component
BAS40-06 RFG
Public Made by Adomby adom
Taiwan Semiconductor(Taiwan Semicon) Schottky Barrier Diodes (SBD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BAS40-06 RFG
Taiwan Semiconductor(Taiwan Semicon) · Schottky Barrier Diodes (SBD) · SOT-23
BAS40-06 RFG from Taiwan Semiconductor(Taiwan Semicon), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of the first Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA). |
| 2 | K2 | passive | Cathode of the second Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA). |
| 3 | A | passive | Common anode of both Schottky diodes in the BAS40-06 (VRRM 40 V, IR 0.2 µA max at VR=30 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor(Taiwan Semicon) |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage per diode | VF | 0.38 | V | IF = 1mA, TJ = 25°C | 2 | ||
| Forward voltage per diode | VF | 1 | V | IF = 40mA, TJ = 25°C | 2 | ||
| Reverse current @ rated VR per diode | IR | 0.2 | μA | VR=30V TJ = 25°C | 2 | ||
| Reverse Breakdown Voltage | V(BR) | 40 | V | IR=10μA | 2 | ||
| Junction capacitance | CJ | 5 | pF | 1 MHz, VR=1V | 2 | ||
| Reverse Recovery Time | trr | 5 | ns | IF=IR=10mA, RL=100Ω, IRR=1mA | 2 | ||
| Repetitive peak reverse voltage | VRRM | 40 | V | TA = 25°C | 1 | ||
| Forward current | IF(AV) | 200 | mA | TA = 25°C | 1 | ||
| Non-repetitive peak forward surge current | IFSM | 0.6 | A | t = 8.3ms, TA = 25°C | 1 | ||
| Junction temperature range | TJ | -65 | 125 | °C | TA = 25°C | 1 | |
| Storage temperature range | TSTG | -65 | 125 | °C | TA = 25°C | 1 | |
| Junction-to-ambient thermal resistance | RӨJA | 357 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test | 1 |
CAD (KiCad official)
- Symbol:
BAS40-06 RFG - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bas40-06-rfg-etched.step/bas40-06-rfg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bas40-06-rfg.step/bas40-06-rfg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor(Taiwan Semicon) datasheet (6 pp, sha256
8b1286368a214991, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BAS40-06 RFG
**Taiwan Semiconductor(Taiwan Semicon)** · Schottky Barrier Diodes (SBD) · SOT-23
BAS40-06 RFG from Taiwan Semiconductor(Taiwan Semicon), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K1 | passive | Cathode of the first Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA). |
| 2 | K2 | passive | Cathode of the second Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA). |
| 3 | A | passive | Common anode of both Schottky diodes in the BAS40-06 (VRRM 40 V, IR 0.2 µA max at VR=30 V). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor(Taiwan Semicon) |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage per diode | VF | | | 0.38 | V | IF = 1mA, TJ = 25°C | 2 |
| Forward voltage per diode | VF | | | 1 | V | IF = 40mA, TJ = 25°C | 2 |
| Reverse current @ rated VR per diode | IR | | | 0.2 | μA | VR=30V TJ = 25°C | 2 |
| Reverse Breakdown Voltage | V(BR) | 40 | | | V | IR=10μA | 2 |
| Junction capacitance | CJ | | | 5 | pF | 1 MHz, VR=1V | 2 |
| Reverse Recovery Time | trr | | | 5 | ns | IF=IR=10mA, RL=100Ω, IRR=1mA | 2 |
| Repetitive peak reverse voltage | VRRM | | | 40 | V | TA = 25°C | 1 |
| Forward current | IF(AV) | | | 200 | mA | TA = 25°C | 1 |
| Non-repetitive peak forward surge current | IFSM | | | 0.6 | A | t = 8.3ms, TA = 25°C | 1 |
| Junction temperature range | TJ | -65 | | 125 | °C | TA = 25°C | 1 |
| Storage temperature range | TSTG | -65 | | 125 | °C | TA = 25°C | 1 |
| Junction-to-ambient thermal resistance | RӨJA | | | 357 | °C/W | | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test | 1 |
## CAD (KiCad official)
- Symbol: `BAS40-06 RFG`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bas40-06-rfg-etched.step` / `bas40-06-rfg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bas40-06-rfg.step` / `bas40-06-rfg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Taiwan Semiconductor(Taiwan Semicon) datasheet](docs/bas40-06-rfg-datasheet.pdf) (6 pp, sha256 `8b1286368a214991`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bas40-06-rfg-datasheet.pdf)