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BD9P155EFV-CE2

ROHM Semicon · DC-DC Converters · HTSSOP-20-EP

BD9P155EFV-CE2 from ROHM Semicon, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable pin: low level of 0.8 V or lower disables the device and high level of 2.0 V or higher enables it, and it must not be left open.
2 VIN power_in Power supply input for the internal circuit, to be connected to the PVIN pins.
3 PVIN power_in Power supply input for the switching regulator output stage, with input ceramic capacitors connected between PGND and these pins.
4 PVIN power_in Power supply input for the switching regulator output stage, with input ceramic capacitors connected between PGND and these pins.
5 N.C. unconnected Not connected to the chip; leave open, and confirm no problem if adjacent pins may be shorted in the application.
6 PGND power_in Ground pin for the switching regulator output stage.
7 PGND power_in Ground pin for the switching regulator output stage.
8 SW output Switching node connected to the source of the internal high-side FET and the drain of the internal low-side FET, used for the power inductor and bootstrap capacitor.
9 SW output Switching node connected to the source of the internal high-side FET and the drain of the internal low-side FET, used for the power inductor and bootstrap capacitor.
10 BST passive Connect a 0.1 µF (Typ) bootstrap capacitor between this pin and the SW pins, which supplies the high-side FET gate drive.
11 OCP_SEL input Overcurrent threshold select: high (connected to VREG) sets 1.250 A (Typ) and low (connected to GND) sets 0.625 A (Typ) as the average inductor current limit.
12 MODE input Mode select: high for forced PWM, low or open for AUTO (PWM/LLM), or a applied clock for SYNC mode.
13 SSCG input Spread spectrum select: high (connected to VREG) enables spread spectrum and low (connected to GND) disables it.
14 RESET output Open-drain output reset pin that requires a pull-up resistor to VREG or a supply within the RESET pin absolute maximum rating, with 5 kΩ to 100 kΩ recommended.
15 GND power_in Ground pin for the device.
16 VOUT_DIS input Discharges the VOUT node when connected to VOUT, and must be connected to GND when the discharge function is not required.
17 VOUT_SNS input Inverting input of GmAmp1 used for OVP, SCP and RESET detection and for clamp and phase compensation; connect to the output voltage.
18 N.C. unconnected Not connected to the chip for the BD9P155EFV-C; leave open, and confirm no problem if adjacent pins may be shorted in the application.
19 VCC_EX power_in Power supply input for the internal circuit that supplies VREG when voltage between 3.2 V (VTEXH, Max) and 5.65 V (VEXOVPL, Min) is applied, and must be connected to GND if unused.
20 VREG power_out Outputs 3.3 V (Typ) for the internal circuit, requires a 1.0 µF (Typ) ceramic capacitor, and must not drive external loads other than the OCP_SEL, MODE and SSCG pins and the RESET pull-up.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package HTSSOP-20-EP
Category Power Management ICs
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VVIN, VPVIN 3.5 40 V 10
Operating Temperature Ta -40 125 ˚C 10
SW Minimum ON Time tONMIN 50 ns 10
SW Minimum OFF Time (VREG = 5.0 V) tOFFMIN 100 ns VREG = 5.0 V 10
Output Current IOUT 1 A 10
Input Capacitor (VIN Continuous Condition) CIN 2.3 µF VIN Continuous Condition 10
VREG Capacitor CREG 0.6 1 2 µF 10
BST Capacitor CBST 0.05 0.1 0.2 µF 10
Output Voltage Accuracy -1.75 1.75 % -40 °C to +125 °C 1
Input Voltage (absolute maximum) VVIN, VPVIN -0.3 42 V 9
EN Voltage (absolute maximum) VEN -0.3 42 V 9
BST Voltage (absolute maximum) VBST -0.3 49 V 9
FB, RESET, MODE, SSCG, OCP_SEL Voltage (absolute maximum) VFB, VRESET, VMODE, VSSCG, VOCP_SEL -0.3 7 V 9
VOUT_DIS Voltage (absolute maximum) VVOUT_DIS -0.3 10 V 9
VOUT_SNS Voltage (absolute maximum) VVOUT_SNS -0.3 10 V 9
VCC_EX Voltage (absolute maximum) VVCC_EX -0.3 7 V 9
VREG Voltage (absolute maximum) VREG -0.3 7 V 9
Maximum Junction Temperature Tjmax 150 ˚C 9
Shutdown Current ISDWN 2.1 10 µA VEN = 0 V, Ta = -40 ˚C to +105 ˚C 10
Quiescent Current from VIN IQ_VIN1 2.1 6 µA VMODE = 0 V, VVCC_EX = 5 V, VFB = VFB1 x 1.04 (SLEEP) 10
Quiescent Current from VIN IQ_VIN3 33 66 µA VMODE = 5 V, VVCC_EX = 5 V, VFB =VFB1 x 1.04 (No SLEEP) 10
Quiescent Current from VCC_EX IQ_VCC_EX1 16 60 µA VMODE = 0 V, VFB = VFB1 x 1.04 (SLEEP) 10
VIN Power On Reset Rising VPOR_R 3.6 3.8 4 V VIN Sweep Up 10
VREG Under Voltage Lockout Falling VUVLO_F 2.7 2.85 3 V VREG Sweep Down 10
VREG Under Voltage Lockout Rising VUVLO_R 2.75 2.95 3.15 V VREG Sweep Up 10
EN Input Voltage High VENH 2 40 V 10
EN Input Voltage Low VENL 0 0.8 V 10
MODE Input Voltage High VMODEH 2 5.5 V 10
OCP_SEL Input Voltage High VSELH 2 5.5 V 10
OCP_SEL Input Voltage Low VSELL 0.8 V 10
SSCG Input Voltage High VSSCGH 2 5.5 V 10
VREG Voltage VREG 3 3.3 3.6 V 11
VCC_EX OVP Threshold Voltage High VEXOVPH 5.85 6.2 6.55 V 11
VCC_EX OVP Threshold Voltage Low VEXOVPL 5.65 6 6.35 V 11
VOUT_DIS Discharge ON Resistance RDIS 75 150 Ω VEN = 0 V, VOUT_DIS = 0.3 V 11
VOUT Discharge Deactivate Voltage VDISL 100 200 300 mV VOUT_DIS Sweep Down 11
Switching Frequency fSW 2 2.2 2.4 MHz 11
Synchronization Frequency Range fSW_EX 1.8 2.4 MHz External Clock Input 11
Switching Frequency (Spread Spectrum) fSWSSR 1.9 2.52 MHz VSSCG = 5 V 11
Output Voltage (BD9P155EFV-C) VOUT_SNS Voltage, PWM Mode VOUT_SNS1 4.925 5.013 5.1 V VOUT_SNS Voltage, PWM Mode 11
Enter SLEEP State Voltage (BD9P155EFV-C) VOUT_SNS2 4.963 5.076 5.188 V VOUT_SNS Rising, Light Load Mode 11
Exit SLEEP State Voltage (BD9P155EFV-C) VOUT_SNS3 4.949 5.063 5.176 V VOUT_SNS Falling, Light Load Mode 11
Start Delay Time tDLY 400 800 µs 11
Soft Start Time tSS 2.5 3 3.9 ms VFB1 x 0.1 to VFB1 x 0.9 11
High Side FET ON Resistance RONH 210 440 mΩ VBST-VSW = 3.3 V 11
Low Side FET ON Resistance RONL 140 290 mΩ VVCC_EX = 3.3 V 11
Over Current Protection Threshold IOCP10 1 1.25 1.5 A VOCP_SEL = 5 V 11
Over Current Protection Threshold IOCP05 0.5 0.625 0.75 A VOCP_SEL = 0 V 11
Reset Threshold Voltage Low (BD9P155EFV-C) VRTL 4.55 4.65 4.75 V 12
Reset Threshold Voltage High (BD9P155EFV-C) VRTH 4.66 4.78 4.9 V 12
Reset ON Resistance RRST 190 400 Ω VIN = 2 V, VEN = 0 V, IRESET = 1 mA 12
Reset Active Time tRSTNACT 2 3.6 5 ms 12
VOUT_SNS OVP Threshold Voltage High (BD9P155EFV-C) VSNSOVPH 5.156 5.379 5.595 V 12
VOUT_SNS OVP Threshold Voltage Low (BD9P155EFV-C) VSNSOVPL 5.033 5.249 5.467 V 12
SCP Threshold Voltage High (BD9P155EFV-C) VSCPH 4.25 4.5 4.75 V 12
SCP Threshold Voltage Low (BD9P155EFV-C) VSCPL 3.75 4 4.25 V 12
Output Voltage for BD9P155EFV-C VOUT 5 V 10
Junction to Ambient (1s board) θJA 143 °C/W 1s board (Note 4) 9
Junction to Ambient (2s2p board) θJA 26.8 °C/W 2s2p board (Note 5) 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing abs Human Body Model (HBM)(Note 1) VESD_HBM ±2 kV Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit 9
contacts copper 7. To minimize the emission noise from switching node, the distance between the SW pins to inductor should be as short as possible and not to expand the copper area more than necessary. 49

CAD (KiCad official)

  • Symbol: BD9P155EFV-CE2
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP (KiCad packages3D, STEP)
  • 3D model files: bd9p155efv-ce2-etched.step / bd9p155efv-ce2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bd9p155efv-ce2.step / bd9p155efv-ce2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (60 pp, sha256 f5977b9e0766c210, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF