component

BAT54CWFILM

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STMicroelectronics Schottky Barrier Diodes (SBD), SOT-323-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BAT54CWFILM

STMicroelectronics · Schottky Barrier Diodes (SBD) · SOT-323-3

BAT54CWFILM from STMicroelectronics, in a SOT-323-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode (40 V VRRM, 300 mA continuous forward current), shown as a bottom pin in the BAT54CWFILM top-view drawing.
2 A2 passive Anode of the second Schottky diode (40 V VRRM, 300 mA continuous forward current), shown as a bottom pin in the BAT54CWFILM top-view drawing.
3 K passive Common cathode of both Schottky diodes, shown as the single top pin in the BAT54CWFILM (common cathode) top-view drawing.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOT-323-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current IR 1 µA Tj = 25 °C, VR = 30 V 2
Reverse leakage current IR 100 µA Tj = 100 °C, VR = 30 V 2
Forward voltage drop VF 240 mV Tj = 25 °C, IF = 0.1 mA 2
Forward voltage drop VF 320 mV Tj = 25 °C, IF = 1 mA 2
Forward voltage drop VF 400 mV Tj = 25 °C, IF = 10 mA 2
Forward voltage drop VF 500 mV Tj = 25 °C, IF = 30 mA 2
Forward voltage drop VF 900 mV Tj = 25 °C, IF = 100 mA 2
Diode capacitance C 7 10 pF VR = 1 V, F = 1 MHz 2
Reverse recovery time trr 5 ns IF = 10 mA, IR = 10 mA, Tj = 25 °C, Irr = 1 mA, RL = 100 Ω 2
Repetitive peak reverse voltage VRRM 40 V Tj = 25 °C 2
Continuous forward current IF 300 mA Tj = 25 °C 2
Surge non repetitive forward current IFSM 1.25 A tp = 10 ms Sinusoidal 2
Storage temperature range Tstg -65 150 °C 2
Operating junction temperature range Tj -40 150 °C 2
Maximum soldering temperature TL 260 °C 2
Junction to ambient thermal resistance Rth(j-a) 550 °C/W SOT-323, epoxy printed circuit board with recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper ambient versus copper surface under each lead 4

CAD (KiCad official)

  • Symbol: BAT54CWFILM
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323-3 (KiCad packages3D, STEP)
  • 3D model files: bat54cwfilm-etched.step / bat54cwfilm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54cwfilm.step / bat54cwfilm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (15 pp, sha256 47b6e3175bbe78ae, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF