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Contents

Pinout
Key specifications
Electrical characteristics
Materials and finish
CAD (KiCad official)
Provenance

README

markdown

BAT54CWFILM

STMicroelectronics · Schottky Barrier Diodes (SBD) · SOT-323-3

BAT54CWFILM from STMicroelectronics, in a SOT-323-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	A1	passive	Anode of the first Schottky diode (40 V VRRM, 300 mA continuous forward current), shown as a bottom pin in the BAT54CWFILM top-view drawing.
2	A2	passive	Anode of the second Schottky diode (40 V VRRM, 300 mA continuous forward current), shown as a bottom pin in the BAT54CWFILM top-view drawing.
3	K	passive	Common cathode of both Schottky diodes, shown as the single top pin in the BAT54CWFILM (common cathode) top-view drawing.

Key specifications

Parameter	Value
Manufacturer	STMicroelectronics
Package	SOT-323-3
Category	Diodes
Pins	3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Reverse leakage current	IR			1	µA	Tj = 25 °C, VR = 30 V	2
Reverse leakage current	IR			100	µA	Tj = 100 °C, VR = 30 V	2
Forward voltage drop	VF			240	mV	Tj = 25 °C, IF = 0.1 mA	2
Forward voltage drop	VF			320	mV	Tj = 25 °C, IF = 1 mA	2
Forward voltage drop	VF			400	mV	Tj = 25 °C, IF = 10 mA	2
Forward voltage drop	VF			500	mV	Tj = 25 °C, IF = 30 mA	2
Forward voltage drop	VF			900	mV	Tj = 25 °C, IF = 100 mA	2
Diode capacitance	C		7	10	pF	VR = 1 V, F = 1 MHz	2
Reverse recovery time	trr			5	ns	IF = 10 mA, IR = 10 mA, Tj = 25 °C, Irr = 1 mA, RL = 100 Ω	2
Repetitive peak reverse voltage	VRRM			40	V	Tj = 25 °C	2
Continuous forward current	IF			300	mA	Tj = 25 °C	2
Surge non repetitive forward current	IFSM			1.25	A	tp = 10 ms Sinusoidal	2
Storage temperature range	Tstg	-65		150	°C		2
Operating junction temperature range	Tj	-40		150	°C		2
Maximum soldering temperature	TL			260	°C		2
Junction to ambient thermal resistance	Rth(j-a)			550	°C/W	SOT-323, epoxy printed circuit board with recommended pad layout	2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		ambient versus copper surface under each lead	4

CAD (KiCad official)

Symbol: BAT54CWFILM
Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
3D model: SOT-323-3 (KiCad packages3D, STEP)
3D model files: bat54cwfilm-etched.step / bat54cwfilm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bat54cwfilm.step / bat54cwfilm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: STMicroelectronics datasheet (15 pp, sha256 47b6e3175bbe78ae, retrieved 2026-10-22, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF