component
BAS321-QF
Public Made by Adomby adom
Nexperia Diodes - General Purpose, SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BAS321-QF
Nexperia · Diodes - General Purpose · SOD-323
BAS321-QF from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the diode; the marking bar on the SOD323 package indicates the cathode (Fig. 8 note 1). |
| 2 | A | passive | Anode of the diode; device limits apply, including a continuous forward current IF of max. 250 mA (Table 5). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 250 | V | 3 | |||
| Reverse voltage | VR | 200 | V | 3 | |||
| Forward current | IF | 250 | mA | [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Non-repetitive peak forward current | IFSM | 1.7 | A | tp = 10 ms; square wave; Tj(init) = 25 °C | 3 | ||
| Non-repetitive peak forward current | IFSM | 9 | A | tp = 1 µs; square wave; Tj(init) = 25 °C | 3 | ||
| Non-repetitive peak forward current | IFSM | 3 | A | tp = 100 µs; square wave; Tj(init) = 25 °C | 3 | ||
| Repetitive peak forward current | IFRM | 625 | mA | tp ≤ 0.5 ms; δ ≤ 0.25 | 3 | ||
| Total power dissipation | Ptot | 300 | mW | Tamb = 25 °C; [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Junction temperature | Tj | 150 | °C | 3 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 366 | K/W | [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 130 | K/W | [2] Soldering point of cathode tab | 3 | ||
| Forward voltage | VF | 1 | V | IF = 100 mA; Tj = 25 °C | 4 | ||
| Forward voltage | VF | 1.25 | V | IF = 200 mA; Tj = 25 °C | 4 | ||
| Reverse current | IR | 100 | nA | VR = 200 V; Tj = 25 °C | 4 | ||
| Reverse current | IR | 100 | µA | VR = 200 V; Tj = 150 °C | 4 | ||
| Diode capacitance | Cd | 2 | pF | VR = 0 V; f = 1 MHz; Tj = 25 °C | 4 | ||
| Reverse recovery time | trr | 50 | ns | IF = 30 mA; IR = 30 mA; RL = 100 Ω; IR(meas) = 3 mA; Tj = 25 °C | 4 |
CAD (KiCad official)
- Symbol:
BAS321-QF - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bas321-qf-etched.step/bas321-qf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bas321-qf.step/bas321-qf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (10 pp, sha256
743313bc9e2e4d09, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BAS321-QF
**Nexperia** · Diodes - General Purpose · SOD-323
BAS321-QF from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the diode; the marking bar on the SOD323 package indicates the cathode (Fig. 8 note 1). |
| 2 | A | passive | Anode of the diode; device limits apply, including a continuous forward current IF of max. 250 mA (Table 5). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | | | 250 | V | | 3 |
| Reverse voltage | VR | | | 200 | V | | 3 |
| Forward current | IF | | | 250 | mA | [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 |
| Non-repetitive peak forward current | IFSM | | | 1.7 | A | tp = 10 ms; square wave; Tj(init) = 25 °C | 3 |
| Non-repetitive peak forward current | IFSM | | | 9 | A | tp = 1 µs; square wave; Tj(init) = 25 °C | 3 |
| Non-repetitive peak forward current | IFSM | | | 3 | A | tp = 100 µs; square wave; Tj(init) = 25 °C | 3 |
| Repetitive peak forward current | IFRM | | | 625 | mA | tp ≤ 0.5 ms; δ ≤ 0.25 | 3 |
| Total power dissipation | Ptot | | | 300 | mW | Tamb = 25 °C; [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 |
| Junction temperature | Tj | | | 150 | °C | | 3 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 3 |
| Thermal resistance from junction to ambient | Rth(j-a) | | | 366 | K/W | [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 |
| Thermal resistance from junction to solder point | Rth(j-sp) | | | 130 | K/W | [2] Soldering point of cathode tab | 3 |
| Forward voltage | VF | | | 1 | V | IF = 100 mA; Tj = 25 °C | 4 |
| Forward voltage | VF | | | 1.25 | V | IF = 200 mA; Tj = 25 °C | 4 |
| Reverse current | IR | | | 100 | nA | VR = 200 V; Tj = 25 °C | 4 |
| Reverse current | IR | | | 100 | µA | VR = 200 V; Tj = 150 °C | 4 |
| Diode capacitance | Cd | | | 2 | pF | VR = 0 V; f = 1 MHz; Tj = 25 °C | 4 |
| Reverse recovery time | trr | | | 50 | ns | IF = 30 mA; IR = 30 mA; RL = 100 Ω; IR(meas) = 3 mA; Tj = 25 °C | 4 |
## CAD (KiCad official)
- Symbol: `BAS321-QF`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bas321-qf-etched.step` / `bas321-qf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bas321-qf.step` / `bas321-qf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590261056062066688) (10 pp, sha256 `743313bc9e2e4d09`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bas321-qf-datasheet.pdf)