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Ray bcs65s04d3: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) e4d6738 1mo ago
{
  "schema_version": 1,
  "type": "component",
  "slug": "bcs65s04d3",
  "title": "BCS65S04D3",
  "brief": "Bestirpower SiC Diodes, DFN-8(5x6). Pinout extracted from the datasheet, KiCad symbol/footprint/3D.",
  "version": "0.1.0",
  "license": "CC-BY-SA-4.0",
  "tags": [
    "component",
    "silicon carbide (sic) devices",
    "bcs65s04d3"
  ],
  "component": {
    "mpn": "BCS65S04D3",
    "manufacturer": "Bestirpower",
    "package": "DFN-8(5x6)",
    "pin_count": 9,
    "category": "Silicon Carbide (SiC) Devices",
    "subcategory": "SiC Diodes",
    "datasheet": "https://datasheet.lcsc.com/datasheet/pdf/94947407de17871697b3dfcca1a17b1e.pdf",
    "parts": {
      "symbol": "bcs65s04d3.kicad_sym",
      "footprint": "bcs65s04d3.kicad_mod",
      "model_3d": "bcs65s04d3-etched.glb",
      "model_3d_plain": "bcs65s04d3.glb",
      "model_3d_step": "bcs65s04d3-etched.step",
      "model_3d_step_plain": "bcs65s04d3.step",
      "lbr": "bcs65s04d3.lbr"
    },
    "distributor_links": {},
    "pins": [
      {
        "number": "1",
        "name": "A",
        "type": "passive",
        "description": "Anode. Connected internally to the SiC Schottky die anode. Multiple anode pads (pins 1-3) are electrically common and should be tied together on the PCB for current sharing."
      },
      {
        "number": "2",
        "name": "A",
        "type": "passive",
        "description": "Anode. Electrically common with pins 1 and 3; tie all anode pads together on the PCB."
      },
      {
        "number": "3",
        "name": "A",
        "type": "passive",
        "description": "Anode. Electrically common with pins 1 and 2; tie all anode pads together on the PCB."
      },
      {
        "number": "4",
        "name": "NC",
        "type": "unconnected",
        "description": "No internal connection. Leave floating or tie to anode potential."
      },
      {
        "number": "5",
        "name": "K",
        "type": "passive",
        "description": "Cathode. Connected to the SiC Schottky die cathode and to the exposed thermal pad on the package underside. Pins 5-8 are electrically common with the thermal pad and must all be tied together for current handling and heat dissipation."
      },
      {
        "number": "6",
        "name": "K",
        "type": "passive",
        "description": "Cathode. Electrically common with pins 5, 7, 8, and the exposed thermal pad."
      },
      {
        "number": "7",
        "name": "K",
        "type": "passive",
        "description": "Cathode. Electrically common with pins 5, 6, 8, and the exposed thermal pad."
      },
      {
        "number": "8",
        "name": "K",
        "type": "passive",
        "description": "Cathode. Electrically common with pins 5, 6, 7, and the exposed thermal pad on the package underside; used as the primary heat-conduction path to the PCB."
      },
      {
        "number": "9",
        "name": "K (Thermal Pad)",
        "type": "passive",
        "description": "Exposed thermal pad on package bottom, internally connected to the cathode. Must be soldered to the cathode copper plane for proper thermal (RθJC = 2.17 °C/W) and electrical performance."
      }
    ],
    "provenance": {
      "extractor": "ds2sf",
      "datasheet": {
        "url": "https://datasheet.lcsc.com/datasheet/pdf/94947407de17871697b3dfcca1a17b1e.pdf",
        "pages": 6,
        "sha256": "0b0acda3b1c3e052",
        "source_tier": "lcsc"
      },
      "cad": "KiCad official (CC-BY-SA 4.0)",
      "pins": {
        "total": 9,
        "described": 9,
        "cites_pages": true,
        "refuses_to_fabricate": true
      }
    },
    "viewers": {
      "symbol": "viewers/symbol.html",
      "footprint": "viewers/footprint.html"
    },
    "models_3d": [
      {
        "file": "bcs65s04d3.step",
        "role": "plain",
        "up": "Z",
        "units": "mm",
        "origin": "footprint origin = pad-pattern centre",
        "seat": "z = 0",
        "extents_mm": [
          6.0,
          4.98,
          0.92
        ],
        "zmin_mm": 0.0,
        "centre_offset_mm": 0.0,
        "footprint_binding": "identity",
        "sha256": "13e5a2a05f78c2a0952534b2fb187d0be154d366a431374e398c7e2032779f1b",
        "checked": "2026-10-07",
        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"
      },
      {
        "file": "bcs65s04d3-etched.step",
        "role": "eda",
        "up": "Z",
        "units": "mm",
        "origin": "footprint origin = pad-pattern centre",
        "seat": "z = 0",
        "extents_mm": [
          6.0,
          4.98,
          0.92
        ],
        "zmin_mm": 0.0,
        "centre_offset_mm": 0.0,
        "footprint_binding": "identity",
        "sha256": "6a6b0f3630fc221eb960270a5943f3591d27fa7f1d27797ee69fd781eeb34b84",
        "checked": "2026-10-07",
        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"
      }
    ]
  },
  "metadata": {
    "specs": {
      "Manufacturer": "Bestirpower",
      "Package": "DFN-8(5x6)",
      "Category": "Silicon Carbide (SiC) Devices",
      "Pins": "9"
    }
  },
  "variants": [
    {
      "mpn": "BCS65S04D3",
      "kind": "packaging"
    }
  ],
  "sections": [
    "hero",
    "viewers",
    "readme",
    "breadcrumbs",
    "info"
  ],
  "discovery_triggers": [
    "bcs65s04d3"
  ],
  "discovery_pitch": "BCS65S04D3 (Bestirpower) component page with datasheet-verified CAD.",
  "author": {
    "name": "Ray",
    "email": "[email protected]"
  },
  "dependencies": {},
  "hero": {
    "type": "image",
    "path": "docs/hero.png"
  },
  "files": [
    "page.json",
    "README.md",
    "bcs65s04d3.kicad_sym",
    "bcs65s04d3.kicad_mod",
    "bcs65s04d3.glb",
    "bcs65s04d3.step",
    "bcs65s04d3.lbr",
    "docs/hero.png",
    "docs/bcs65s04d3-datasheet.pdf",
    "viewers/symbol.html",
    "viewers/footprint.html"
  ],
  "visibility": {
    "public": true
  },
  "updated_at": "2026-09-24T17:39:47.693Z"
}