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BFR93AE6327HTSA1

Public Made by Adom

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Infineon Technologies Bipolar (BJT), SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BFR93AE6327HTSA1

Infineon Technologies · Bipolar (BJT) · SOT-23-3

BFR93AE6327HTSA1 from Infineon Technologies, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B passive Base terminal; the datasheet gives a maximum base current IB of 9 mA.
2 E passive Emitter terminal; the datasheet gives a maximum emitter-base voltage VEBO of 2 V.
3 C passive Collector terminal; the datasheet gives a maximum collector current IC of 90 mA and a maximum collector-emitter voltage VCEO of 12 V.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-emitter voltage VCEO 12 V 1
Collector-emitter voltage VCES 20 V 1
Collector-base voltage VCBO 20 V 1
Emitter-base voltage VEBO 2 V 1
Collector current IC 90 mA 1
Base current IB 9 mA 1
Total power dissipation Ptot 300 mW TS ≤ 111 °C 1
Junction temperature TJ 150 °C 1
Storage temperature TStg -55 150 °C 1
Collector-emitter breakdown voltage V(BR)CEO 12 V IC = 1 mA, IB = 0 2
Collector-emitter cutoff current ICES 100 µA VCE = 20 V, VBE = 0 2
Collector-base cutoff current ICBO 100 nA VCB = 10 V, IE = 0 2
Emitter-base cutoff current IEBO 10 µA VEB = 2.5 V, IC = 0 2
DC current gain hFE 70 100 140 - IC = 30 mA, VCE = 8 V, pulse measured 2
Transition frequency fT 4.5 6 GHz IC = 30 mA, VCE = 8 V, f = 500 MHz 3
Collector-base capacitance Ccb 0.54 0.8 pF VCB = 10 V, f = 1 MHz, VBE = 0, emitter grounded 3
Junction - soldering point thermal resistance RthJS 130 K/W 1

CAD (KiCad official)

  • Symbol: BFR93AE6327HTSA1
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: bfr93ae6327htsa1-etched.step / bfr93ae6327htsa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bfr93ae6327htsa1.step / bfr93ae6327htsa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (6 pp, sha256 5613dc0c3b4df4a4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF