component
BCS65S04D3
Public Made by Adomby adom
Bestirpower SiC Diodes, DFN-8(5x6). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBCS65S04D3
Bestirpower · SiC Diodes · DFN-8(5x6)
BCS65S04D3 from Bestirpower, in a DFN-8(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode. Connected internally to the SiC Schottky die anode. Multiple anode pads (pins 1-3) are electrically common and should be tied together on the PCB for current sharing. |
| 2 | A | passive | Anode. Electrically common with pins 1 and 3; tie all anode pads together on the PCB. |
| 3 | A | passive | Anode. Electrically common with pins 1 and 2; tie all anode pads together on the PCB. |
| 4 | NC | unconnected | No internal connection. Leave floating or tie to anode potential. |
| 5 | K | passive | Cathode. Connected to the SiC Schottky die cathode and to the exposed thermal pad on the package underside. Pins 5-8 are electrically common with the thermal pad and must all be tied together for current handling and heat dissipation. |
| 6 | K | passive | Cathode. Electrically common with pins 5, 7, 8, and the exposed thermal pad. |
| 7 | K | passive | Cathode. Electrically common with pins 5, 6, 8, and the exposed thermal pad. |
| 8 | K | passive | Cathode. Electrically common with pins 5, 6, 7, and the exposed thermal pad on the package underside; used as the primary heat-conduction path to the PCB. |
| 9 | K (Thermal Pad) | passive | Exposed thermal pad on package bottom, internally connected to the cathode. Must be soldered to the cathode copper plane for proper thermal (RθJC = 2.17 °C/W) and electrical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Bestirpower |
| Package | DFN-8(5x6) |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
BCS65S04D3
CAD (KiCad official)
- Symbol:
BCS65S04D3 - Footprint:
Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm - 3D model: DFN-8(5x6) (KiCad packages3D, STEP)
- 3D model files:
bcs65s04d3-etched.step/bcs65s04d3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bcs65s04d3.step/bcs65s04d3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Bestirpower datasheet (6 pp, sha256
0b0acda3b1c3e052, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).