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BAS40-06 RFG

Taiwan Semiconductor(Taiwan Semicon) · Schottky Barrier Diodes (SBD) · SOT-23

BAS40-06 RFG from Taiwan Semiconductor(Taiwan Semicon), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of the first Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA).
2 K2 passive Cathode of the second Schottky diode in the BAS40-06 common-anode pair (VRRM 40 V, IF(AV) 200 mA, VF 1.00 V max at IF=40 mA).
3 A passive Common anode of both Schottky diodes in the BAS40-06 (VRRM 40 V, IR 0.2 µA max at VR=30 V).

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor(Taiwan Semicon)
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage per diode VF 0.38 V IF = 1mA, TJ = 25°C 2
Forward voltage per diode VF 1 V IF = 40mA, TJ = 25°C 2
Reverse current @ rated VR per diode IR 0.2 μA VR=30V TJ = 25°C 2
Reverse Breakdown Voltage V(BR) 40 V IR=10μA 2
Junction capacitance CJ 5 pF 1 MHz, VR=1V 2
Reverse Recovery Time trr 5 ns IF=IR=10mA, RL=100Ω, IRR=1mA 2
Repetitive peak reverse voltage VRRM 40 V TA = 25°C 1
Forward current IF(AV) 200 mA TA = 25°C 1
Non-repetitive peak forward surge current IFSM 0.6 A t = 8.3ms, TA = 25°C 1
Junction temperature range TJ -65 125 °C TA = 25°C 1
Storage temperature range TSTG -65 125 °C TA = 25°C 1
Junction-to-ambient thermal resistance RӨJA 357 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test 1

CAD (KiCad official)

  • Symbol: BAS40-06 RFG
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bas40-06-rfg-etched.step / bas40-06-rfg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas40-06-rfg.step / bas40-06-rfg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor(Taiwan Semicon) datasheet (6 pp, sha256 8b1286368a214991, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF