# BCS65S04D3

**Bestirpower** · SiC Diodes · DFN-8(5x6)

BCS65S04D3 from Bestirpower, in a DFN-8(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode. Connected internally to the SiC Schottky die anode. Multiple anode pads (pins 1-3) are electrically common and should be tied together on the PCB for current sharing. |
| 2 | A | passive | Anode. Electrically common with pins 1 and 3; tie all anode pads together on the PCB. |
| 3 | A | passive | Anode. Electrically common with pins 1 and 2; tie all anode pads together on the PCB. |
| 4 | NC | unconnected | No internal connection. Leave floating or tie to anode potential. |
| 5 | K | passive | Cathode. Connected to the SiC Schottky die cathode and to the exposed thermal pad on the package underside. Pins 5-8 are electrically common with the thermal pad and must all be tied together for current handling and heat dissipation. |
| 6 | K | passive | Cathode. Electrically common with pins 5, 7, 8, and the exposed thermal pad. |
| 7 | K | passive | Cathode. Electrically common with pins 5, 6, 8, and the exposed thermal pad. |
| 8 | K | passive | Cathode. Electrically common with pins 5, 6, 7, and the exposed thermal pad on the package underside; used as the primary heat-conduction path to the PCB. |
| 9 | K (Thermal Pad) | passive | Exposed thermal pad on package bottom, internally connected to the cathode. Must be soldered to the cathode copper plane for proper thermal (RθJC = 2.17 °C/W) and electrical performance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Bestirpower |
| Package | DFN-8(5x6) |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 9 |

## Ordering variants

Same part, different packaging or reel option.

- `BCS65S04D3`

## CAD (KiCad official)

- Symbol: `BCS65S04D3`
- Footprint: `Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm`
- 3D model: DFN-8(5x6) (KiCad packages3D, STEP)
- 3D model files: `bcs65s04d3-etched.step` / `bcs65s04d3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bcs65s04d3.step` / `bcs65s04d3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Bestirpower datasheet](docs/bcs65s04d3-datasheet.pdf) (6 pp, sha256 `0b0acda3b1c3e052`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bcs65s04d3-datasheet.pdf)