Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC.
3 RF_OUT output RF output, internally matched to 50 ohm, requires a DC blocking capacitor of no more than 100 pF above 100 MHz.
4 GND1 power_in Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC.
5 GND2 power_in Ground pin connected to the PCB top ground plane, which must be as close as possible to the MMIC.
6 RF_IN input RF input, internally matched to 50 ohm, requires a DC blocking capacitor of no more than 100 pF above 100 MHz.

Key specifications

Parameter Value
Manufacturer NXP SEMICONDUCTORS
Package SOT-363-6
Category Global Sourcing Parts
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 5 V RF input AC coupled 2
Supply current ICC 55 mA 2
Total power dissipation Ptot 200 mW Tsp = 90 °C 2
Storage temperature Tstg -40 125 °C 2
Junction temperature Tj 125 °C 2
Drive power Pdrive -10 dBm 2
Thermal resistance junction to solder point Rth(j-sp) 300 K/W Ptot = 200 mW; Tsp = 90 °C 2
Supply voltage VCC 3 3.3 3.6 V 2
Supply current ICC 16.9 19.9 22.7 mA 2
Power gain Gp 29.5 30.1 30.7 dB f = 250 MHz 3
Power gain Gp 29.1 29.8 30.6 dB f = 950 MHz 3
Power gain Gp 28.5 30 31.4 dB f = 2150 MHz 3
Input return loss RLin 9 11 dB f = 250 MHz 3
Input return loss RLin 10 12 dB f = 950 MHz 3
Input return loss RLin 7 14 dB f = 2150 MHz 3
Output return loss RLout 15 19 dB f = 250 MHz 3
Output return loss RLout 14 15 dB f = 950 MHz 3
Output return loss RLout 8 11 dB f = 2150 MHz 3
Isolation ISL 49 70 dB f = 250 MHz 3
Isolation ISL 49 51 dB f = 950 MHz 3
Isolation ISL 34 36 dB f = 2150 MHz 3
Noise figure NF 3.5 4 dB f = 250 MHz 3
Noise figure NF 3.3 3.8 dB f = 950 MHz 3
3 dB bandwidth B3dB 2.7 2.9 3.1 GHz 3 dB below gain at 1 GHz 3
Rollett stability factor K 28 43 f = 250 MHz 3
Rollett stability factor K 4 5 f = 950 MHz 3
Rollett stability factor K 1 1 f = 2150 MHz 3
Saturated output power PL(sat) 9 10 dBm f = 250 MHz 3
Saturated output power PL(sat) 7 8 dBm f = 950 MHz 3
Saturated output power PL(sat) 5 6 dBm f = 2150 MHz 3
Output power at 1 dB gain compression PL(1dB) 7 7 dBm f = 250 MHz 3
Output power at 1 dB gain compression PL(1dB) 5 6 dBm f = 950 MHz 3
Output power at 1 dB gain compression PL(1dB) 3 4 dBm f = 2150 MHz 3
Input third-order intercept point IP3I -13 -11 dBm Pdrive = -43 dBm each tone; f1 = 250 MHz; f2 = 251 MHz 3
Input third-order intercept point IP3I -14 -12 dBm Pdrive = -43 dBm each tone; f1 = 950 MHz; f2 = 951 MHz 3
Input third-order intercept point IP3I -19 -16 dBm Pdrive = -43 dBm each tone; f1 = 2150 MHz; f2 = 2151 MHz 3
Output third-order intercept point IP3O 17 19 dBm Pdrive = -43 dBm each tone; f1 = 250 MHz; f2 = 251 MHz 3
Output third-order intercept point IP3O 15 18 dBm Pdrive = -43 dBm each tone; f1 = 950 MHz; f2 = 951 MHz 3
Output third-order intercept point IP3O 11 14 dBm Pdrive = -43 dBm each tone; f1 = 2150 MHz; f2 = 2151 MHz 3
Second harmonic output power PL(2H) -37 -35 dBm Pdrive = -31 dBm; f1H = 250 MHz; f2H = 500 MHz 3
Second harmonic output power PL(2H) -32 -28 dBm Pdrive = -31 dBm; f1H = 950 MHz; f2H = 1900 MHz 3
Second-order intermodulation distance IM2 35 37 dBc Pdrive = -34 dBm each tone; f1 = 250 MHz; f2 = 251 MHz 3
Second-order intermodulation distance IM2 26 32 dBc Pdrive = -34 dBm each tone; f1 = 950 MHz; f2 = 951 MHz 3

CAD (KiCad official)

  • Symbol: BGA2818
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363-6 (KiCad packages3D, STEP)
  • 3D model files: bga2818-etched.step / bga2818-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bga2818.step / bga2818.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP SEMICONDUCTORS datasheet (13 pp, sha256 05fbf4d7bfd233d1, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF